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Technical content

Issue Date: Oct. 01, 2008 MR27V6452L 4M–Word × 16–Bit or 8M–Word × 8–Bit Page Mode P2ROM

FEATURES

  • 4,194,304-word × 16-bit / 8,388,608-word × 8-bit electrically switchable configuration Bit
  • Input/Output TTL compatible t PACKAGES nology utilizes test equipment for programming the customers code into the P2ROM prior to final production testing. OM and has many llowing; at the final stage of the production process, a large P2ROM inventory "bank system" of un-programmed packaged products are maintained to provide an aggressive lead-time and minimize liability as a custom product.
  • No mask charge , since P2ROMs do not utilize a custom mask for storing customer code, no mask charges apply.
  • No additional programming charge, unlike Flash and OTP that require additional programming and handling costs, the P2ROM already has the code loaded at the factory with minimal effect on the production throughput. The cost is included in the unit price.
  • Custom Marking is available at no additional charge.
  • Pin Compatible with Mask ROM and some FLASH products.
  • Pag e size of 8-word x 16-Bit or 16-word x 8-
  • 3.0 V to 3.6 V power supply
  • Random Access time..
  • Page Access ti
  • Standby c
  • Three-state outpu MR 27V6452L-xxxMA 44-pin plastic SOP (SOP44-P-600-1.27-K)
  • MR27V6452L-xxxTN 48-pin plastic TSOP (TSOP I 48-P-1220-0.50-1K) MR27V6452L-xxxTA 56-pin plastic TSOP (TSOP I 56-P-1420-0.50-K) P2ROM ADVANCED TECHNOLOGY P2ROM stands for Production Programmed ROM. This exclusive LAPIS Semiconductor tech factory Advancements in this technology allows production costs to be equivalent to MASKR advantages and added benefits over the other non-volatile technologies, which include the fo
  • Short lead time, since the P2ROM is programmed 1/

PIN CONFIGURATION (TOP VIEW) 48TSOP(Type-I) (Unit: mm) A15 A14 A13 A12 A11 A10 A19 A20 NC NC A21 NC NC OE# V SS CE# A17 A16 BYT VSS D15 D14 D13 D12 V CC D D10 56TSOP(Type-I) NC NC A15 A14 A13 A12 A11 A10 A19 A20 NC NC A21 NC NC A18 A17 NC NC NC NC A16 BYTE# V SS D15/A-1 D14 D13 D12 V CC D11 D10 OE# V SS CE# NC NC* A21 A18 A SS OE# D10 D11 A20 A19 A10 A11 A12 A13 A14 A15 A16 BYT V SS D15/A–1 D14 D13 D12 V CC *:Different from FLASH products. C V 44SOP

D15 / A–1 Data output / Address input A0 to A21 Address inputs D0 to D14 Data outputs CE# Chip enable input OE# Output enable input BYTE# Word / Byte select input VCC Power supply voltage VSS Ground NC No connect In 8-bit output mode, these pins are placed in a high-Z state and pin D15 functions as the A-1 address pin. A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 CE# BYTE# OE# CE × 8/× 16 Switch D0 D2 D4 D6 D8 D10 D12 D14 D1 D3 D5 D7 D9 D11 D13 D15 Memory Cell Matrix × 16-Bit or 8M × 8-Bit Row Decoder Column Dec Address Buffer OE M ultiplexer Output Buffer oder A–1

