L8G17130-PF LIGITEK | Alldatasheet
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TWO STEP RECTANGLE TYPE LED LAMPS Pb Lead-Free Parts A L8G17130-PF 01 - Aug.- 2007 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only L8G17130-PF DATA SHEET DOC. NO : QW0905- REV. : DATE :
2.5 1.0 2.8 4.8 1.5MAX 6.0 2.54TYP. 1.0MIN □0.5 TYP. 25.0MIN 10.0 Page1/5PART NO.L8G17130-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Package Dimensions Directivity Radiation Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UNIT mA mW μA mA Symbol Absolute Maximum Ratings Parameter Absolute Maximum Ratings at Ta=25 ℃ IFP PD 10Ir Power Dissipation Peak Forward Current Duty 1/10@10KHz Reverse Current @5V Forward Current IF 15 Page 2/5 ℃-40 ~ +100Tstg Storage Temperature Forward voltage @10mA(V)COLOR Typical Electrical & Optical Characteristics (Ta=25 ℃) Luminous intensity @10mA(mcd) 12110 Typ. Min.Min. 4.52.1301.7 EmittedLens Green Green Diffused GaP Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Typ. Peak wave length λPnm Spectral halfwidth △λnm Viewing angle 2θ 1/2 (deg) PART NOMATERIAL Operating Temperature -40 ~ +85Topr ℃ L8G17130-PF L8G17130-PFPART NO.
Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Page Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 500550600650 0.0 0.5 1.0 8G CHIP L8G17130-PFPART NO.
60 Seconds Max
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Temp(°C) 260° 260°C3sec Max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 150 Time(sec) 100 2°/sec max 120° 25°
500 Preheat
Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 5°/sec max 2.Wave Soldering Profile L8G17130-PFPART NO.
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 MIL-STD-883:1008 JIS C 7021: B-10 Reliability Test:
Description
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Test Condition 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Operating Life Test High Temperature Storage Test Test Item This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) (10min) (10min) 2.total 10 cycles 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs Thermal Shock Test High Temperature High Humidity Test Low Temperature Storage Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test Solder Resistance Test The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. L8G17130-PFPART NO.