L2DBK2363 LIGITEK | Alldatasheet
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DOC. NO : QW0905-L2DBK2363 REV. : A DATE : 06 - May. - 2006 DATA SHEET BIPOLAR TYPE LED LAMPS Lead-Free Parts Pb LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
25.0MIN 2.54TYP Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 1.0MIN 1 2 1.5MAX □0.5 TYP L2DBK2363PART NO. Package Dimensions 1/5Page 5.0 DBK DBK 3.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 30° 60° -30° -60° 100% 75%
@20mA(mcd) Typ. Spectral halfwidth △λnm 470 Dominant wave length λDnm 4.0 Max. Forward voltage @ mA(V) 3.5 Typ. 160 Min. Viewing angle 2θ 1/2 (deg) 2/5Page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only UNIT mA mA μA V mW 100 DBK Ratings 150 Ir -20 ~ +80 -30 ~ +100 120 Forward Current Peak Forward Current Duty 1/10@10KHz Parameter Operating Temperature Storage Temperature Electrostatic Discharge( * ) Reverse Current @5V Power Dissipation Typical Electrical & Optical Characteristics (Ta=25 ℃) Symbol ESD Topr Tstg IF PD IFP Absolute Maximum Ratings at Ta=25 ℃ Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. PART NO. L2DBK2363 InGaN/GaN Blue47030 3.5 4.016030050
Fig.5 Relative Intensity vs. Wavelength Typical Electro-Optical Characteristics Curve LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 1.03.04.0 0 1 1.0 Relative Intensity@20mA Wavelength (nm) 450 0.0 400500550 0.5 0.5 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Ambient Temperature(℃)Ambient Temperature(℃) 0-20-40 0.8 0-40-2010080604020 0.0 601008040 Fig.4 Relative Intensity vs. Temperature 2.5 1.0 0.9 1.1 1.5 1.0 2.0 Fig.3 Forward Voltage vs. Temperature 1.2 3.0 Relative Intensity Normalize @20mA Forward Current(mA) Forward Current(mA)Forward Voltage(V) 2.05.0110 0.0 0.5 1.0 1.5 2.0 1001000 Fig.2 Relative Intensity vs. Forward CurrentFig.1 Forward current vs. Forward Voltage 2.5 3.0 100 1000 DBK CHIP Page3/5 PART NO. L2DBK2363
Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) 120° Time(sec)
60 Seconds Max
2°/sec max 0° 0 25° 50 100 150 Temp(°C) 260° 260°C3sec Max 5°/sec max 2.Wave Soldering Profile Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/5PART NO. L2DBK2363
Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Thermal Shock Test (10min) (10min) 2.total 10 cycles This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. Reliability Test: Low Temperature Storage Test 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature High Humidity Test 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test ConditionTest Item Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. MIL-STD-202:103B JIS C 7021: B-11 The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-883:1008 JIS C 7021: B-10 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. Description Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/5PART NO. L2DBK2363