HSON8 AMKOR | Alldatasheet
Document overview
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Technical content
Applications
The HSON8 is suitable for medium-power applications (reference values 80W*/60A), designed for low on-resistance and high-speed switching MOSFETs. Ideal for: f Motor drivers f Injection drivers f Power supply circuits f Lamp drivers f Automotive products *Tc = 25°C, Tj = Max 150°C Reliability Qualification Amkor packages are assembled with proven reliable semiconductor materials. All reliability testing includes: f JEDEC standard pre-conditioning except high temperature storage f 85°C/85% RH, 168 hours, IR reflow 260°C 3X f H3TRB: 85°C/85% RH, 1000 hours f uHAST: 130°C/85% RH, 96 hours f Temp cycle: -55°C to 150°C, 1000 cycles f High temp storage: 150°C, 1000 hours Test Services Amkor offers full turnkey business for all power discrete products with the capability to test various types of power devices including MOSFETs, intelligent power devices, etc. f Power discrete test capability ▷ DC ▷ Capacitance *1 ▷ Rg *1 ▷ Avalanche test ▷ Thermal resistance f Program conversion f Electrical failure analysis f Integrated test, marking, vision inspection and tape & reel services *1 Sampling test only The HSON8 package maintains the same footprint area (5 x 6 mm) as the standard SOP8 package. HSON8 features an exposed die pad to enhance thermal performance. HSON8 DATA SHEET | POWER PRODUCTS
FEATURES
f Full turnkey available from wafer saw through test and packing f Green materials: Pb-free plating & halogen-free mold compound f Plating coverage at the tip of the lead is more than 50% of leadframe thickness UNDER DEVELOPMENT f Environmentally friendly die attach Pb-free solder PROCESS HIGHLIGHTS f Interconnect: φ125 µm ~ φ300 µm Al wire f Plating: 100% Matte Sn f Marking: Laser mark
Visit amkor.com or email sales@amkor.com for more information. With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2020 Amkor Technology, Incorporated. All Rights Reserved. DS407D-EN Rev Date: 01/20 HSON8 Standard Materials f Leadframe: Copper with Ni plating on wirebonding area f Die attach: Pb solder f Interconnect: Al wire f Mold compound: Halogen-free Shipping f Tape and reel packing ▷ 2500 pcs per reel ▷ Tape width: 12 mm ▷ Reel Ф = 330 mm f Barcode packing label Cross Section Package Outline Drawing Top and Bottom View Unit: mm Die Die attach material Mold compound A B Leadframe Al wire C D E C D A B E