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Issue Date: 10/22/2014 ML630Q791 32-bit Microcontroller for Sensor Control GENERAL DESCRIPTION The ML630Q791 is a high -performance low power 32 -bit microcontroller optimized for the control of various sensor ICs. Equipped with a 32- bit CPU core Cortex ®-M0, it implements a 128 KB flash memory, 16 KB RAM , rich interfaces used to control various sensors, and host interface with the 512 -byte communication register in a very compact package. Th e ML630Q791 can efficiently control the power consumption of the whole system by separating the sensor control function from the application processor, and its high performance permits sensor -fusion using accelerometers, magnetic field sensors and gyro sensors, which makes it an ideal sensor control microcontroller for smart phones.
FEATURES
- CPU — 32-bit RISC CPU (ARM® Cortex®-M0) — Thumb®/Thumb®-2 instruction supported — Serial Wire Debug (SWD) port support
- Internal memory — 128 KB FLASH ROM (32K x 32-bit) — 16 KB SRAM (4K x 32-bit)
- Interrupt controller — Non-maskable interrupt: 1 source — Maskable interrupt: 21 sources Internal sources: 14 (Timer: 8, PWM: 1, I2C: 2, HOSTIF: 1, Arithmetic circuit: 1, UART: 1) External sources: 7
- Timer / Counter — 8-bit auto-reload timer x 8channels — 16-bit pulse width modulation(PWM) x 1channel — Watchdog timer (WDT) x 1channel
- Serial interface — I2C interface with master function x 2channels (including 8-bit, 32-stage FIFO) — UART interface x 1channel (two-wire, full duplex communication, including 8-bit, 32-stage FIFO)
- Host interface — Serial interface with slave function (SPI/I2C selectable) x 1channel — Interrupt to a host processor — 512Byte FIFO RAM
- General-purpose I/O port — 7-bit input/output port x 1channel — External Interrupt function
- Arithmetic circuit — Root and Division operations support
- Flash Programming Function — Hardware remap function support — ISP(In System Programming) support ARM, Cortex and Thumb are registered trademarks of ARM Limited
- Operation mode and power management function — CPU operation mode Supports high- and low-speed clock operation. — Sleep mode Stops clock of CPU. — SleepDeep mode Stops clock of CPU and all peripheral blocks.
- Input clock — 32.768 kHz (External clock input)
- Power supply voltage — VDD : 1.7V to 1.9V — Digital core section : 1.35V to 1.65V (supplied by the internal voltage regulator)
- Power consumption — High-speed operation (32MHz) : 5.0mA — SleepDeep mode : 2 .5uA
- Operating frequency — High-speed clock: 32 MHz (generated by internal FLL from input clock) — Low-speed clock: 32.768 kHz
- Operating temperature — -40°C to 85°C
- Package — 20-pin WL-CSP 0.4mm pitch (2.1 mm x 1.8 mm)
*1 Selectable I2C or SPI interface *2 Secondary function *3 Tertiary function Program Memory (Flash) 128KB RAM 16KB NVIC (Cortex®-M0) Timer 8-bit 8ch WDT 1ch General -Purpose I/O 7bit 1ch Arithmetic Circuit HOST IF (SPI / I2C) Clock Controller Reset Controller RESET_N I2C (Master) 2ch UART 1ch Regulator VDD VDDL GND CPU (Cortex®-M0) SDA_S*1 SCL_S*1 SDO_S*1*2 SDI_S*1 SCSN_S*1*2 SCLK_S*1 INT0_S*2 INT1S *3 CLK BRMP SWD SWC PWM 1ch PA0 to PA6 PWM0*3 RXD0*2 TXD0*2 SDA0_M SCL0_M SDA1_M*2 SCL1_M*2
PA4 PA5 SDA0_M SCL0_M 5 PA3 PA2 BRMP VPP 4 GND PA0 SWD SWC 3 VDDL PA1 SDA_S CLK 2 VDD RESET_N PA6 SCL_S 1 D C B A 20-pin WL-CSP Package (Bottom View)
PIN Primary Function Secondary Function Tertiary Function No. Symbol I/O Reset State Function Symbol I/O Function Symbol I/O Function A2 CLK I HZ SYSTEM — — — — — — B4 BRMP I PD SYSTEM — — — — — — A3 SWC I PU DEBUG I/F — — — — — — B3 SWD IO PU DEBUG I/F — — — — — — A1 SCL_S*1 SCLK_S I B2 SDA_S*1 SDIO_S SDI_S IO IO I D5 PA4 IO HZ GPIO SCS_S I HSTIF — — — C5 PA5 IO HZ GPIO SDO_S O HSTIF — — — C4 PA2 IO HZ GPIO RXD0 I UART — — — D4 PA3 IO HZ GPIO TXD0 O UART — — — C3 PA0 IO HZ GPIO SDA1_M IO I2C1 PWM0 IO PWM C2 PA1 IO HZ GPIO SCL1_M O I2C1 INT1_S O HSTIF B1 PA6 IO HZ GPIO INT0_S O HSTIF — — — *1 The used pin is determined by the HSTIF setting.
