FLIPSTACKCSP AMKOR | Alldatasheet

Document overview

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Technical content

FlipStack® CSP technology enables the stacking of a wide range of different semiconductor devices to deliver the high level of silicon integration and area efficiency required in portable multi-media products. This type of packaging uses high density thin core substrates, advanced wafer thinning, die attach, flip chip and wire bonding capabilities to stack multiple devices in a conventional fine pitch BGA (FBGA) surface mount package. Many customers have relied on Amkor to solve their highest density and most complex device stack combinations. As a result, Amkor has established industry leadership in stacking complex mixed signal, logic + memory devices, including digital base band or application/processors + high density flash or mobile DRAM devices. Designers are looking to FlipStack® CSP technologies to achieve integration, size and cost reductions in chip set combinations.

Applications

FlipStack® CSP technology enables smaller, lighter and more innovative new product form factors at a lower cost. This solution addresses a range of design requirements, and enables a wide variety of applications, including portable multimedia devices such as tablets, cell phones and digital cameras. Reliability Qualification Amkor assures reliable performance by continuously monitoring key indices. f Moisture resistance testing: JEDEC level 3 @ 260°C f Biased/Unbiased HAST: 121°C/100% RH, 2 atm, 192 hours f Temp/Humidity: 85°C/85% RH, 1000 hours f Temp cycle: -55°C/+125°C, 1000 cycles f High temp storage: 150°C, 1000 hours Board Level f Thermal cycle: -40°C/+125°C, 1000 cycles Test Services f Program generation/conversion f Product engineering f Wafer sort f -55°C to +165°C test available f Burn-in capabilities f Tape and reel services The FlipStack® CSP family utilizes Amkor’s industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities, in combination with Amkor’s fcCSP technology. This broad high-volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost. FlipStack® CSP DATA SHEET | LAMINATE PRODUCTS

FEATURES

f Package height down to 0.6 mm f Design, assembly and test capabilities that enable stacking combinations of memory, logic and mixed signal type devices f Established package infrastructure with standard CABGA and fcCSP footprints f Consistent product performance with high yields and reliability f Die overhang wirebonding f Low loop wirebonding to 40 µm or less f Pb-free, RoHS compliant and green materials f Passive component integration options f JEDEC standard outlines including MO-192, MO-195, MO-216, MO-219 and MO-298

With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2019 Amkor Technology, Incorporated. All Rights Reserved. DS820D-EN Rev Date: 09/19 Visit amkor.com or email sales@amkor.com for more information. Process Highlights f Die thickness (flip chip): As thin as 70 μm f Die thickness (wirebond): As thin as 50 μm f Ball diameter: As required f Wirebond pitch (min): 40 μm in-line with roadmap to 25 μm f Bump pitch mass reflow: 60 μm in-line f Thermal compression: 50 μm in-line f Wirebond length (max): 5 mm (200 mils) f Wirebond diameter (min): 0.7, 0.8, 0.9, 1.0 mil+ in gold, silver or copper wirebond diameters f Wafer diameter: 150, 200 & 300 mm wafers FlipStack® CSP Cross SectionsStandard Materials f Package substrate ▷ Laminate dielectric ⨠ HL832: NXA, NS, NS-LC, NSF-LCA ⨠ E679: FG, FGB, FGBS, GT, E700G, E705G, DS7409HG, DS7409HGB(S), DS7409HGB(LE), ELC4785GSB, ELC4785THB, ELC4785THG ▷ Layer count (laminate): 2-6 f Die attach ▷ Bottom die: Flip chip attached by mass reflow or thermal compression ▷ Top die: Non-conductive epoxy, film f Wire type: Au, Cu or Ag f Encapsulant: Transfer molded epoxy f Underfill: Capillary or molded f Bumps (F/C die): Pb-free, eutectic, Cu pillar f Solder balls: Pb-free, eutectic f Device type: Silicon, SiGe, GaAs, glass (IPD film on glass) f Marking: Laser Capillary or molded underfill options 2-6 Layer substrates A B C Eutectic or lead-free solder ball options Gold, silver or copper wire options D Capillary or molded underfill options 2-6 Layer substrates A B C Eutectic or lead-free solder ball options Gold, silver or copper wire options D D A B C D A B C