L8Y8G65562-S7-PF

L8Y8G65562-S7-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905-L8Y8G65562/S7-PF REV. : A DATE : 05 - Dec. - 2006 DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only L8Y8G65562/S7-PF Lead-Free Parts Pb BIPOLAR TYPE LED LAMPS

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 60°-60° -30° 30° 1 2 Y PART NO. Package Dimensions G LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only L8Y8G65562/S7-PF Page 1 2 3.2+0.05 -0.1 -0.1 1.0MIN □0.5 TYP 42.0±0.5 2.54TYP 4.0±0.2 2.0+0.05 1.0MAX 0.7MAX

Tstg Storage Temperature -40 ~ +100 Forward voltage @10mA(V) 1.7 1.7 Min. Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Typical Electrical & Optical Characteristics (Ta=25 ℃) Spectral halfwidth △λnm Peak wave length λPnm MATERIALPART NO Yellow Green Emitted L8Y8G65562/S7-PF GaP GaAsP/GaP White Diffused Lens 56530 58535 COLOR Viewing angle 2θ 1/2 (deg) Luminous intensity @10mA(mcd) 8.0 8.0 Typ. 2.14.5 2.1 Typ. 4.5 Min. 176 176 -40 ~ +85 Ratings LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Absolute Maximum Ratings at Ta=25 ℃ Forward Current Operating Temperature Reverse Current @5V Power Dissipation Peak Forward Current Duty 1/10@10KHz Parameter 15IF Topr Ir PD IFP Symbol Page 2/6 mA15 μA mA mW UNIT L8Y8G65562/S7-PFPART NO.

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 Y CHIP 3/6PageL8Y8G65562/S7-PFPART NO.

1.0 Relative Intensity@20mA 500 0.0 0.5 Wavelength (nm) 650550 600 -40 Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature Forward Voltage@20mA Normalize @25℃ 0.8 1.0 0.9 1.1 1.2 0.5 Relative Intensity@20mA Normalize @25℃ -4060 Ambient Temperature(℃) 40200-20100 80 0.0 Ambient Temperature(℃) 02040-20 60100 80 Fig.4 Relative Intensity vs. Temperature 2.5 1.5 1.0 2.0 3.0 1.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve 100 Forward Current(mA) 0.1 1.0 1000 G CHIP Relative Intensity Normalize @20mA 1.0 0.5 4.0 Forward Voltage(V) 2.03.05.0 0.0 1.5 1.0 2.0 100 Forward Current(mA) 101000 Fig.2 Relative Intensity vs. Forward Current 2.5 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 3.5 Page 4/6L8Y8G65562/S7-PFPART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 5°/sec max 260°C3sec Max Temp(°C) 260° 150100 Time(sec) 2°/sec max25° 00° Preheat Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 120° Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body)

60 Seconds Max

L8Y8G65562/S7-PFPART NO.

MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Test Item Operating Life Test Test Condition Reliability Test: High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.

Description

MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202:103B JIS C 7021: B-11 High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. Page 6/6L8Y8G65562/S7-PFPART NO.