Pin name I/O Description Polarity GND — IO/core GND — VDD — IO power supply — VDDL — Core power supply (generated by internal regulator) — SYSTEM Pin name I/O Description Polarity CLK I External clock input (32.768kHz) — BRMP I Remap control input (for firmware update) Based on the BRMP pin setting at the time of the reset release, Bank0 is remapped. RESET_N I System reset input Negative DEBUG Interface Pin name I/O Description Polarity SWC I Serial clock of Serial Wire Debug Port — SWD IO Serial I/O data of Serial Wire Debug Port — Host Interface(HSTIF) Pin name I/O Description Polarity SCL_S*2 I SCL of I2C slave interface — SDA_S*2 IO SDA of I2C slave interface — SCLK_ S I SCLK of SPI slave interface — SDIO_S IO SDI and SDO of SPI slave interface in 3-wired mode — SDI_S I SDI of SPI slave interface in 4-wired mode — SCS_S I SCS of SPI slave interface *1 SDO_S O SDO of SPI slave interface in 4-wired mode — INT0_S O Interrupt0 output for host interface Negative INT1_S O Interrupt1 output for host interface Negative *1 The polarity can be set by the software. *2 3.6V tolerant in case of I2C interface. I2C master interface Pin name I/O Description Polarity SDA0_M* IO SDA of I2C0 master interface — SCL0_M* O SCL of I2C0 master interface — SDA1_M* IO SDA of I2C1 master interface — SCL1_M* O SCL of I2C1 master interface — * 3.6V tolerant.
Pin name I/O Description Polarity RXD0 I UART receive data — TXD0 O UART transmit data — PWM Pin name I/O Description Polarity PWM0 IO Output: PWM interface Input: PWM and timer clock input GPIO Pin name I/O Description Polarity PA0 to PA6 IO GPIO (External interrupt function available) — TEST Pin name I/O Description Polarity VPP — FLASH test pin —
TERMINATION OF UNUSED PINS Pin Recommended pin handling VPP Open BRMP Open SWC Connect a pull-up resistor. (Recommended) SWD Connect a pull-up resistor. (Recommended) SCL_S Connect a pull-down resistor. SDA_S Connect a pull-down resistor. PA0 to PA6 Open (Note) SDA0_M, SCL0_M Connect a pull-up resistor. [Note:] It is recommended to set the unused input ports and input/output ports to the input mode with pull -down/pull-up resistor or the output mode since the supply current may become excessively large if the pins are left open in the high im pedance input setting.
