L8I2041-PF LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DATA SHEET L8I2041-PF L8I2041-PF - 2007 A DOC. NO : QW0905- REV. : DATE : 10 - Dec. Pb Lead-Free Parts

1.5MAX 4.03.0 5.24.2 1.0MIN 2.54TYP 25.0MIN 0.5 TYP 30°-30° -60° 60° 1/5Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only L8I2041-PF Package Dimensions PART NO. Directivity Radiation Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UNIT mA mW μA mA Red Symbol Absolute Maximum Ratings Parameter Absolute Maximum Ratings at Ta=25 ℃ IFP PD 10Ir Power Dissipation Peak Forward Current Duty 1/10@10KHz Reverse Current @5V Forward Current IF 15 Page 2/5 ℃-40 ~ +100Tstg Storage Temperature Typical Electrical & Optical Characteristics (Ta=25 ℃) Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Operating Temperature -40 ~ +85Topr ℃ L8I2041-PFPART NO. Luminous intensity @10mA(mcd) Viewing angle 2θ 1/2 (deg) 308.020 Typ.Min. Spectral halfwidth △λnm Peak wave length λPnm 2.11.745635 LensMin. PART NOMATERIAL OrangeGaAsP/GaPL8I2041-PF Emitted Red Transparent COLOR Forward voltage @10mA(V) Typ.

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.0 0.1 1.0 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20-40 4020080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 700750 E - I CHIP Page3/5L8I2041-PFPART NO.

PART NO. L8I2041-PF

60 Seconds Max

Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 5°/sec max Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 0° 0 25° 120° Preheat 50 100 2°/sec max Temp(°C) 260° 260°C3sec Max Time(sec) 150 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Page 4/5

PART NO. L8I2041-PF This test intended to see soldering well performed or not. The purpose of this test is the resistance of the device under tropical for hours. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec High Temperature High Humidity Test Thermal Shock Test Solder Resistance Test The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. (10min) (10min) 2.total 10 cycles 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 Page 5/5 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test Low Temperature Storage Test The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Reliability Test: Test ItemTest Condition Description MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only