IF170A INTERFET | Alldatasheet

Document overview

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  • PDF pages: 8

Technical content

Features

  • InterFET N0132L Geometry
  • Low noise: 1.0 nV/√Hz typical
  • High gain: 22mS typical
  • Low gate leakage: 750fA typical @10V
  • High radiation tolerance
  • RoHS, REACH, CMR compliant
  • Custom test and binning options available
  • SMT, TH, and bare die package options
  • Edge case SPICE modeling: InterFET SPICE Industry Standard Crosses
  • 2SK152, 2SK170, 2N6451, 2N6452, 2N3972, MMBF4393
  • NSVJ3557SA3, NSVJ5908DSG5, NSVJ2394SA3 InterFET Similar Parts
  • IF1320, IFN152, SMP6451, SMP6452, SMP3972, SMP4393 InterFET Dual Parts
  • IF389A, IF389B, IF389C, IF389D, IFN146, IF1322A

Applications

  • General: Amplifiers; Switches; Voltage regulators; Oscillators; Signal mixers; Noise generators
  • Military/Aero: Radar; Communications; Satellites; Missiles guidance; Hydrophone preamplifiers.
  • Medical: Medical imaging systems; Medical monitors and recorders; Ultrasound equipment
  • Audio: Tone control circuits; Headphone amplifiers; Audio filters; Electret Microphone

Description

The -30V InterFET IF170x JFET is targeted for sensitive amplifier stages for mid-frequencies designs. Higher breakdown voltage parts are available through InterFET custom ordering. IF389x is the dual matched option. Ordering Information Custom Part and Binning Options Available Part Number Description Case Packaging IF170AT72, IF170BT72, IF170CT72, IF170DT72 Through-Hole TO-72 Bulk IF170AT92, IF170BT92, IF170CT92, IF170DT92 Through-Hole TO-92 Bulk IF170AST3, IF170BST3, IF170CST3, IF170DST3 Surface Mount SOT23 Bulk IF170AST3TR, IF170BST3TR, IF170CST3TR, IF170DST3TR 7“ Tape and Reel: 1,000 and 3,000 Pieces 13” Tape and Reel: 9,000 Pieces SOT23 Minimum 1,000 Pieces Tape and Reel IF170ACOT, IF170BCOT, IF170CCOT, IF170DCOT Chip Orientated Tray (COT Waffle Pack) COT 400/Waffle Pack IF170ACFT, IF170BCFT, IF170CCFT, IF170DCFT Chip Face-up Tray (CFT Waffle Pack) CFT 400/Waffle Pack SOT23 Top View NOTE: S/D pins are interchangeable Source Drain connections TO-92 Bottom View S/D S/D Gate S/D S/D Gate TO-72 Bottom View Gate S/D S/D 4 Case

https://www.InterFET.com InterFET Corporation April 2024 InterFET Product Folder Technical Support Order Now Order Now IF170A-B-C-D Document Number: SP IF170A-B-C-D

Electrical Characteristics

Dynamic Characteristics (@ TA = 25°C, Unless otherwise specified) Parameters Conditions Min Max Unit GFS Full Forward Transconductance VDS = 10V, VGS = 0V, f = 1kHz 14 mS GFS(TYP) Typical Transconductance VDS = 15V, ID = 1mA 6 mS Ciss Input Capacitance VDS = 10V, ID = 2mA, f = 1MHz 20 pF Crss Reverse Transfer Capacitance VDS = 10V, ID = 2mA, f = 1MHz 4.5 pF en Noise Voltage VDS = 10V, ID = 2mA, f = 1kHz 1.0 (Typical) nV/√Hz Maximum Ratings (@ TA = 25°C, Unless otherwise specified) Parameters TO-72 SOT-23 TO-92 Unit VRGS Reverse Gate Source and Gate Drain Voltage -30 -30 -30 V IFG Continuous Forward Gate Current 50 50 50 mA PD Continuous Device Power Dissipation¹ 500 350 500 mW P Power Derating1 3.3 2.8 4 mW/°C TJ Operating Junction Temperature -65 to 175 -55 to 150 -55 to 150 °C TSTG Storage Temperature -65 to 175 -55 to 150 -55 to 150 °C 1 Thermal power dissipation and derating values obtained with gate pin (substrate) thermally connected to pad and/or internal l ayer. Static Characteristics (@ TA = 25°C, Unless otherwise specified) Parameters Conditions IF170A IF170B IF170C IF170D UnitMin Max Min Max Min Max Min Max V(BR)GSS Gate to Source Breakdown Voltage IG = -1μA, VDS = 0V -30 -30 -30 -30 V IGSS Gate to Source Reverse Current VDS = 0V, VGS = -10V -0.1 -0.1 -0.1 -0.1 nA VGS(OFF) Gate to Source IDSS Drain to Source Saturation Current VDS = 10V, VGS = 0V

