112I ATTEND | Alldatasheet
Document overview
- Manufacturer or author: Liu Robin
- PDF pages: 3
Technical content
The information contained herein is exclusive property of Attend. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -1 - SPECIFICATION AND PERFORMANCE Series 112I-series File 112I_Spec_1 Date 2020/07/28 Scope: This specification covers the requirements for product performance, test methods and quality assurance provisions of below P/N Description 112I-TA01 Micro SD socket, Push-Pull Type, w/card switch, w/Peg, Reel Performance and Descriptions: The product is designed to meet the electrical, mechanical and environmental performance requirements specification. Unless otherwise specified, all tests are performed at ambient environmental conditions. RoHS: All material in according with the RoHS environment related substances list controlled. MATERIALS NO. PART NAME DESCRIPTION
1 HOUSING LCP, black
2 CONTACT Phosphor bronze C5 191, G/F on Contact area , 50u” min. Tin plating on solder area, 50u” min. Nickel under plating over all 3 SHELL Brass C2680, 50u"min. Nickel plating RATING Rated Voltage 10V Rated Current 0.5A Operating Temperature -40~85°C Storage Temperature -40~85°C Durability 10,000 cycles ELECTRICAL Item Requirement Test Condition Contact Resistance Initial: 40 mΩ (Max) Solder connectors on PCB and mate them together, measure by applying closed circuit current of 10mA maximum at open circuit voltage of 20mV (max). (JIS C5402 5.4) Insulation Resistance Initial: 1000 MΩ(Min). Apply 500V DC between adjacent contacts, or contact and ground. (MIL-STD-202 METHOD 302)
The information contained herein is exclusive property of Attend. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -2 - Dielectric Withstanding Voltage No breakdown Mate connectors; apply 500V AC (rms.) between two adjacent for 1minute. (Trip current:1mA) (MIL-STD-202 METHOD 301) MECHANICAL Item Requirement Test Condition Durability Finish 1.Contact Resistance: 80mΩ (Max) 2.No Damage EIA-364-09, 10000 cycles time, mate and unmated connectors for 500 cycles per hour. Mating Force 40N Max. Measure forces necessary to mate connector. Rate:12.5mm/Minute Un-mating Force 0.5N Min. and 40N Max. Measure forces necessary to mate connector. Rate:12.5mm/Minute ENVIRONMENTAL Item Requirement Test Condition Humidity Finish 1. Contact Resistance: 80mΩ (Max) 2. Insulation Resistance: 100MΩ (Min) Humidity storage at +40ºC with 90~95% RH for 96 hours. Upon completion of the exposure period, the test specimens shall be conditions for 1 of 2 hours, then 10 mating cycles while. (EIA364-31) Heat Resistance Finish 1. Contact Resistance: 80mΩ (Max) 2. Insulation Resistance: 100MΩ (Min) Connectors solder on PCB, expose to 85°C for 96hrs. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 of 2hrs, after which the specified measurements shall be performed. (MIL-STD-202 METHOD 108) Cold Resistance Finish 1. Contact Resistance: 80mΩ (Max) 2. Insulation Resistance: 100MΩ (Min) Connectors solder on PCB, expose to -25°C for 96hrs. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 of 2hrs, after which the specified measurements shall be performed. (EIA364-59) Salt Spray Finish 1. Contact Resistance: 80mΩ (Max) 2 .No Damage 5 ± 1% salt solutions, at 35 ± 2ºC duration 48 hours. Connectors detached (MIL-STD-1344)
The information contained herein is exclusive property of Attend. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -3 - SOLDER ABILITY Item Requirement Test Condition Solder ability 95%of immersed area must show no voids , pin holes. Dip solder tails into the molten solder(held at 230±5°C) up to 0.5mm from the tip of tails for 3±0.5 seconds. (MIL-STD-202 METHOD 208) Resistance to soldering heat No melting, cracks or functional damage allowed All connectors designed for PCB soldering within this specification must be able to withstand the heat from solder oven according to the graph below. The cycle should be repeated twice. (MIL-STD-202 METHOD 210) Reflow Profile Preheating temperature: 150 ~ 200°C, 60~120 seconds Liquidus temperature (TL): 217°C, 60~150 seconds Peak temperature: 260°C Time within 5 °C of peak temperature (Tc): 255°C, 30seconds