The ML630Q791 controls various sensors via the host interface. The host interface provides selectable I2C/SPI interface and interrupt signals to the host processor, and includes an register address space and an 512Byte FIFO. Register Map Address Name Symbol R/W Size Initial Value Write Read 0x00 0x80 Configuration register CFG R/W 8 0x00 0x01 0x81 reserved — — — — 0x02 0x82 interrupt mask register 0 INTMSK0 R/W 8 0xFF 0x03 0x83 interrupt mask register 1 INTMSK1 R/W 8 0xFF 0x04~ 0x08 0x84~ 0x88 reserved — — — — — 0x89 Operation status register STATUS R/— 8 0xFE — 0x8A Error code register 0 ERROR0 R/— 8 0x00 — 0x8B Error code register 1 ERROR1 R/— 8 0x00 — 0x8C interrupt request register 0 INTREQ0 R/— 8 0x00 — 0x8D interrupt request register 1 INTREQ1 R/— 8 0x00 0x0E~ 0x0F 0x8E~ 0x8F reserved — — — — 0x10 0x90 FIFO register FIFO R/W 8 0xXX 0x11~ 0x1F 0x91~ 0x9F reserved — — — — 0x20 0xA0 Parameter register 0F PRMF R/W 8 0x00 0x21 0xA1 Parameter register 0E PRME R/W 8 0x00 0x22 0xA2 Parameter register 0D PRMD R/W 8 0x00 0x23 0xA3 Parameter register 0C PRMC R/W 8 0x00 0x24 0xA4 Parameter register 0B PRMB R/W 8 0x00 0x25 0xA5 Parameter register 0A PRMA R/W 8 0x00 0x26 0xA6 Parameter register 09 PRM9 R/W 8 0x00 0x27 0xA7 Parameter register 08 PRM8 R/W 8 0x00 0x28 0xA8 Parameter register 07 PRM7 R/W 8 0x00 0x29 0xA9 Parameter register 06 PRM6 R/W 8 0x00 0x2A 0xAA Parameter register 05 PRM5 R/W 8 0x00 0x2B 0xAB Parameter register 04 PRM4 R/W 8 0x00 0x2C 0xAC Parameter register 03 PRM3 R/W 8 0x00 0x2D 0xAD Parameter register 02 PRM2 R/W 8 0x00 0x2E 0xAE Parameter register 01 PRM1 R/W 8 0x00 0x2F 0xAF Parameter register 00 PRM0 R/W 8 0x00 0x30 0xB0 Command register 0 CMD0 R/W 8 0x00 0x31 0xB1 Command register 1 CMD1 R/W 8 0x00 0x32 0xB2 Command entry register ENT R/W 8 0x00 0x33~ 0x3F 0xB3~ 0xBF reserved — — — — — 0xC0 Result register 00 RSLT00 R/— 32 0x00 — 0xC1 Result register 01 RSLT01 R/— 32 0x00 — 0xC2 Result register 02 RSLT02 R/— 32 0x00 — 0xC3 Result register 03 RSLT03 R/— 32 0x00 — 0xC4 Result register 04 RSLT04 R/— 32 0x00 — 0xC5 Result register 05 RSLT05 R/— 32 0x00 — 0xC6 Result register 06 RSLT06 R/— 32 0x00 — 0xC7 Result register 07 RSLT07 R/— 32 0x00 — 0xC8 Result register 08 RSLT08 R/— 32 0x00 — 0xC9 Result register 09 RSLT09 R/— 32 0x00
Address Name Symbol R/W Size Initial Value Write Read — 0xCA Result register 0A RSLT0A R/— 32 0x00 — 0xCB Result register 0B RSLT0B R/— 32 0x00 — 0xCC Result register 0C RSLT0C R/— 32 0x00 — 0xCD Result register 0D RSLT0D R/— 32 0x00 — 0xCE Result register 0E RSLT0E R/— 32 0x00 — 0xCF Result register 0F RSLT0F R/— 32 0x00 — 0xD0 Result register 10 RSLT10 R/— 32 0x00 — 0xD1 Result register 11 RSLT11 R/— 32 0x00 — 0xD2 Result register 12 RSLT12 R/— 32 0x00 — 0xD3 Result register 13 RSLT13 R/— 32 0x00 — 0xD4 Result register 14 RSLT14 R/— 32 0x00 — 0xD5 Result register 15 RSLT15 R/— 32 0x00 — 0xD6 Result register 16 RSLT16 R/— 32 0x00 — 0xD7 Result register 17 