L20URF9653S-30B-AM LIGITEK | Alldatasheet
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SQUARE WITH 4LEADS TYPE LED LAMPS DOC. NO : QW0905-L20URF9653S-30B-AM REV. : A DATE : 18 - Nov. - 2008 L20URF9653S-30B-AM DATA SHEET LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Pb Lead-Free Parts
ψ3.0 7.62±0.5 2.5±0.5 Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 25% Directivity Radiation -60° 75%100%50% -30° 7.62±0.5 5.08±0.3 1.9 0.4 Package Dimensions ANODE CATHODE C1.25 R0.7 PART NO. L20URF9653S-30B-AM 60° 100%50%0 25%75% 30° 0.5 3.5±0.5 5.08 4.4±0.5 1.55 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/5
Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. Typical Electrical & Optical Characteristics (Ta=25 ℃) AlGaInP MATERIAL L20URF9653S-30B-AM PART NO Red Water Clear COLOR Emitted Lens Spectral halfwidth △λnm Viewing angle 2θ 1/2 (deg) Dominant wave length λDnm 3.02.020625 Max. 7700705000 Typ.Min. Topr Operating Temperature Storage Temperature Tstg Peak Forward Current Duty 1/10@10KHz Reverse Current @5V Power Dissipation Forward Current Ir PD IFP IF ℃-40 ~ +85 -40 ~ +100 ℃ 210 μA mW mA mA Absolute Maximum Ratings at Ta=25 ℃ Parameter Symbol Page 2/5 Ratings URF(S) UNIT LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Min. Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Electrostatic Discharge( * ) ESD2000V PART NO. L20URF9653S-30B-AM Forward voltage @50mA(V) Luminous intensity @50mA(mcd)
Typical Electro-Optical Characteristics Curve LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only URFS CHIP Page 3/5 PART NO. L20URF9653S-30B-AM Fig.2 Relative Intensity vs. Forward CurrentFig.1 Forward current vs. Forward Voltage Forward Current(mA) 100 200 300 400 Forward Voltage(V) Relative Intensity Normalize @20mA 5.0 Forward Current(mA) 05001000 Fig.4 Relative Intensity vs. TemperatureFig.3 Forward Voltage vs. Temperature 1.04 Forward Voltage@20mA Normalize @25℃ 0.98 1.00 1.02 0.94 0.96 608002040-40 100-20 Ambient Temperature(℃) Relative Intensity@20mA Normalize @25℃ -20 100 Ambient Temperature(℃) -40 4020080 60 1.4 1.2 0.8 0.0 0.2 0.4 0.6 1.0 Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA Wavelength (nm) 550600650700 0.5 1.0
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
60 Seconds Max
2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Time(sec) 150 260°C3sec Max 100 5°/sec max 50Preheat 2°/sec max 260° 120° 0°0 25° Temp(°C) PART NO. L20URF9653S-30B-AM
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. Solder Resistance Test This test intended to see soldering well performed or not.Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Thermal Shock Test High Temperature High Humidity Test (10min) (10min) 2.total 10 cycles 1.Ta=65℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs High Temperature Storage Test Low Temperature Storage Test Operating Life Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Reliability Test: Test ItemTest Condition MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-883:1008 JIS C 7021: B-10 JIS C 7021: B-12 MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Page 5/5 Description Reference Standard PART NO. L20URF9653S-30B-AM