PQFN AMKOR | Alldatasheet
Document overview
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Technical content
DATA SHEET | POWER PRODUCTS f This package features ▷ Very-low parasitics and inductances resulting in world-class package level RDS(on) ▷ Outstanding EMI behavior and excellent thermal performance ▷ Space-saving designs ranging from 3 x 3 mm to 8 x 8 mm ▷ Numerous multi-die, multi-clip with wire variations available ▷ Capable of supporting numerous GaN applications/solutions ▷ Green materials: Pb-free plating and halogen-free mold compound
Applications
PQFN is suitable for medium-power applications, designed for low on-resistance and high-speed switching MOSFETs. f Servers f Portable electronic devices f Notebook PCs f Automotive f Telecom f Light Electric Vehicles (LEV) f Battery management f IoT Test Services Amkor offers full turnkey business for all power products, with the capability to test various types of power devices including MOSFETs, bipolar transistors, IGBTs, diodes and regulator IC/intelligent power devices. f Amkor power test systems ▷ ETS88 ▷ ETS364 ▷ ETS800 ▷ PowerTech (typically targeted for discrete solutions) ▷ Test capability examples ⨠ Static test (DC) ⨠ Dynamic test (AC, switching/Trr, capacitance/Rg) ⨠ Destruction test (inductive load/VSUS, I latch, surge, isolation/VIL) ⨠ Thermal resistance (ΔVDS, ΔmV, etc.) f Program generation/conversion f Failure analysis f Full complement of handling technology f Integrated marking, vision inspection and tape & reel services The PQFN (PowerQuad® Flat No-Lead) is a highly efficient space- saving package designed for a wide range of higher power applications. A “Smart Power” option in today’s power electronic world, the PQFN is a step above the standard low-power sawn QFN package, while being more flexible (IC control die integrated designs) than other power discrete packages. PQFN PROCESS HIGHLIGHTS f Die attach: 55 µm thin die pick up capability f Plating: 100% Matte Sn f Roughened copper leadframe with selective Ag f Interconnect: Cu clip technology for better thermal and electrical performance NEW DEVELOPMENTS f Wettable flank option available and well suited to the automotive market f Package available with dual exposed heatsink options f Thin wafer dicing with narrow saw streets
Visit amkor.com or email sales@amkor.com for more information. With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2019 Amkor Technology, Incorporated. All Rights Reserved. DS416A-EN Rev Date: 12/19 Standard Materials f Leadframe ▷ Roughened copper ▷ PPF (Pre-Plated Frame) f Die attach ▷ Solder paste for power MOSFETs and GaN ▷ Epoxy or die attach film for IC control die f Interconnect (3 options) ▷ Copper clip ▷ Multiple Cu wires ▷ Multiple Au wires f Mold compound ▷ Halogen-free Shipping f Tape and reel packing f Tray or canister f Barcode packing label f Drop ship PQFN Cross Sections PQFN Single Stack PQFN Dual Stack