RSLT17 R/— 32 0x00 — 0xD8 Result register 18 RSLT18 R/— 32 0x00 — 0xD9 Result register 19 RSLT19 R/— 32 0x00 — 0xDA Result register 1A RSLT1A R/— 32 0x00 — 0xDB Result register 1B RSLT1B R/— 32 0x00 — 0xDC Result register 1C RSLT1C R/— 32 0x00 — 0xDD Result register 1D RSLT1D R/— 32 0x00 — 0xDE Result register 1E RSLT1E R/— 32 0x00 — 0xDF Result register 1F RSLT1F R/— 32 0x00 — 0xE0 Result register 20 RSLT20 R/— 32 0x00 — 0xE1 Result register 21 RSLT21 R/— 32 0x00 — 0xE2 Result register 22 RSLT22 R/— 32 0x00 — 0xE3 Result register 23 RSLT23 R/— 32 0x00 — 0xE4 Result register 24 RSLT24 R/— 32 0x00 — 0xE5 Result register 25 RSLT25 R/— 32 0x00 — 0xE6 Result register 26 RSLT26 R/— 32 0x00 — 0xE7 Result register 27 RSLT27 R/— 32 0x00 — 0xE8 Result register 28 RSLT28 R/— 32 0x00 — 0xE9 Result register 29 RSLT29 R/— 32 0x00 — 0xEA Result register 2A RSLT2A R/— 32 0x00 — 0xEB Result register 2B RSLT2B R/— 32 0x00 — 0xEC Result register 2C RSLT2C R/— 32 0x00 — 0xED Result register 2D RSLT2D R/— 32 0x00 — 0xEE Result register 2E RSLT2E R/— 32 0x00 — 0xEF Result register 2F RSLT2F R/— 32 0x00 — 0xF0 Result register 30 RSLT30 R/— 32 0x00 — 0xF1 Result register 31 RSLT31 R/— 32 0x00 — 0xF2 Result register 32 RSLT32 R/— 32 0x00 — 0xF3 Result register 33 RSLT33 R/— 32 0x00 — 0xF4 Result register 34 RSLT34 R/— 32 0x00 — 0xF5 Result register 35 RSLT35 R/— 32 0x00 — 0xF6 Result register 36 RSLT36 R/— 32 0x00 — 0xF7 Result register 37 RSLT37 R/— 32 0x00 — 0xF8 Result register 38 RSLT38 R/— 32 0x00 — 0xF9 Result register 39 RSLT39 R/— 32 0x00 — 0xFA Result register 3A RSLT3A R/— 32 0x00 — 0xFB Result register 3B RSLT3B R/— 32 0x00 — 0xFC Result register 3C RSLT3C R/— 32 0x00 — 0xFD Result register 3D RSLT3D R/— 32 0x00 — 0xFE Result register 3E RSLT3E R/— 32 0x00 — 0xFF Result register 3F RSLT3F R/— 32 0x00
Configuration Register CFG 7 6 5 4 3 2 1 0 CFG REGMD — INTPW[1:0] INT1EN INTLVL — — R/W R/W — R/W R/W R/W R/W — — Initial Value 0 0 0 0 0 0 0 0 REGMD: This bit shows the register access mode of the serial interface (SPI/I2C). When set to "0", the internal address is incremented by 1 each time a 1-byte data is transmitted/received. When set to "1", the address is fixed to the same address. INTPW[1:0]: This bit indicates the pulse width setting when the interrupt signal is a pulse signal. If the pulse width is set to 500[ns] or longer, an interrupt pulse may not be output depending on the timing when the CPU writes to the interrupt request register. In this case, use the level output as the interrupt signal instead of the pulse output. INTPW[1:0] Description 00 250[ns] (4 MHz cycle) (initial value) 01 500[ns] (2 MHz cycle) 10 1000[ns] (1 MHz cycle) 11 2000[ns] (500 kHz cycle) INT1EN: Controls the INT1_S interrupt signal. INT1EN Description
0 INT1_S pin is merged with INT0_S to be output (initial value)
1 INT1_S pin is enabled
INTLVL: Sets the interrupt level. Set to "0" for pulse output, or set to "1" for level output.
