L8UGDBK3392-R18

L8UGDBK3392-R18 LIGITEK | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 7

Technical content

DOC. NO : QW0905-L8UGDBK3392/R18 REV. : A DATE : 19 - Oct. - 2012 DATA SHEET DURL COLOR LED LAMPS L8UGDBK3392/R18 Lead-Free Parts Pb LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 發行 DCC 立碁電子

1.CATHODE BLUE 2.COMMON ANODE 3.CATHODE GREEN 18.0MIN 2.54TYP 2.0MIN Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 2.54TYP 2.0MIN 1 2 3 □0.5 TYP 1.5 MAX PART NO. L8UGDBK3392/R18 Package Dimensions Page 1/6 7.6 8.6 10.5±0.5 31 2 DBK 8UG 5.0 5.9 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 100% 50%75% 025% -60° -30° 50%25%75%100% 60° 30°

℃Tstg -40 ~ +100 Storage Temperature L8UGDBK3392/R18 White Diffused Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. AlGaInP Green 57420 4.03.5 156.5 Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO Spectral halfwidth △λnm Dominant wave length λDnm COLOR Emitted InGaN Blue MATERIAL Lens 47030 Viewing angle 2θ 1/2 (deg) Forward voltage @20mA(V) Luminous intensity @20mA(mcd) Max.Min. Typ.Min. 1.72.6 350900 Electrostatic Discharge( * ) Operating Temperature Forward Current Reverse Current @5V Peak Forward Current Duty 1/10@10KHz Power Dissipation Absolute Maximum Ratings at Ta=25 ℃ IFP 75100 mA -40 ~ +85Topr Ir PD65 ESD μA V mW120 2000 Ratings Parameter Symbol IF 25 Green UNIT mA30 Blue LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page2/6 PART NO. L8UGDBK3392/R18 500 -20 ~ +80 -30 ~ +100 Typ.

Fig.3 Forward Voltage vs. Temperature Ambient Temperature(℃) Forward Voltage@20mA Normaliz @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity @20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.5 2.03.04.05.0 0.8 40-20-4080100 60 0.5 1.0 1.5 2.0 0.9 1.2 1.0 1.1 1.0 1.5 2.0 2.5 2.5 3.0 20020-400 -2080 4060100 3.0 8UG CHIP Wavelength (nm) Relative Intensity @20mA Fig.5 Relative Intensity vs. Wavelength Page 4/6 PART NO. L8UGDBK3392/R18 500 600550 650 1.0 0.5

1.0 Forward Voltage@20mA Normalize @25℃ Relative Intensity@20mA Normalize@25℃ Ambient Temperature(℃)Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength -40 0.8 0.9 -20-02040 0.5 10080600 -20-402040100 6080 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current 100 Forward Current(mA) Fig.4 Relative Intensity vs. Temperature 3.0 Forward Current(mA) Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.0 1.1 1.2 1.0 1.0 0.1 100 1.52.0 3.0 2.0 1.5 2.5 2.5 2.0 1.5 1.0 0.5 Relative Intensity Normalize @20mA 2.53.010 1.0 Typical Electro-Optical Characteristics Curve Fig.1 Forward current vs. Forward Voltage DBK CHIP 1000 3.5 1000 Wavelength (nm) Relative Intensity@20mA Page 3/6 PART NO. L8UGDBK3392/R18 0.5 550500400 0.0 450 1.0

Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260±5°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body)

60 Seconds Max

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

0 Preheat 50 100

Time(sec) 150 Temp(°C) 5°/sec max 25° 2°/sec max 120° 260° 260±5°C 3sec Max 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/6 PART NO. L8UGDBK3392/R18

1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1sec Solder Resistance Test Solderability Test Thermal Shock Test MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. This test intended to see soldering well performed or not. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Test Condition 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Reliability Test: Low Temperature Storage Test High Temperature High Humidity Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature Storage Test Test Item Operating Life Test The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reference StandardDescription This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/6 PART NO. L8UGDBK3392/R18