L8SE31040-P1-PF-TBS-X

L8SE31040-P1-PF-TBS-X LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : - 201511-May. L8SE31040/P1-PF/TBS-X A DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ROUND TYPE LED LAMPS L8SE31040/P1-PF/TBS-X Pb Lead-Free Parts 發行 DCC 立碁電子

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Package Dimensions Page 1/7 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.L8SE31040/P1-PF/TBS-X 3.62 2.92 3.86 2.95 2.54TYP 25.0MIN 5.3 1.5MIN 0.5 1.0MIN + - 10.8±0.5 T D L W1 W3 P F - + L8SE31040/P1/A-PF 1.3±0.1

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only mA UNIT mW μA mA IF Parameter Symbol Absolute Maximum Ratings at Ta=25 ℃ Forward Current Ir PD Topr Power Dissipation Reverse Current @5V Operating Temperature Peak Forward Current Duty 1/10@10KHz IFP -40 ~ +85 8SE Ratings Typ.Min.Min.Max. Luminous intensity @10mA(mcd) Forward voltage @10mA(V) Viewing angle 2θ 1/2 (deg)D wave length λ nm Lens MATERIAL Emitted Orange COLOR Dominant PART NO Typical Electrical & Optical Characteristics (Ta=25 ℃) Spectral halfwidth △λnm Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. L8SE31040/P1-PF/TBS-X 610351.72.150 123 Storage Temperature Tstg -40 ~ +100 ℃ PART NO.L8SE31040/P1-PF/TBS-X Orange DiffusedGaAsP/GaP

4.53A7 4.5 A9812 Brightness Code For Standard LED Lamps Luminous Intensity(mcd) at 10 mA Group A11 A8 8 Min. 8SE CHIP L8SE31040/P1-PF/TBS-XPART NO. Max. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 3/7Page 20 30 12 20A10

TBS-100.76 0.85 0.75 0.87 18.0 20.5 19.00.71 21.50.81 21.0 18.4 22.00.83 19.40.72 TBS-9 TBS-8 TBS-7 TBS-6 TBS-5 TBS-3 TBS-2 TBS-1 0.82 0.98 1.0 0.79 19.0 24.5 20.00.75 25.50.96 24.0 19.9 25.00.94 20.90.78 0.89 0.93 1.04 0.73 22.5 25.5 23.50.89 26.51.0 21.5 17.5 22.50.85 18.50.69 Page 4/7 PART NO. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only inch 0.17 0.12 0.08 SYMBOLMinimumSYMBOL ITEMS mminch 4.20.153.8D mm 3.00.09 2.3F OPTION CODE Dimension Symbol Information• Component Lead Pitch Front-To-Rear Deflection Tape Feed Hole Diameter Feed Hole To Bottom Of Component Maximum SPECIFICATIONS 0.43 1.42 0.23 0.06 0.3 0.61 0.75 0.16 0.38 0.51 11W0L Lead Length After Component Height 5.80.174.4P1 7.70.25.1P2 15.50.57W114.5 190.69W317.5 4.000W2 Tape Width Adhesive Tape Position Adhesive Tape Width Overall Taped Package Thickness Center Of Component Location Lead Location Package Dimensions• minimumSymbol Specification maxmum inch 13.4 10.8 inchmm 33013.0L 26510.4W mm 275

340 Overall Length

Description

Dimensions Symbol Information• 2500PCSQuantity/Box 2.4601.9750H Overall Thickness REMARK:TBS=Tape And Box Straight Leads L8SE31040/P1-PF/TBS-X

Typical Electro-Optical Characteristics Curve Page 5/7 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.L8SE31040/P1-PF/TBS-X 3.0 2.5 1.5 1.0 0.5 0.0 2.0 60100 8002040-40-20 0.9 0.8 10080 5.04.03.02.0 1.0 1.2 1.1 1.0 6040200-20-40 3.0 2.5 2.0 1.5 1.0 0.5 0.0 1000100101.0 1000 100 1.0 0.1 1.0 Relative Intensity Normalize @20mA Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) Forward Current(mA) Fig.1 Forward current vs. Forward Voltage Forward Voltage(V) Relative Intensity@20mA Normalize @25℃ Ambient Temperature(℃) Fig.4 Relative Intensity vs. Temperature Forward Voltage@20mA Normalize @25℃ Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Fig.3 Forward Voltage vs. Temperature 750700650 0.5 0.0 600550 Wavelength (nm) Relative Intensity@20mA Fig.6 Directivity Radiation 100%75%50% -60° -30° 0 25%50%75%100%25% 30° 60°

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 150 260°C3sec Max 260° 100 120° 500° 25°

60 Seconds Max

2°/sec max 5°/sec max Time(sec) Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Temp(°C) PART NO.L8SE31040/P1-PF/TBS-X

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference StandardDescription Page 7/7 The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Test ConditionTest Item Reliability Test: Operating Life Test High Temperature Storage Test Low Temperature Storage Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test Thermal Shock Test 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) (10min) (10min) 2.total 10 cycles PART NO.L8SE31040/P1-PF/TBS-X