IHS AMKOR | Alldatasheet
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Technical content
Si Integrated Heat Spreaders for fcCSP Packages Si is an effective alternative to Cu as a heat spreader material. f As a result of robust thermal conductivity and ease of processing, Si is an effective alternative to Cu as a heat spreader material f Si Integrated Heat Spreaders (IHS) can be embedded inside the mold, while exposing its top surface to an external heat sink Example constructions include: Si Integrated Heat Spreader Considerations Amkor’s package enhancement can be embedded inside of a mold to expose the top surface to an external heat sink. Embedded and Exposed Si IHS in a Single-die fcCSP TECHNOLOGY SOLUTIONS With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2018 Amkor Technology Incorporated. All Rights Reserved. TS115A 05/18 Visit amkor.com or email sales@amkor.com for more information. Embedded and Exposed Si IHS in a Side-by-Side Hybrid Structure Dual Si IHS in a Hybrid Structure Embedded and Exposed Si IHS in a Stacked Hybrid Structure Si Integrated Heat Spreader (IHS) Thermal Interface Material (TIM) Active Si (Flip Chip or Wirebond) Wirebond Die Attach Material Flip Chip Die Bump Wirebond Bondfinger Substrate Solder Ball Wirebond