L8Y17130-PF LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : DATA SHEET L8Y17130-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only - 200701 - Aug. L8Y17130-PF A Lead-Free Parts Pb TWO STEP RECTANGLE TYPE LED LAMPS

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only L8Y17130-PFPART NO. 1/5Page 10.0 25.0MIN □0.5 TYP. 1.0MIN 2.54TYP. 6.0 1.5MAX 4.8 2.8 1.0 2.5

GaAsP/GaP YellowL8Y17130-PF 110124.52.11.735585 Yellow Diffused IFP PD IF Tstg Topr Symbol Power Dissipation Reverse Current @5V Storage Temperature Operating Temperature Parameter Peak Forward Current Duty 1/10@10KHz Forward Current -40 ~ +100 -40 ~ +85 Ir10 Ratings Yellow mW μA mA mA UNIT COLOR MATERIALPART NO Emitted Typ. Luminous intensity @10mA(mcd) Spectral halfwidth △λnm Peak wave length λPnm Lens Typ. Forward voltage @ mA(V) Min.Min. Viewing angle 2θ 1/2 (deg) Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Absolute Maximum Ratings at Ta=25 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PagePART NO.L8Y17130-PF

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 500550600650 0.0 0.5 1.0 700 8Y CHIP Page3/5 PART NO.L8Y17130-PF

2.Wave Soldering Profile 5°/sec max Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Preheat0 50 25° 120° 2°/sec max 100 Time(sec) 150 Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 260°C3sec Max 260° Temp(°C) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) Page 4/5

60 Seconds Max

PART NO.L8Y17130-PF

The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. Solder Resistance Test Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Low Temperature Storage Test High Temperature High Humidity Test Thermal Shock Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs (10min) (10min) 2.total 10 cycles 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Test Item High Temperature Storage Test Operating Life Test 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)

Description

Reliability Test: MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard Page 5/5PART NO.L8Y17130-PF