Interrupt Mask Register INTMSK n (n = 0, 1) 7 6 5 4 3 2 1 0 INTMSK0 MSK0 [7] MSK0 [6] MSK0 [5] MSK0 [4] MSK0 [3] MSK0 [2] MSK0 [1] MSK0 [0] R/W R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 1 1 1 1 1 1 1 1 7 6 5 4 3 2 1 0 INTMSK1 MSK1 [7] MSK1 [6] MSK1 [5] MSK1 [4] MSK1 [3] MSK1 [2] MSK1 [1] MSK1 [0] R/W R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 1 1 1 1 1 1 1 1 MSK0[7:0]: Masks the interrupt notification to the host processor by the interrupt request register (INTREQ0). Set to " 1" to mask the interrupt notification by REQ0[n] bit of INTREQ0.Set to "0" not to mask the interrupt notification. MSK1[7:0]: Masks the interrupt notification to the host processor by the interrupt request register (INTREQ1). Set to " 1" to mask the interrupt notification by REQ1[n] bit of INTREQ1.Set to "0" not to mask the interrupt notification.
Operation Status Register STATUS 7 6 5 4 3 2 1 0 STATUS ST[7] ST[6] ST[5] ST[4] ST[3] ST[2] ST[1] ST[0] Initial Value 0 0 0 0 0 0 0 0 ST[7:0]: Indicates the status of sensor measurement. Error Code Register ERROR n (n = 0, 1) 7 6 5 4 3 2 1 0 ERRORn ERn [7] ERn [6] ERn [5] ERn [4] ERn [3] ERn [2] ERn [1] ERn [0] Initial Value 0 0 0 0 0 0 0 0 ER n[7:0]: Indicates the interrupt source to the host processor. Each bit of this register is cleared by being read by the host processor. Interrupt Request Register INTREQn (n = 0, 1) 7 6 5 4 3 2 1 0 INTREQn REQn [7] REQn [6] REQn [5] REQn [4] REQn [3] REQn [2] REQn [1] REQn [0] Initial Value 0 0 0 0 0 0 0 0 REQn[7:0]: Indicates the interrupt source to the host processor. Each bit of this register is cleared by being read by the host processo r. FIFO Register FIFO 7 6 5 4 3 2 1 0 FIFO FIFO [7] FIFO [6] FIFO [5] FIFO [4] FIFO [3] FIFO [2] FIFO [1] FIFO [0] R/W R/W R/W R/W R/W R/W R/W R/W R/W Initial Value x x x x x x x x FIFO [7:0]: This register indicates the command processing results.This register is FIFO structure and read the data of given size. When doing firmware update, the data with max 512 Byte unit input is available.
Parameter Register PRMn (n = 00 to 0F) 7 6 5 4 3 2 1 0 PRMn PRMn[7] PRMn [6] PRMn [5] PRMn [4] PRMn [3] PRMn [2] PRMn [1] PRMn [0] R/W R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 PRMn[7:0]: This register sets the parameters of commands. Command Register CMDn (n = 0, 1) 7 6 5 4 3 2 1 0 CMDn CMDn[7] CMDn[6] CMDn[5] CMDn[4] CMDn[3] CMDn[2] CMDn[1] CMDn[0] R/W R/W R/W R/W R/W R/W R/W R/W R/W Initial Value 0 0 0 0 0 0 0 0 CMDn[7:0]: This register sets the measurement conditions of sensors and inputs commands such as measurement start/stop. Command Entry Register ENT 7 6 5 4 3 2 1 0 Initial Value 0 0 0 0 0 0 0 0 ENT: After a command is set, set this bit "1" to notify the CPU of the command. When the CPU receives the command, this bit is cleared. Result Register RSLT n (n = 00 to 3F) 7 6 5 4 3 2 1 0 RSLTn RSLTn[7] RSLTn [6] RSLTn [5] RSLTn [4] RSLTn [3] RSLTn [2] RSLTn [1] RSLTn [0] Initial Value 0 0 0 0 0 0 0 0 RSLTn[7:0]: This register indicates the command processing results.
