112J-TXAR-R01

112J-TXAR-R01 ATTEND | Alldatasheet

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• Manufacturer or author: willis
• PDF pages: 5

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SPECIFICATION AND PERFORMANCE SERIES: 112J-TXAR-R01 FILE: 112J-TXAR-R01_spec DATE: 2013/10/31 The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -1 - Scope: This specification covers the requirements for product performance, test methods and quality assurance provisions of 112J-TXAR-R01. Performance and Descriptions: The product is designed to meet the electrical, mechanical and environmental performance requirements specification. Unless otherwise specified, all tests are performed at ambient environmental conditions. RoHS: All material in according with the RoHS environment related substances list controlled. MATERIAL AND FINISH INSULATOR Material Housing: LCP+35%GF, Color: Black Slider: LCP+35%GF, Color: Black CONTACT Material Phosphor Bronze Alloy (C5210R–EH) Plating Contact area: Gold flash or Gold 10 micro inches Solder area: Gold flash All under-plated Ductile Nickel 50 micro inches (Min.) SHELL OR COVER Material Shell: SUS304R-3/4H Spring : Piano Wire Drag Link : SUS304 Plating Contact area: Gold flash Solder area: Gold flash All under-plated Ductile Nickel 12 micro inches (Min.) RATING Current Rating: 0.5A (Max.)/(1PIN) Voltage Rating: 100V AC/DC Operating Temperature: -40℃ to +90℃ Storage Temperature: -40℃ to +90℃

SPECIFICATION AND PERFORMANCE SERIES: 112J-TXAR-R01 FILE: 112J-TXAR-R01_spec DATE: 2013/10/31 The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -2 - ELECTRICAL Item Requirement Test Condition Contact Resistance Initial: 50 mΩ (Max) Solder connectors on PCB and mate them together, measure by applying closed circuit current of 10mA maximum at open circuit voltage of 20mV (max). (JIS C5402 5.4) Insulation Resistance Initial: 1000 MΩ(Min). Apply 500V DC between adjacent contacts, or contact and ground. (MIL-STD-202 METHOD 302) Dielectric Withstanding Voltage No breakdown Mate connectors; apply 500V AC (rms.) between two adjacent for 1minute. (Trip current:1mA) (MIL-STD-202 METHOD 301) MECHANICAL Item Requirement Test Condition Contact Retention Force 2.5N per pin (Min.) Place a connector on the push-pull machine, then apply a force on a contact head and push the contact to the opposite direction of the contact insertion at the speed of 25 ± 3mm/min. (EIA364-29) Durability Finish 1.Contact Resistance: 80mΩ (Max) 2.No Damage Solder connectors on PCB, then place them on the pull-push machine, and repeat mating and un-mating 10,000cycles repeatedly at a rate of 400~600 cycles/hour. (EIA364-09)

SPECIFICATION AND PERFORMANCE SERIES: 112J-TXAR-R01 FILE: 112J-TXAR-R01_spec DATE: 2013/10/31 The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -3 - Vibration Finish 1. No electrical discontinuity more than 0.1μs. 2 .No Damage 3. Contact Resistance: 80mΩ (Max) Mate dummy card and subject to the following vibration conditions, for a period of 30 minutes in each of 3 mutually perpendicular axis, passing DC 1 mA during the test. Amplitude: 1.52 mm P-P or 19.6 m/s2 Frequency: 10-55-10Hz Shall be traversed in 1minute. (MIL-STD-202 METHOD 201) Shock Finish 1. No electrical discontinuity more than 0.1μs. 2 .No Damage 3. Contact Resistance: 80mΩ (Max) Solder connectors on PCB and mate them together, subject to he following shock conditions, 3 shocks shall be period along 3 mutually perpendicular axis, passing DC 1mA current during the test. 1 axis, plus-minus direction, core 3times.(total:18times) 490m/s2 (MIL-STD-202 METHOD 213) Card Insertion / Eject Force 9.8N(Max) Push the card at the speed rate 25 ± 3 mm/minute. Card Release Force 2N+/-1N From the state of the card lock, Pull the card at the speed rate 25 ± 3 mm/minute. Push in strength No Damage The card inserted in positive and the opposite direction and the load of 19.6N is added ENVIRONMENTAL Item Requirement Test Condition Humidity Finish 1. Contact Resistance: 80mΩ (Max) 2. Insulation Resistance: 100MΩ (Min) Humidity storage at +40ºC with 90~95% RH for 96 hours. Upon completion of the exposure period, the test specimens shall be conditions for 1 of 2 hrs, then 10 mating cycles while. (EIA364-31)

SPECIFICATION AND PERFORMANCE SERIES: 112J-TXAR-R01 FILE: 112J-TXAR-R01_spec DATE: 2013/10/31 The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -4 - Temperature Cycle Finish 1. Contact Resistance: 80mΩ (Max) 2. Insulation Resistance: 100MΩ (Min) Stage Temp Time t1 - 55℃ 30 min t2 - 55~+90 ℃ 3 min t3 + 90 ℃ 30 min t4 +90~ -55 ℃ 3 min Test time: 6 cycles (JIS C0025) Heat Resistance Finish 1. Contact Resistance: 80mΩ (Max) 2. Insulation Resistance: 100MΩ (Min) Solder connectors on PCB and mate them together, expose to 90 ± 20℃ for 96hrs. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 of 2hrs, after which the specified measurements shall be performed. (MIL-STD-202 METHOD 108) Cold Resistance Finish 1. Contact Resistance: 80mΩ (Max) 2. Insulation Resistance: 100MΩ (Min) Solder connectors on PCB and mate them together, expose to -55 ± 30C for 96hrs. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 of 2hrs, after which the specified measurements shall be performed. (EIA364-59) Salt Spray Finish 1. Contact Resistance: 80mΩ (Max) 2 .No Damage 5 ± 1% salt solutions, at 35 ± 2ºC duration 48 hours. Connectors detached (MIL-STD-1344)

SPECIFICATION AND PERFORMANCE SERIES: 112J-TXAR-R01 FILE: 112J-TXAR-R01_spec DATE: 2013/10/31 The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -5 - SOLDER ABILITY Item Requirement Test Condition Solder ability 95%of immersed area must show no voids , pin holes. Dip solder tails into the molten solder(held at 230±5℃) up to 0.5mm from the tip of tails for 3±0.5 seconds. (MIL-STD-202 METHOD 208) Resistance to soldering heat No melting, cracks or functional damage allowed All connectors designed for PCB soldering within this specification must be able to withstand the heat from solder oven according to the graph below. The cycle should be repeated twice. (MIL-STD-202 METHOD 210) Peak temperature: 260℃ Soldering temperature: 230℃ Preheating temperature: 150-180℃