DDR ATTEND | Alldatasheet
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SPECIFICATION AND PERFORMANCE SERIES: DDR Series FILE: DDR Series_spec DATE: 2013/01/04 The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -1 - Scope: This specification covers the requirements for product performance, test methods and quality assurance provisions of DDR Series. Performance and Descriptions: The product is designed to meet the electrical, mechanical and environmental performance requirements specification. Unless otherwise specified, all tests are performed at ambient environmental conditions. RoHS: All material in according with the RoHS environment related substances list controlled. MATERIAL AND FINISH INSULATOR Material Housing: LCP UL94V-0 Black CONTACT Material Contact: Phosphor Bronze C5210 Plating Contact Area: Gold Flash SHELL OR COVER Material Latch: Stainless Steel SUS301 Plating RATING Current Rating : 0.5A Voltage Rating : 25V AC Operating Temperature : -40～+85℃ Storage Temperature: -40℃ to +90℃
SPECIFICATION AND PERFORMANCE SERIES: DDR Series FILE: DDR Series_spec DATE: 2013/01/04 The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -2 - ELECTRICAL Item Requirement Test Condition Contact Resistance Initial: 60 mΩ Max. Final: 80 mΩ Max. Solder connectors on PCB and mate them together, measure by applying closed circuit current of 10mA maximum at open circuit voltage of 20mV maximum. Insulation Resistance Initial: 500MΩ Min. Final: 100MΩ Min. Mate connectors, apply 100V DC (rms.) between two adjacent contacts for one minutes.[MIL STD. 202F, Method 302] Dielectric Withstanding Voltage 125VAC for1 minutes. Leak current: 0.5 [mA] Max. Mate connectors, apply 125V AC (rms.) between two adjacent contacts for one minutes.[MIL STD. 202F, Method 301] MECHANICAL Item Requirement Test Condition Durability No Damage Solder connectors on PCB, then repeat mating and unmating 25 cycles along the mating axis. Contact Retention Force 1 N/pos. Min Place a connector on the push-pull machine, then apply a force on a contact head and push the contact to the opposite direction of the contact insertion at the speed of 25±3mm/min. Measure the force when the contact dislodges from insulator. Latch Spring Retention Force 8 N/Pos. Min Place a connector on the push-pull machine, then apply a force on a contact head and push the latch spring to the opposite direction of the latch spring insertion at the speed of 25±3mm/min. Measure the force when the latch spring dislodges from insulator.
SPECIFICATION AND PERFORMANCE SERIES: DDR Series FILE: DDR Series_spec DATE: 2013/01/04 The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -3 - Vibration No electrical discontinuity greater than 1 µ second shall occur. Solder connectors on PCB and mate them together, subject to the following vibration conditions, for a period of 2 hours in each of 3 mutually perpendicular axes, passing DC 1mA current during test. Amplitude: 1.52 mm P-P Sweep Frequency.: 10 - 55 - 10 Hz /min [MIL STD. 202F, Method 201A] Shock No electrical discontinuity greater than 1 μsec shall occur. Solder connectors on PCB and mate them together, subject to the following shock conditions, 3 shocks shall be period along 3 mutually perpendicular axes, passing DC 1mA current during the test. (Total of 18 shocks) Test Pulse : Half sinusoidal-Peak 490 m/s2 (50G) Duration: 11 msec. [MIL STD. 202F, Method 213A] ENVIRONMENTAL Item Requirement Test Condition Heat Resistance Detrimental damage affecting to the performance shall not occur. Solder connectors on PCB and mate them together, expose to 85±2℃ for 96hours. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 to 2 hours, after which the specified measurements shall be performed. [MIL STD. 202F, Method 108A]
SPECIFICATION AND PERFORMANCE SERIES: DDR Series FILE: DDR Series_spec DATE: 2013/01/04 The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -4 - Cold Resistance Detrimental damage affecting to the performance shall not occur. Solder connectors on PCB and mate them together, expose to -40±3℃ for 96hours. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 to 2 hours, after which the specified measurements shall be performed. Thermal Shock Detrimental damage affecting to the performance shall not occur. Solder connectors on PCB and mate them together, subject to the following conditions for 5 cycles. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 of 2 hours, after which the specified measurements shall be performed. Heat Cycle: a) –40℃ (30min.) b ) +85℃ (30min.) Transit time shall be within 3 min Humidity Detrimental damage affecting to the performance shall not occur. Solder connectors on PCB and mate them together, expose to the defined environment condition for 10 cycles. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room condition s for 1 of 2 hours, after which the specified measurements shall be performed.
SPECIFICATION AND PERFORMANCE SERIES: DDR Series FILE: DDR Series_spec DATE: 2013/01/04 The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -5 - Salt Spray Detrimental damage affecting to the performance shall not occur. Solder connectors on PCB and mate them together, subject to the following salt mist. Upon completion of the exposure period, salt deposits shall be removed by gentle wash or dip in running water, after which the specified measurements shall be performed. NaCl solution: a) Concentration: 5±1 % b) Spray time: 48±4h c) Ambient Temperature : 35±1℃ SO2 Gas Detrimental damage affecting to the performance shall not occur. Solder connectors on PCB and mate them together, expose to 10ppm SO2 gas, ambient temperature 25±2 ℃ for 24 Hours. SOLDER ABILITY Item Requirement Test Condition Solderability More then 95% of the dipped surface shall be wet evenly with new solder. The solder time of connector in the solder bath at 230±5℃ for 3±0.5 sec. After immersing solder tine in the flux for 5 to 10 seconds Solder heat resistance Detrimental damage affecting to the performance shall not occur. 180～200℃ for 120 seconds. Max 220℃ for 60 sec. Max Peak：255±5℃ 10 sec. Max
SPECIFICATION AND PERFORMANCE SERIES: DDR Series FILE: DDR Series_spec DATE: 2013/01/04 The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -6 -
SPECIFICATION AND PERFORMANCE SERIES: DDR Series FILE: DDR Series_spec DATE: 2013/01/04 The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -7 - Test Sequence 試験項目 Test Item Group A B C D E F G H I J K L M N
1 Examination of Product 1,5 1,4 1 1 1,5 1,5 1,5 1,5 1,5 1,6 1,5 1,5 1,3 1,3
2 Contact Resistance 2 3 2,4 2,4 2,4 2,4 2,4 2,4 2,4 2,4
3 Dielectric withstanding voltage 4
4 Insulation Resistance 3 5
5 Durability 2
6 Contact Retention Force 2
7 Latch Spring Retention Force 2
8 Vibration 3
9 Shock 3
10 Heat Resistance 3
11 Cold Resistance 3
12 Thermal Shock 3
13 Humidity 3
14 Salt Spray 3
15 SO2 Gas 3
16 Solderability 2
17 Solder Heat Resistance 2
Connector 1 2 2 5 2 2 2 2 2 2 2 2 2 2 Mating PCB (set) 1 2 2 2 2 2 2 2 2 2 2 2 2 2 Quantities of Samples