L9UG11243-PF LIGITEK | Alldatasheet
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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only REV. : A 29 -Mar.-2016DATE : DOC. NO : QW0905-L9UG11243-PF Lead-Free Parts Pb 發行 DCC 立碁電子
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Package Dimensions L9UG11243-PFPART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/6 25.0MIN 2.54TYP + - 1.0MIN 1.8 3.3 1.5MAX 0.5 TYP 1.6 3.0 2.4 R1.7 25%75%100%50% -60° -30° 75%25%050%100% 30° 60°
℃Tstg -40 ~ +100 Storage Temperature L9UG11243-PF Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO Spectral halfwidth △λnm Dominant wave length λDnm COLOR Emitted AlGaInP MATERIAL Lens Viewing angle 2θ 1/2 (deg) Forward voltage @20mA(V) Luminous intensity @20mA(mcd) Max.Min.Min. 1.7 2.6 65160 20 Electrostatic Discharge Operating Temperature Forward Current Reverse Current @5V Peak Forward Current Duty 1/10@10KHz Power Dissipation Absolute Maximum Ratings at Ta=25 ℃ IFP 60 mA -40 ~ +85Topr Ir PD ESD μA V mW75 2000 Ratings Parameter Symbol IF UNIT mA30 9UG PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only L9UG11243-PF Page 2/6 Typ. Green 574 Water Clear
Typical Electro-Optical Characteristics Curve LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 9UG CHIP Page 3/6 PART NO. L9UG11243-PF Relative Intensity Normalize @20mA Forward Current(mA) 3.0 2.5 2.0 1.5 1.0 0.5 Fig.4 Relative Intensity vs. Temperature Wavelength (nm) Relative Intensity @20mA 500 0.5 1.0 550 600650 2.0 Forward Voltage(V) Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normaliz @25℃ -20-40 0.9 0.8 1.0 1.2 1.1 1.0 0.1 Relative Intensity @20mA Normalize @25℃ 806040020100 3.04.05.0 Ambient Temperature(℃) 020-40-2060100 8040 Forward Current(mA) 1.0101001000 3.0 2.5 2.0 1.5 1.0 0.5 Fig.2 Relative Intensity vs. Forward CurrentFig.1 Forward current vs. Forward Voltage 1.0 100 1000
Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to body) 260°C5sec Max Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
60 Seconds Max
2°/sec max25° 120° Temp(°C) 260° 5°/sec max Time(sec) 150 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L9UG11243-PF Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 260 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Page 4/6
1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not.Solderability Test Solder Resistance Test Thermal Shock Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. (10min) (10min) 2.total 10 cycles MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 High Temperature High Humidity Test Low Temperature Storage Test High Temperature Storage Test The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Reliability Test: Operating Life Test Test Item This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Test Condition Description MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only L9UG11243-PFPART NO. Page 5/6
W H W H C/NO: MADE IN CHINA ITEM NO. Q'TY: PCS N,W,: kgs G,W,: kgs L 3. 12 INNER BOXES / CARTON SIZE : L X W X H 58cm X 34cm X 34cm 2. 8 BAG / INNER BOX SIZE : L X W X H 33cm X 19cm X 8cm L 1. 1000PCS / BAG PACKING SPECIFICATION 6/6Page