(GND=0V) Parameter Symbol Condition Rating Unit Power supply voltage (Digital I/O) VDD Ta=25°C -0.3 to 4.6 V Power supply voltage (Digital CORE) VDDL Ta=25°C -0.3 to 1.8 V Input voltage VIN Ta=25°C -0.3 to 4.6 V Output voltage VOUT Ta=25°C -0.3 to 4.6 V Output current IOUT Ta=25°C -10 to 10 mA Power dissipation PD Ta=25°C 0.8 W Storage temperature TSTG ― -55 to 150 °C RECOMMENDED OPERATION CONDITIONS (GND=0V) (GND=0V) Parameter Symbol Condition Range Unit Ambient temperature Ta ― -40 to 85 °C Power supply voltage VDD ― 1.7 to 1.9 V Input voltage VIN0 ― 0 to VDD V VIN1 *1 0 to 3.6 V Input clock frequency fCLK ― 32.768±1% kHz VDDL pin external capacitance CL ― 2.2±50% μF *1 SCL_S, SDA_S, SDA0_M, SCL0_M, PA0, PA1 using as I2C bus interface. OPERATING CONDITIONS OF FLASH MEMORY (GND=0V) Parameter Symbol Condition Range Unit Ambient temperature Ta ― -40 to 85 °C Power supply voltage VDD ― 1.7 to 1.9 V Rewrite count CEP ― 1000 times Data retention YDR ― 10 years
ELECTRICAL CHARACTERISTICS
DC Characteristics (1/2) (VDD=1.7 to 1.9V, GND=0V, Ta=-40 to 85°C) Parameter Symbol Condition Standard value Unit Min. Typ. Max. Power consumption (Sleep) IDD2 CPU stop *1 ― 2.5 120 μA Power consumption (Low-speed operation) IDD3 CPU 32.768kHz operation *1 ― 0.5 0.7 mA Power consumption (High-speed operation) IDD4 CPU 32MHz operation ― 5.0 6.5 mA Power consumption (At reset) IDD-R RESETN pin is Low ― 0.4 0.6 mA *1 operate with the low-speed clock and stop the high-speed clock (FLL). Peripherals except HostIF are initial state. DC Characteristics (2/2) (VDD=1.7 to 1.9V, GND=0V, Ta=-40 to 85°C) Parameter Symbol Condition Standard value Unit Min. Typ. Max. Output voltage 1 VOH1 ― ― ― ― V (SDA0_M, SCL0_M PA0*1, PA1*1 SCL_S*2, SDA_S*2) VOL1 IOL = 3mA ― ― VDD x 0.2 Output voltage 2 VOH2 IOH = -2mA VDD - 0.45 ― ― V (Other pins) VOL2 IOL = 2mA ― ― 0.45 Output leakage IOOH VOH = VDD (in high-impedance state) ― ― 1 μA IOOL VOL = 0V (in high-impedance state) -1 ― ― input current 1 IIH1Z VIH = VDD ― ― 1 μA IIL1Z VIL = GND -1 ― ― IIH1 VIH = VDD (pull-down) 2 ― 200 IIL1 VIL = GND (pull-up) -200 ― -2 Input voltage VIH1 ― VDD x 0.7 ― ― V VIL1 ― ― ― VDD x 0.3 *1 Output voltage 1 shows the characteristic in case the secondary pin function (I2C) is selected. *2 Output voltage 1 shows the characteristic in case I2C is selected for host interface.
