IFP44 INTERFET | Alldatasheet

Document overview

  • Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
  • PDF pages: 5

Technical content

Features

  • InterFET P0099F Geometry
  • Low Noise: 8 nV/√Hz Typical
  • RoHS Compliant
  • SMT, TH, and Bare Die Package options.

Applications

  • Replacement for Japanese 2SJ44

Description

The 25V InterFET IFP44 is a replacement for the Japanese 2SJ44. Targeted for switching and commutator designs. The on resistance is typically less than 100 Ohms at room temperatures. The TO-18 package is hermetically sealed and suitable for military applications. Ordering Information Custom Part and Binning Options Available Part Number Description Case Packaging IFP44 Through-Hole TO-18 Bulk PN44 Through-Hole TO-92 Bulk SMP44 Surface Mount SOT23 Bulk SMP44TR 7“ Tape and Reel: Max 3,000 Pieces 13” Tape and Reel: Max 9,000 Pieces SOT23 Minimum 1,000 Pieces Tape and Reel IFP44COT Chip Orientated Tray (COT Waffle Pack) COT 400/Waffle Pack IFP44CFT Chip Face-up Tray (CFT Waffle Pack) CFT 400/Waffle Pack Product Summary Parameters IFP44 Min Unit BVGSS Gate to Source Breakdown Voltage 25 V IDSS Drain to Source Saturation Current 1 mA VGS(off) Gate to Source Cutoff Voltage 0.2 V GFS Forward Transconductance 9 mS Source Drain Gate SOT23 Top View TO-18 Bottom View 1Drain Source Gate/Case TO-92 Bottom View Source Drain Gate

www.InterFET.com IFP44 Document Number: IF35087.R00 InterFET Corporation June, 2019 IFP44InterFET Product Folder Technical Support Order Now Order Now

Electrical Characteristics

Static Characteristics (@ TA = 25°C, Unless otherwise specified) Parameters Conditions IFP44 UnitMin Max V(BR)GSS Gate to Source Breakdown Voltage VDS = 0V, IG = -1μA 25 V IGSS Gate to Source Reverse Current VGS = 10V, VDS = 0V 1 nA VGS(OFF) Gate to Source Cutoff Voltage VDS = 10V, ID = 100nA 0.2 1.5 V IDSS Drain to Source Saturation Current VGS = 0V, VDS = 10V (Pulsed) 1 18 mA Maximum Ratings (@ TA = 25°C, Unless otherwise specified) Parameters Value Unit VRGS Reverse Gate Source and Gate Drain Voltage 25 V IFG Continuous Forward Gate Current 10 mA PD Continuous Device Power Dissipation 300 mW P Power Derating 2.8 mW/°C TJ Operating Junction Temperature -55 to 125 °C TSTG Storage Temperature -65 to 150 °C Dynamic Characteristics (@ TA = 25°C, Unless otherwise specified) Parameters Conditions IFP44 UnitTypical GFS Forward Transconductance VDS = 10V, VGS = 0V, f = 1kHz 9 mS Ciss Input Capacitance VDS = 10V, VGS = 0V, f = 1MHz 15 pF Crss Reverse Transfer Capacitance VDS = -10V, VGS = 0V, f = 1MHz 3 pF

www.InterFET.com IFP44 Document Number: IF35087.R00 InterFET Corporation June, 2019 IFP44InterFET Product Folder Technical Support Order Now Order Now SOT23 (TO-236AB) Mechanical and Layout Data Package Outline Data Suggested Pad Layout 1. All linear dimensions are in millimeters. 2. Package weight approximately 0.12 grams 3. Molded plastic case UL 94V-0 rated 4. For Tape and Reel specifications refer to InterFET CTC-021 Tape and Reel Specification, Document number: IF39002 5. Bulk product is shipped in standard ESD shipping material 6. Refer to JEDEC standards for additional information. 1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been provided for reference only. A more robust pattern may be desired for wave soldering.

www.InterFET.com IFP44 Document Number: IF35087.R00 InterFET Corporation June, 2019 IFP44InterFET Product Folder Technical Support Order Now Order Now TO-18 Mechanical and Layout Data Package Outline Data Suggested Through-Hole Layout 1. All linear dimensions are in millimeters. 2. Package weight approximately 0.29 grams 3. Bulk product is shipped in standard ESD shipping material 4. Refer to JEDEC standards for additional information. 1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been provided as a straight lead reference only. A more robust pattern may be desired for wave soldering and/or bent lead configurations.

www.InterFET.com IFP44 Document Number: IF35087.R00 InterFET Corporation June, 2019 IFP44InterFET Product Folder Technical Support Order Now Order Now TO-92 Mechanical and Layout Data Package Outline Data Suggested Through-Hole Layout 1. All linear dimensions are in millimeters. 2. Package weight approximately 0.19 grams 3. Molded plastic case UL 94V-0 rated 4. Bulk product is shipped in standard ESD shipping material 5. Refer to JEDEC standards for additional information. 1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been provided as a straight lead reference only. A more robust pattern may be desired for wave soldering and/or bent lead configurations.