L8HRF3330

L8HRF3330 LIGITEK | Alldatasheet

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DOC. NO : QW0905- REV. : DATE : DATA SHEET SUPER BRIGHT ROUND TYPE LED LAMPS L8HRF3330/T-PF 26 - Jun. A - 2007 L8HRF3330/T-PF Lead-Free Parts Pb LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only

25.0MIN □0.5 TYP Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 1.0MIN 2.54TYP + - 1.5MAX Package Dimensions PART NO.L8HRF3330/T-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 5.9 7.6 8.6 5.0 Page

Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UNIT mA mW μA mA Page Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Typical Electrical & Optical Characteristics (Ta=25 ℃) L8HRF3330/T-PF PART NO 630 Dominant wave length λDnm AlGaInP RedRed Diffused Emitted MATERIAL Lens COLOR 1.52038 2.265 Min. Forward voltage @ mA(V) Spectral halfwidth △λnm Luminous intensity @2mA(mcd) Min.Max. Typ. Peak Forward Current Duty 1/10@10KHz Electrostatic Discharge( * ) Reverse Current @5V Power Dissipation Forward Current Storage Temperature Operating Temperature Tstg Topr -40 ~ +100 -40 ~ +85 PD Ir ESD IFP IF 2000 Parameter Absolute Maximum Ratings at Ta=25 ℃ Symbol Red Ratings Viewing angle 2θ 1/2 (deg) V 2/5L8HRF3330/T-PFPART NO.

Fig.3 Forward Voltage vs. Temperature Ambient Temperature(℃) Forward Voltage@20mA Normalize @25℃ -20 0.8 40020 1.1 1.0 0.9 1.2 Ambient Temperature(℃) Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ 0.5 8060 0.0 0-20 406020 1.5 1.0 2.0 2.5 Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve Forward Current(mA) 2.01.0 3.0 8HRF CHIP Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA 1.0 0.0 1.0 2.0 Forward Current(mA) 101001000 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/5 Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA Wavelength (nm) 600550 0.0 0.5 650 1.0 700 0.501.52.5 L8HRF3330/T-PFPART NO.

Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.

60 Seconds Max

0°0 50 100Preheat 2°/sec max25° 120° 150 Time(sec) Temp(°C) 260° 5°/sec max 260°C3sec Max LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Page 4/5L8HRF3330/T-PFPART NO.

1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solderability Test This test intended to see soldering well performed or not. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec High Temperature High Humidity Test Thermal Shock Test The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. (10min) (10min) 2.total 10 cycles The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DescriptionTest ConditionTest Item High Temperature Storage Test Operating Life Test The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Reliability Test: Reference Standard Page 5/5L8HRF3330/T-PFPART NO.