L8E5730

L8E5730 LIGITEK | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 6

Technical content

DOC. NO : QW0905-L8E5730 REV. : A DATE : 19 - Jul. - 2007 DATA SHEET L8E5730 RECTANGLE TYPE LED LAMPS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts

Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation + - PART NO. L8E5730 Package Dimensions LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/5 1.0MIN 25.0MIN 2.54TYP 7.8 □0.5 TYP 1.5MAX 2.5 7.1 2.4

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UNIT mA mW μA mA Orange Symbol Absolute Maximum Ratings Parameter Absolute Maximum Ratings at Ta=25 ℃ IFP PD 10Ir Power Dissipation Peak Forward Current Duty 1/10@10KHz Reverse Current @5V Forward Current IF 15 Page 2/5 ℃-40 ~ +100Tstg Storage Temperature Forward voltage @10mA(V)COLOR Typical Electrical & Optical Characteristics (Ta=25 ℃) Luminous intensity @10mA(mcd) 8.0144 Typ. Min.Min. 4.52.1451.7 EmittedLens Orange Orange Diffused GaAsP/GaP L8E5730 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Typ. Peak wave length λPnm Spectral halfwidth △λnm Viewing angle 2θ 1/2 (deg) PART NOMATERIAL Operating Temperature -40 ~ +85Topr ℃ PART NO. L8E5730

Fig.3 Forward Voltage vs. Temperature Fig.5 Relative Intensity vs. Wavelength Ambient Temperature(℃) Relative Intensity@20mA Wavelength (nm) Forward Voltage@20mA Normalize @25℃ Fig.4 Relative Intensity vs. Temperature Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ Typical Electro-Optical Characteristics Curve Forward Voltage(V) Fig.1 Forward current vs. Forward Voltage Forward Current(mA) Forward Current(mA) Fig.2 Relative Intensity vs. Forward Current Relative Intensity Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 550 600 0.0 0.5 1.0 650 700750 8E CHIP Page3/5 PART NO. L8E5730

2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 150 Time(sec) 260°C3sec Max 260° Temp(°C) 2°/sec max 10050Preheat 120° 25° 00° Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 5°/sec max Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body)

60 Seconds Max

PART NO. L8E5730

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Reference Standard MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 DescriptionTest ConditionTest Item Reliability Test: 1.Ta=105℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Low Temperature Storage Test High Temperature Storage Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Page 5/5 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. Solder Resistance Test Thermal Shock Test High Temperature High Humidity Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this test is the resistance of the device under tropical for hours. This test intended to see soldering well performed or not. PART NO. L8E5730