AC Characteristics (Clock) (VDD=1.7 to 1.9V,GND= 0V, Ta=-40 to 85°C) Parameter Symbol Condition Standard value Unit Min. Typ. Max. Input clock frequency fCLK ― Typ. -1% 32.768 Typ. +1% kHz Input clock High pulse width TCLKH ― Typ. -1% 15.259 Typ. +1% μs Input clock Low pulse width TCLKL ― Typ. -1% 15.259 Typ. +1% μs System clock frequency fSYS fCLK = 32.768kHz Typ -5% 32 Typ +5% MHz FLL activation time (Normal activation) TFLL1 fCLK = 32.768kHz ― ― 1 ms FLL activation time (Fast activation) TFLL2 fCLK = 32.768kHz ― 75 ― μs AC Characteristics (Reset) (VDD=1.7 to 1.9V, GND= 0V, Ta=-40 to 85°C) Parameter Symbol Condition Standard value Unit Min. Typ. Max. Reset pulse width PRST ― 400 ― ― μs Reset noise elimination pulse width PNRST ― ― ― 0.1 FLL output clock TSYS *TSYS = 1/fSYS TPLL1, T PLL2 CLK (clock input pin) TCLKH TCLKL *TCLK = 1/fCLK TCLK RESET_N RESET_N pin reset PRST VIL1 VIL1 PNRST VIL1 VIL1 Reset noise elimination
AC Characteristics (UART) (VDD=1.7 to 1.9V, GND=0V, Ta=-40 to 85°C) Parameter Symbol Condition Standard value Unit Min. Typ. Max. Transferring baud-rate tTBRT ― ― BRT*1 ― s Receiving baud-rate tRBRT ― BRT*1 -3% BRT*1 BRT*1 +3% s *1 Baud rate period (including the error of the clock frequency selected) set with the UART0 baud rate regi ster (UA0BRTL,H) and the UART0 mode register 0 (UA0MOD0). tRBRT TXD0 RXD0 tTBRT
AC Characteristics (Host Interface: I2C Slave Interface) (VDD=1.7 to 1.9V, GND=0V, Ta= -40 to 85°C) Parameter Symbol Condition Standard value Unit Min. Typ. Max. SCL_S clock frequency fSCL — — — 400 kHz SCL_S hold time (start/restartcondition) tHD:STA — 0.6 — — µs SCL_S "L" level time tLOW — 1.3 — — µs SCL_S "H" level time tHIGH — 0.6 — — µs SCL_S setup time (restart condition) tSU:STA — 0.6 — — µs SDA_S hold time tHD:DAT — 0 — — ns SDA_S setup time tSU:DAT — 0.1 — — µs SDA_S setup time (P: Stop condition) tSU:STO — 0.6 — — µs Bus free time tBUF — 1.3 — — µs SCL_S SDA_S Start condition Restart condition Stop condition tBUF tHD:STA tLOW tHIGH tSU:STA tHD:STA tSU:DAT tHD:DAT tSU:STO
AC Characteristics (Host Interface: SPI Slave Interface) (VDD=1.7 to 1.9V, GND=0V, Ta= -40 to 85°C) Parameter Symbol Condition Standard value Unit Min. Typ. Max. SCLK_S input cycle tSCYC ― 250 ― ― ns SCLK_S input pulse width tSW ― 120 ― ― ns SCS_S setup time tCS1 ― 80 ― ― ns tCS2 ― 80 ― ― ns SCS_S hold time tCH1 ― 80 ― ― ns tCH2 ― 80 ― ― ns SCS_S input pulse width tCW ― 90 ― ― ns SDO_S output delay time tSD ― ― ― 100 ns SDI_S input setup time tSS ― 60 ― ― ns SDI_S input hold time tSH ― 60 ― ― ns *1 As for SPI, if Host keeps SCLK high while communication is standby, there are cases when this LSI cannot enter SleepDeep mode until SCS_S becomes non-active. *2 Either “High active” or “Low active” can be selected for polarity of SCS_S. tSH tSS tSCYC tSW tSW tCS tCS1 tSD tCH1 tCW SCLK_S *1 SDI_S SCLK_S SDO_S SCS_S *2 tCH2
AC Characteristics (I2C Master Interface: Standard Mode 100 kHz) (VDD=1.7 to 1.9V, GND=0V, Ta= -40 to 85°C) Parameter Symbol Condition Standard value Unit Min. Typ. Max. SCLn_M clock frequency fSCL — — — 100 kHz SCLn_M hold time (start/restart condition) tHD:STA — 4.0 — — µs SCLn_M "L" level time tLOW — 4.7 — — µs SCLn_M "H" level time tHIGH — 4.0 — — µs SCLn_M setup time (restart condition) tSU:STA — 4.7 — — µs SDAn_M hold time tHD:DAT — 0 — — µs SDAn_M setup time tSU:DAT — 0.25 — — µs SDAn_M setup time (P: Stop condition) tSU:STO — 4.0 — — µs Bus free time tBUF — 4.7 — — µs AC Characteristics (I2C Master Interface: Fast Mode 400 kHz) (VDD=1.7 to 1.9V, GND=0V, Ta= -40 to 85°C) Parameter Symbol Condition Standard value Unit Min. Typ. Max. SCLn_M clock frequency fSCL — — — 400 kHz SCLn_M hold time (start/restart condition) tHD:ST A — 0.6 — — µs SCLn_M "L" level time tLOW — 1.3 — — µs SCLn_M "H" level time tHIGH — 0.6 — — µs SCLn_M setup time (restart condition) tSU:ST A — 0.6 — — µs SDAn_M hold time tHD:DA T — 0 — — µs SDAn_M setup time tSU:DA T — 0.1 — — µs SDAn_M setup time (P: Stop condition) tSU:ST O — 0.6 — — µs Bus free time tBUF — 1.3 — — µs SCLn_M SDAn_M Start condition Restart condition Stop condition tBUF tHD:STA tLOW tHIGH tSU:STA tHD:STA tSU:DAT tHD:DAT tSU:STO n=0,1
