L10HIR44243-A-PF LIGITEK | Alldatasheet

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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only L10HIR44243/A-PF ROUND TYPE LED LAMPS DATA SHEET DOC. NO : QW0905-L10HIR44243/A-PF REV. : A DATE : 13 - Mar. - 2016 Lead-Free Parts Pb 發行 DCC 立碁電子

3.853.1 25.0MIN MATERIAL Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. The LHIR62743/A-PF-B01series are high power solution grown efficiency Gallium Arsenide infrared emitting diodes encapsulated in water clear plastic 3. Low average degradation. Device Selection Guide: L10HIR44243/A-PF AIGaAs PART NO Descriptions: T-1 3/4 package individually 2.54TYP 1. High radiant intensity. 2. Suitable for pulsed applications. Features: ∅0.5 TYP 1.5MAX Water Clear LENS COLOR 4.023.05 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only L10HIR44243/A-PF Package Dimensions PART NO. 1/7Page

-40 ~ +85 -40 ~ +85 Max. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The radiant intensity data did not including ±15% testing tolerance. Reverse Current Viewing Angle 2θ1/2 IR 100 Peak Emission Wavelength Spectral Line Half Width Forward Voltage Aperture Radiant Incidence Radiant Intensity 850λpeak VF △λ 50 1.21.6 0.43Ee Le 3.0 0.57 4.0 Electrical Optical Characteristics (Aa=25) ℃ PARAMETER Min.SYMBOL Typ. Electrostatic Discharge Operating Temperature Storage Temperature Reverse Voltage Power Dissipation ESD Tstg Topr Vr PD Absolute Maximum Ratings at Ta=25 ℃ Peak Forward Current (300PPS,10μs Pulse) Forward Current Parameter IFP IF Symbol L10HIR44243/A-PF PART NO. deg μA VR=5V IF=20mAnm V nm IF=20mA IF=20mA mW/cm mW/sr IF=20mA IF=20mA TEST CONDITIONUNIT V 100 V mW A mA UNIT 2/7Page

5.0 6.0 4.0 6.0 8.0 5.0 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only L10HIR44243/A-PF Brightness Code For Standard LED Lamps Group Bin Code PART NO. Radiant Intensity(mW/sr)at 20 mA Min. 3.0 Max. 4.0 Page3/7

Fig.6 Relative Radiant Power vs. Temperature LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Radiant Power vs. Wavelength Relative Radiant Power Normalize @20mA Forward Current[mA] IFPK[mA]IFDC[mA] Ambient Temperature[℃] Fig.5 Forward DC Voltage vs. Temperature Forward DC Voltage Normalize @20mA, 25 ℃ 0.8 -40 0.9 0-2020 1.2 1.0 1.1 Relative Radiant Power Normalize @ 20mA, 25℃ 100604080 0.0 -40 1.0 0.5 Ambient Temperature[℃] 0-202060 4080 2.0 1.5 3.0 2.5 Forward Voltage[V] Fig.3 Relative Radiant Power vs. Forward DC Current 10.0 Relative Radiant Power Normalize @20mA 0.1 110 1.0 0.1 0.0 1.02.0 10.0 Relative Radiant Power Normalize @100 mA 100 0.1 1.0 100 Fig.4 Relative Radiant Power 4.03.0 800 0.0 Wavelength[nm] vs. Forward Peak Current 850 900 950 L10HIR44243/A-PF Fig.1 Forward Current vs. Rorward Voltage Typical Electro-Optical Characteristics Curve 100 1000 HIR CHIP PART NO. 0.5 1.0 100

5°/sec max

60 Seconds Max

2°/sec max25° 0° 0 Preheat 50 120° 100 260° Temp(°C) 260°C3sec Max Time(sec) 150 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/7 Note:1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. PART NO. L10HIR44243/A-PF

(10min) (10min) 2.total 10 cycles 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Test Condition 1.T.Sol=245 ℃±5℃ 2.Dwell time=5 ±1secSolderability Test Operating Life Test High Temperature High Humidity Test Thermal Shock Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. Solder Resistance Test 1.Ta=65 ℃±5℃ 2.RH=90%~95% 3.t=240hrs ±2hrs Low Temperature Storage Test High Temperature Storage Test Reliability Test: Test Item This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to see soldering well performed or not. This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-202:103B JIS C 7021: B-11 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 MIL-STD-883:1008 JIS C 7021: B-10 Description Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/7 PART NO. L10HIR44243/A-PF

H L PACKING SPECIFICATION 1. 1000PCS / BAG W 2. 8 BAG / INNER BOX SIZE : L X W X H 33cm X 19cm X 8cm L C/NO: MADE IN CHINA ITEM NO. Q'TY: PCS N,W,: kgs G,W,: kgs H W 3. 12 INNER BOXES / CARTON SIZE : L X W X H 58cm X 34cm X 34cm Page 7/7