https://www.InterFET.com InterFET Corporation April 2024 InterFET Product Folder Technical Support Order Now Order Now IF170A-B-C-D Document Number: SP IF170A-B-C-D Typical IF170x Characteristics

https://www.InterFET.com InterFET Corporation April 2024 InterFET Product Folder Technical Support Order Now Order Now IF170A-B-C-D Document Number: SP IF170A-B-C-D Typical IF170x Characteristics (Continued)

https://www.InterFET.com InterFET Corporation April 2024 InterFET Product Folder Technical Support Order Now Order Now IF170A-B-C-D Document Number: SP IF170A-B-C-D SOT23 (TO-236AB) Mechanical and Layout Data Package Outline Data Suggested Pad Layout 1. All linear dimensions are in millimeters. 2. Package weight approximately 0.12 grams 3. Molded plastic case UL 94V-0 rated 4. For Tape and Reel specifications refer to InterFET CTC-021 Tape and Reel Specification, Document number: IF39002 5. Bulk product is shipped in standard ESD shipping material 6. Refer to JEDEC standards for additional information. 1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been provided for reference only. A more robust pattern may be desired for wave soldering.

https://www.InterFET.com InterFET Corporation April 2024 InterFET Product Folder Technical Support Order Now Order Now IF170A-B-C-D Document Number: SP IF170A-B-C-D TO-72 Mechanical and Layout Data Package Outline Data Suggested Through-Hole Layout 1. All linear dimensions are in millimeters. 2. Four leaded device. Not all leads are shown in drawing views. 3. Package weight approximately 0.31 grams 4. Bulk product is shipped in standard ESD shipping material 5. Refer to JEDEC standards for additional information. 1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been provided as a straight lead reference only. A more robust pattern may be desired for wave soldering and/or bent lead configurations.

https://www.InterFET.com InterFET Corporation April 2024 InterFET Product Folder Technical Support Order Now Order Now IF170A-B-C-D Document Number: SP IF170A-B-C-D TO-92 Mechanical and Layout Data Package Outline Data Suggested Through-Hole Layout 1. All linear dimensions are in millimeters. 2. Package weight approximately 0.19 grams 3. Molded plastic case UL 94V-0 rated 4. Bulk product is shipped in standard ESD shipping material 5. Refer to JEDEC standards for additional information. 1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been provided as a straight lead reference only. A more robust pattern may be desired for wave soldering and/or bent lead configurations.

Parameters SOT23 SOIC8 TO-92 Metal Case Alloy CDA194 C194 1/2H C194 1/2H Kovar Cu Balance 97% min 97% min Pb 0.03% max 0.03% max 0.03% max Ni 29% Co 17% Mn 0.3% Si 0.2% C <0.01% Au Plating 8 of 8 https://www.InterFET.com InterFET Corporation April, 2024 Environment InterFET parts follow the latest RoHS Compliance, REACH Compliance, Proposition 65 Statement, TSCA Statement, and Chemical Disposal and Waste Mitigation requirement and guidelines. For more on InterFET’s Environmental Commitment please visit www.InterFET.com/environmental/. Package tests Parameters SOT23 SOIC8 TO-92 Metal Case MSL Level 1 TBD N/A N/A ESD Class M4 Machine Model Class 3B HBM Class M4 Machine Model Class 3B HBM Class M4 Machine Model Class 3B HBM Class M4 Machine Model Class 3B HBM Legal Notice InterFET Corporation reserves the right to make corrections, enhancements, improvements, modifications, and other changes to its semiconductor products without further notice to this document and any product described herein. InterFET does not assume any liability arising out of the application or use of this document or any product described herein. Unless InterFET has explicitly designated an individual product as meeting the requirements of a particular industry standard, InterFET is not responsible for any failure to meet such industry standard requirements. InterFET Corporation assumes no liability for a customers product design or applications. Corporate designers and others who are developing systems that incorporate InterFET products understand and agree that they remain responsible for using their independent analysis, evaluation and judgment in designing their applications. Corporate designers and others have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications with all applicable regulations, laws and other applicable requirements. InterFET Corporation resources are provided “as is” with potential faults. InterFET disclaims all other warranties or representations, express or implied, regarding resources or use thereof, including but not limited to accuracy or completeness, title, any widespread failure warranty and any implied warranties of merchantability, fitness for a particular purpose, and non-infringement of any third party intellectual property rights. InterFET shall not be liable for and shall not defend or indemnify designer against any claim, including but not limited to any infringement claim that relates to or is based on any combination of products even if described in InterFET resources or otherwise. In no event shall InterFET be liable for any actual, direct, special, collateral, indirect, punitive, incidental, consequential or exemplary damages in connection with or arising out of InterFET resources or use thereof, and regardless of whether InterFET has been advised of the possibility of such damages. IF170A-B-C-D Document Number: SP IF170A-B-C-D