AC Characteristics (Firmware update) Power-on/Power-off VDD BRMP RESET_N Min:400us Min:400us Min:10ms Min:0ns
Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact a ROHM sales office for the product na me, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
REVISION HISTORY
Document No. Issue Date Page Description Previous Edition Current Edition PEDL630Q791-01 2014.5.15 - - Preliminary Edition issued FEDL630Q791-01 2014.10.22 - - Final Edition issued
1) The information contained herein is subject to change without notice. 2) Although LAPIS Semiconductor is continuously working to improve product reliability and qu ality, semiconductors can break down and malfunction due to various factors. Therefore, in order to prevent personal injury or fire arising from failur e, please take safety measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail -safe procedures. LAPIS Semiconductor shall have no responsibility for any damages arising out of the use of our Products beyond the rating specified by LAPIS Semiconductor. 3) Examples of application circuits, circuit constants and any other information contained herein are provided only to illustrate the standard usage and operations of the Products.The peripheral conditions must be taken into account when designing circuits for mass production. 4) The technical information specified herein is intended only to show the typical functions of the Products and examples of application circuits for the Products. No license, expressly or implied, is granted hereby under any intellectual property rights or o ther rights of LAPIS Semiconductor or any third party with respect to the information contained in this document; therefore LAPIS Semiconductor shall have no responsibility whatsoever for any dispute, concerning such rights owned by third parties, arising out of the use of such technical information. 5) The Products are intended for use in general electronic equipment (i.e. A V/OA devices, communication, consumer systems, gaming/entertainment sets) as well as the applications indicated in this document. 6) The Products specified in this document are not designed to be radiation tolerant. 7) For use of our Products in applications requiring a high degree of reliability (as exemplified below), please contact and consult with a LAPIS Semiconductor representative: transpo rtation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems. 8) Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters. 9) LAPIS Semiconductor shall have no responsibility for any damages or injury arising from non -compliance with the recommended usage conditions and specifications contained herein. 10) LAPIS Semiconductor has used reasonable care to ensure the accuracy of the in formation contained in this document. However, LAPIS Semiconductor does not warrant that such information is error -free and LAPIS Semiconductor shall have no responsibility for any damages arising from any inaccuracy or misprint of such information. 11) Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive. For more details, including RoHS compatibility, please contact a ROHM sales office. LAPIS Semiconductor shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations. 12) When providing our Products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable ex port laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act. 13) This document, in part or in whole, may not be reprinted or reproduced without prior consent of LAPIS Semicondu ctor. Copyright 2014 LAPIS Semiconductor Co., Ltd. 2-4-8 Shinyokohama, Kouhoku-ku, Yokohama 222-8575, Japan http://www.lapis-semi.com/en/