L24HIR83233-30 LIGITEK | Alldatasheet

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A 01-Dec. DATA SHEET L24HIR83233-30/A-PF INFRARED EMITTING DIODES LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts DOC. NO : QW0905- REV. : DATE : - 2014 發行 DCC 立碁電子

T-1 3/4 package individually PART NO. infrared emitting diodes encapsulated in water clear plastic The L24HIR83233-30/A-PFseries are high power solution grown efficiency Descriptions: 3. Low average degradation. 2. Suitable for pulsed applications. 1. High radiant intensity. Features: Device Selection Guide: Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. MATERIAL GaAIAs PART NO L24HIR83233-30/A-PF LENS COLOR Water Clear Package Dimensions L24HIR83233-30/A-PF LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page1/9 Gallium Arsenide 1.5MAX 11.0 1.0MIN 2.54TYP □0.5 TYP 25.0MIN 8.07.9

Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The radiant intensity data did not including ±15% testing tolerance. Absolute Maximum Ratings at Ta=25 ℃ LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Electrical Optical Characteristics (Aa=25) ℃ PD Power Dissipation 3520Le Radiant Intensity Viewing Angle Reverse Current Forward Voltage Spectral Line Half Width Peak Emission Wavelength Aperture Radiant Incidence 2θ1/2 IR VF 1.2 2.857Ee λpeak 850 Electrostatic Discharge Reverse Voltage Storage Temperature Operating Temperature SYMBOLPARAMETER Min. Typ. Tstg Topr ESD Vr Forward Current Peak Forward Current (300PPS,10μs Pulse) Parameter IFP IF Symbol 100 mW mW/srIF=20mA 100 μA deg VR=5V 1.6 V nm mW/cm nm IF=20mA IF=20mA IF=20mA IF=20mA TEST CONDITIONMax. UNIT -40 ~ +85 -40 ~ +85 2000 V V 100 Ratings HIR A mA UNIT Page2/9L24HIR83233-30/A-PF PART NO.

LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Group Radiant Intensity(mW/sr)at 20 mA Max.Min. Brightness Code For Standard LED Lamps Bin Code 3/9PageL24HIR83233-30/A-PF PART NO. A15 42 50 A16 50 60 HIR CHIP

Fig.3 Relative Radiant Power vs. Forward DC Current Fig.5 Forward DC Voltage vs. Temperature IFDC[mA] Forward DC Voltage Normalize @20mA, 25 ℃ Ambient Temperature[℃] Relative Radiant Power Normalize @20mA Fig.4 Relative Radiant Power IFPK[mA] Relative Radiant Power Normalize @100 mA Typical Electro-Optical Characteristics Curve Forward Voltage[V] Fig.1 Forward Current vs. Rorward Voltage Forward Current[mA] Wavelength[nm] Fig.2 Relative Radiant Power vs. Wavelength Relative Radiant Power Normalize @20mA LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only HIR CHIP 0.1 100 1000 0.11 0.1 -40 0.8 -40 0.0 Relative Radiant Power Normalize @ 20mA, 25℃ Ambient Temperature[℃] Fig.6 Relative Radiant Power vs. Temperature vs. Forward Peak Current 1.0 10.0 10100 1001000 1.0 10.0 0.9 1.0 1.1 1.2 -20020406080100-20040 2060100 80 0.5 1.0 1.5 2.0 2.5 3.0 Page4/9 0.5 0.0 800 1.0 850 900 950 L24HIR83233-30/A-PF PART NO.

Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Storage time: 1.The operation of Temperatures and RH are : 5℃~35℃,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH<60%, they should be treated at 60℃±5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, require some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40% of its desired value. (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Circuit model A LED Circuit model B LED Page 5/9 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only L24HIR83233-30/A-PF PART NO.

  1. The LED lamps are designed for high-density mount- ing and have a structure which can alleviate mechan- ical stress due to clinching . Nevertheless , take care to avoid the occurrence of residual mechanical stress due to clinching . 45°15° Anode side(cathode side on GaAlAs chips) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Mounting: 1. If the leads are subjected to stress during soldering a printed circuit board, illumination failure may result immediately or later during use. For this reason, make sure that the intervals between the installation holes in the board are equal to the intervals between the leads (after forming if done) so that no stress is applied to the lead. (O) (O) (X) Page 6/9L24HIR83233-30/A-PF PART NO.

Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body)

60 Seconds Max

0° 0 25° 120° Preheat 2°/sec max Temp(°C) 260° 2.Wave Soldering Profile Time(sec) 5°/sec max 100 260°C3sec Max 150 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page7/9 PART NO. L24HIR83233-30/A-PF

The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 (10min) (10min) 2.total 10 cycles Solder Resistance Test Solderability Test This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Reliability Test: Operating Life Test High Temperature Storage Test Low Temperature Storage Test Thermal Shock Test High Temperature High Humidity Test Test Item Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Test Condition 1.Ta=85℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page8/9 PART NO. L24HIR83233-30/A-PF

1.250 PCS / BAG

W 3. 12 INNER BOXES / CARTON SIZE : L X W X H 58.5cm X 34cm X 34cm 2. 8 BAG / INNER BOX SIZE : L X W X H 33.5cm X 19cm X 7.5cm W H C/NO: MADE IN CHINA ITEM NO. Q'TY: PCS N,W,: kgs G,W,: kgs L L H Page9/9