LA05W-DBK-W1 LIGITEK | Alldatasheet
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B DOC. NO : QW0905-L REV. : DATE : 30 -Jun. - 2011 A05W/DBK-W1 LA05W/DBK-W1 DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Lead-Free Parts Pb 發行 DCC 立碁電子
5.0 5.9 Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 1.5MAX 25.0MIN 1.0MIN □0.5 TYP 2.54TYP 7.6 8.6 Package Dimensions LA05W/DBK-W1 LDBK3333/H0-PF PART NO. 20.0 3.0 100.0±15 1.7 10.0±5 6.5 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 10.0 4.7 1/6Page + _
Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Luminous intensity @ mA(mcd) 1500 Min. Typical Electrical & Optical Characteristics (Ta=25 ℃) Emitted BlueLA05W/DBK-W1 InGaN/GaN PART NO MATERIAL Forward voltage @20mA(V)COLOR Dominant wave length λDnm Spectral halfwidth △λnm
470 Water Clear
304.0 3.5 Max.Typ. Operating Temperature Electrostatic Discharge( * ) Storage Temperature Tstg ESD Topr -30 ~ +100 -20 ~ +80 150 Viewing angle 2θ 1/2 (deg) 2700 26 Typ. V LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Forward Current Power Dissipation Reverse Current @5V Peak Forward Current Duty 1/10@10KHz Parameter 30IF PD Ir IFP 120 100 Symbol DBK Ratings Absolute Maximum Ratings at Ta=25 ℃ mA mW μA mA UNIT 2/6Page Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LA05W/DBK-W1PART NO.
Luminous Intensity(mcd) at 20 mA Min. Max. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LA05W/DBK-W1 Brightness Code For Standard LED Lamps DBK CHIP 3/6Page A2740005000
Fig.5 Relative Intensity vs. Wavelength Typical Electro-Optical Characteristics Curve LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.03.04.0 0 1 1.0 Relative Intensity@20mA Wavelength (nm) 450 0.0 400500550 0.5 0.5 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Ambient Temperature(℃)Ambient Temperature(℃) 0-20-40 0.8 0-40-2010080604020 0.0 601008040 Fig.4 Relative Intensity vs. Temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 Fig.3 Forward Voltage vs. Temperature 1.2 3.0 Relative Intensity Normalize @20mA Forward Current(mA) Forward Current(mA)Forward Voltage(V) 2.05.0110 0.0 0.5 1.0 1.5 2.0 1001000 Fig.2 Relative Intensity vs. Forward CurrentFig.1 Forward current vs. Forward Voltage 2.5 3.0 100 1000 DBK CHIP Page4/6LA05W/DBK-W1PART NO.
Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 120° 25° Time(sec) 50 100Preheat0
60 Seconds Max
2°/sec max 150 260° Temp(°C) 5°/sec max 260°C3sec Max Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/6LA05W/DBK-W1PART NO. Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Thermal Shock Test High Temperature High Humidity Test Low Temperature Storage Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Reliability Test: High Temperature Storage Test Operating Life Test Test Item This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Test Condition Description MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. Page 6/6LA05W/DBK-W1