L2SBKS2363 LIGITEK | Alldatasheet
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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts BIPOLAR TYPE LED LAMPS DATA SHEET DOC. NO : QW0905-L2SBKS2363 REV. : A DATE : 06 - May. - 2006 L2SBKS2363
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 3.0 SBKS SBKS 5.0 Page 1/5 Package Dimensions PART NO. L2SBKS2363 □0.5 TYP 1.5MAX 1.0MIN Directivity Radiation Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 2.54TYP 25.0MIN 75%100% -60° -30° 60° 30°
@20mA(mcd) Typ. Spectral halfwidth △λnm 475 Dominant wave length λDnm 4.2 Max. Forward voltage @ mA(V) 3.5 Typ. Min. Viewing angle 2θ 1/2 (deg) 2/5Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UNIT mA mA μA mW 100 SBKS Ratings 50Ir -20 ~ +80 -30 ~ +100 120 Forward Current Peak Forward Current Duty 1/10@10KHz Parameter Operating Temperature Storage Temperature Reverse Current @5V Power Dissipation Typical Electrical & Optical Characteristics (Ta=25 ℃) Symbol Topr Tstg IF PD IFP Absolute Maximum Ratings at Ta=25 ℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 12065 Electrostatic Discharge( * ) ESD500 V Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. L2SBKS2363PART NO. Water Clear InGaN/SiCBlue475263.54.26512034
Ambient Temperature(℃) Fig.3 Forward Current vs. Temperature Forward Current@20mA 680 630 530 430 480 480 380 580 Relative Intensity@20mA 1005075 Wavelength (nm) Fig.4 Relative Intensity vs. Wavelength 0.5 1.0 Fig.1 Forward current vs. Forward Voltage Typical Electro-Optical Characteristics Curve Forward Current(mA) SBK-S CHIP 1.0 Relative Intensity Normalize @20mA Forward Current(mA) 543 05 Forward Voltage(V) 0.25 0.75 0.5 3025151020 Fig.2 Relative Intensity vs. Forward Current 1.5 1.25 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page3/5L2SBKS2363PART NO.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile 5°/sec max 260°C3sec Max 260° Temp(°C) 15010050 25° 00° 2°/sec max Preheat
60 Seconds Max Time(sec)
120° Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) L2SBKS2363PART NO.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference StandardDescription The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Operating Life Test Test Item Test Condition 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature Storage Test Reliability Test: The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to see soldering well performed or not. (10min) (10min) 2.total 10 cycles Thermal Shock Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test L2SBKS2363PART NO.