Mode C OE BYTE# CC to D7 to D14 D15/A–1 CTI LE E# # V D0 D8 Read (16-Bit) L DOUT L H Read (8-Bit) L L L DOUT Hi–Z L/H H Output disable L H L Hi–Z H Standby H ∗ L 3.3 V Hi–Z ∗: Don’ or L) AXIMUM RATINGS ameter Symbol Condition Unit t Care (H ABSOLUTE M Par Value Operating temperature under bias Ta 0 to 70 °C Storage temperature Tstg –5 125 °C 5 to Input voltage VI –0.5 to VCC+0.5 V Output voltage V –0.5 to VCC+0.5 V O Power supply voltage VCC relative to VSS –0.5 to 5 V Power dissipation per package P D Ta = 25°C W 1.0 Out cuit cur — mA put short cir rent IOS 10 RECOMMENDED OPERATING CONDITIONS (Ta = 0 to 70°C) Parameter Symbol Condition Min. Typ. Max. Unit VCC power supply voltage VCC 3.0 — 3.6 V Input “H” level VIH 2.2 — VCC+0.5∗ V Input “L” level VIL VCC = 3.0 to 3.6 V 0.6 V –0.5∗∗ — Volt relative . ∗ : .5V(Max en puls overs ot is le han 10 ∗∗ : Min.) when lse wi dershoo less than 10ns. PIN CAPACITANCE (VCC = 3.3 V, Ta = 25°C, f = 1 MHz) Parameter Symbol Condition Min. Typ. Max. Unit age is to VSS Vc c+1 .) wh e width of ho ss t ns. -1.5V( pu dth of un t is Input C IN1 — — 12 BYTE# C IN2 VI = 0 V — — 200 Output C OUT V O = 0 V — — 12 pF

ELECTRICAL CHARACTERISTICS

= 3.0 V to 3.6 V, Ta = 0 to 70°C) Symbol Conditio Min. Typ. Max. Unit Cha racte (VCC Parame ter n Input leakage current I LI V I = 0 to — — 10 μA VCC Output leakage curren 0 to — — 10 μA t ILO V O = VCC ICCSC CE# = V — 10 μA CC — VCC power supply curr ICCST CE# = — — 1 mA ent (Standby ) VIH VCC power supply curr ICCA IL, O V IH f=5MH — — 50 mA ent ead) CE# = V E# = z VIH — 2.2 — V CC+0.5∗ V Input “H” level Input “L” level VIL — –0.5∗∗ — 0.6 V Output “H” level VOH I OH = –1 mA 2.4 — — V Output “L” level VOL I OL = 2 mA — — 0.4 V Voltage is relative to V SS. ∗ : V Max.) w se w ershoot when pu width of u rshoot is le 10ns (VCC = 3.0 V to 3.6 V, Ta = 0 to 70°C) ter Symbol Condition . Max. Unit c c+1.5V( hen pul idth of ov is less than 10ns. ∗∗ : -1.5V(Min.) lse nde ss than . AC Characteristics Parame Min Address cycle time t — — ns C 90 Address access time E# = VIL 90 ns tACC CE# = O — Page cycle time tPC — 30 — ns Pag — — 30 ns e access time tPAC CE# access time tCE OE# = V IL — 90 ns OE# # = VIL — 30 ns access time tOE CE tCHZ OE# = V IL 0 20 ns Output disable time tOHZ CE# = V IL 0 20 ns Output hold time tOH E# = OE# = V IL 0 — ns C Measurement conditions Output load Output 44SOP

TIMING CHART (READ CYCLE) Random Mode Read Cycle Address CE# OE# Dout Access tC tCE tOH tCHZ tOHZ Valid Data Hi-Z Hi-Z tOE tOH tACC tACC tC de Read Cycle Valid Data Page Access Mo tC A3 to A21 tCE tOE tACC tOH tCHZ tOHZ Hi-Z Hi-Z Dout tPAC tPC tPC A-1 to A2 (Byte mode) A0 to A2 (Word mode) CE# OE# tPAC

Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact ROHM’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). (Unit: mm)

Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact ROHM’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). (Unit: mm)

(Unit: m Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact ROHM’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).

REVISION HISTORY

No. Date Previous on Current Description Editi Edition FEDR27V6452L-02 21, 2005 ition 1 -01 Sep. – – Final ed FEDR27V6452L-02 t, 18, 2005 -02 Oc 1 1, 6 Add MR27V6452L- xxxMA FEDR27V6452L-02-03 Jun, 07,2007 1 1,2,5,9 Add MR27V6452L-xxxTA tC, tACC, tCE =100ns->90ns FEDR27V6452L-002-03 Oct,1,2008 – – Changed company logo and name to OKI SEMICONDUCTOR 10/

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