GE02N60 ETL | Alldatasheet

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*Dynamic dv/dt Rating *Simple Drive Requirement *Repetitive Avalanche Rated *Fast Switching Package Dimensions A 4.40 4.80 c1 1.25 1.45 b 0.76 1.00 b1 1.17 1.47 c 0.36 0.50 L 13.25 14.25 D 8.60 9.00 e 2.54 REF. E 9.80 10.4 L1 2.60 2.89 L4 14.7 15.3 Ø 3.71 3.96 L5 6.20 6.60 A1 2.60 2.80 Absolute Maximum Ratings Parameter Symbol Ratings Unit Drain-Source Voltage VDS 600 V Gate-Source Voltage VGS ±20 V Continuous Drain Current, VGS@10V ID @TC=25: 2 A Continuous Drain Current, VGS@10V ID @TC=100: 1.26 A Pulsed Drain Current1 IDM 6 A Total Power Dissipation PD @TC=25: 39 W Linear Derating Factor 0.31 W/: Single Pulse Avalanche Energy2 EAS 200 mJ Avalanche Current IAR 2 A Repetitive Avalanche Energy EAR 2 mJ Operating Junction and Storage Temperature Range Tj, Tstg -55 ~ +150 : Thermal Data Parameter Symbol Value Unit Thermal Resistance Junction-case Max. Rthj-c 3.2 :/W Thermal Resistance Junction-ambient Max. Rthj-a 62 :/W BVDSS 600V RDS(ON) 9 ID 2A Pb Free Plating Product

GE02N60 Page: 2/5 ISSUED DATE :2005/01/27 REVISED DATE :2005/12/12B Electrical Characteristics (Tj = 25:::: unless otherwise specified) Parameter Symbol Min. Typ. Max. Unit Test Conditions Drain-Source Breakdown Voltage BVDSS 600 - - V VGS=0, ID=250uA Breakdown Voltage Temperature Coefficient æBVDSS /æTj - 0.6 - V/: Reference to 25:, ID=1mA Gate Threshold Voltage VGS(th) 2.0 - 4.0 V VDS=VGS, ID=250uA Forward Transconductance gfs - 0.8 - S VDS=10V, ID=1A Gate-Source Leakage Current IGSS - - ±100 nA VGS= ±20V Drain-Source Leakage Current(Tj=25:) - - 100 uA VDS=600V, VGS=0 Drain-Source Leakage Current(Tj=150:) IDSS - - 500 uA VDS=480V, VGS=0 Static Drain-Source On-Resistance RDS(ON) - - 9.0 VGS=10V, ID=1A Total Gate Charge3 Qg - 13.9 - Gate-Source Charge Qgs - 1.9 - Gate-Drain (“Miller”) Change Qgd - 8.2 - nC ID=2A VDS=480V VGS=10V Turn-on Delay Time3 Td(on) - 8.8 - Rise Time Tr - 10 - Turn-off Delay Time Td(off) - 21.3 - Fall Time Tf - 8.8 - ns VDD=300V ID=2A VGS=10V RG=10 RD=150 Input Capacitance Ciss - 155 - Output Capacitance Coss - 27 - Reverse Transfer Capacitance Crss - 14 - pF VGS=0V VDS=25V f=1.0MHz Source-Drain Diode Parameter Symbol Min. Typ. Max. Unit Test Conditions Forward On Voltage3 VSD - - 1.5 V IS=2A, VGS=0V, Tj=25: Continuous Source Current (Body Diode) IS - - 2 A VD=VG=0V, VS=1.5V Pulsed Source Current (Body Diode)1 ISM - - 6 A Notes: 1. Pulse width limited by safe operating area. 2. Staring Tj=25:, VDD=50V, L=100mH, RG=25, IAS=2A. 3. Pulse width 300us, duty cycle 2%.

GE02N60 Page: 3/5 ISSUED DATE :2005/01/27 REVISED DATE :2005/12/12B Characteristics Curve Fig 3. Normalized BVDSS v.s. Junction Temperature Fig 4. Normalized On-Resistance v.s. Junction Temperature Fig 5. Maximum Drain Current v.s. Case Temperature Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics Fig 6. Type Power Dissipation

GE02N60 Page: 4/5 ISSUED DATE :2005/01/27 REVISED DATE :2005/12/12B Fig 7. Maximum Safe Operating Area Fig 8. Effective Transient Thermal Impedance Fig 9. Gate Charge Characteristics Fig 10. Typical Capacitance Characteristics Fig 11. Forward Characteristics of Reverse Diode Fig 12. Gate Threshold Voltage v.s. Junction Temperature

GE02N60 Page: 5/5 ISSUED DATE :2005/01/27 REVISED DATE :2005/12/12B Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of GTM. GTM reserves the right to make changes to its products without notice. GTM semiconductor products are not warranted to be suitable for use in life-support Applications, or systems. GTM assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: TEL : 886-3-597-7061 FAX : 886-3-597-9220, 597-0785 China: (201203) No.255, Jang-Jiang Tsai-Lueng RD. , Pu-Dung-Hsin District, Shang-Hai City, China TEL : 86-21-5895-7671 ~ 4 FAX : 86-21-38950165 Fig 13. Switching Time Circuit Fig 14. Switching Time Waveform Fig 15. Gate Charge Circuit Fig 16. Gate Charge Waveform