104D-RCA0-RA1

104D-RCA0-RA1 ATTEND | Alldatasheet

Document overview

• Manufacturer or author: Liu Robin
• PDF pages: 4

Technical content

The information contained herein is exclusive property of Attend. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -1 - SPECIFICATION AND PERFORMANCE Series 104D-RCA0-RA1 File 104D-RCA0-RA1_SPEC Date 2014/03/14 Scope: This specification covers the requirements for product performance, test methods and quality assurance provisions of 104D-RCA0-RA1 Performance and Descriptions: The product is designed to meet the electrical, mechanical and environmental performance requirements specification. Unless otherwise specified, all tests are performed at ambient environmental conditions. RoHS: All material in according with the RoHS environment related substances list controlled. MATERIALS NO. PART NAME DESCRIPTION

1 HOUSING

LCP, Color Black 2 SLIDER CAM

3 PLASTIC FRAME

4 CONTACT-SD

Phosphor Bronze Alloy 0.15T, 5u”min Gold plating on contact area, 80u”min Tin plating on solder area, 30u”min Nickel under plating over all.

5 PROTECT CONTACT

6 PROTECT CONTACT AND

7 DETECT CONTACT

8 HOLDDOWN CONTACT Brass, 0.2T, 80u ” min. Tin plating on solder tail area, 30u ” min. Nickel under plating overall

9 SHELL

Stainless 0.2T

10 CARD LOCK

11 CAM PIN Stainless wire, Φ0.4 12 SPRING Piano wire, Φ0.25, 50u” min. Nickel under plating over all RATING Voltage Rating 100V AC/DC Current Rating 0.5A (Max.)/(1PIN) Operating Temperature -40°C to + 85°c Storage Temperature -40°C to +85°C Durability 10,000 cycles

The information contained herein is exclusive property of Attend. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -2 - ELECTRICAL Item Requirement Test Condition Contact Resistance Initial: 80 mΩ (Max) Solder connectors on PCB and mate them together, measure by applying closed circuit current of 10mA maximum at open circuit voltage of 20mV (max). (JIS C5402 5.4) Insulation Resistance Initial: 1,000MΩ(Min). Apply 500V DC between adjacent contacts, or contact and ground. (MIL-STD-202 METHOD 302) Dielectric Withstanding Voltage No breakdown Mate connectors; apply 500V AC(rms.) between two adjacent for 1minute. (Trip current:1mA) (MIL-STD-202 METHOD 301) MECHANICAL Item Requirement Test Condition Contact Retention Force 2.5N per pin (Min.) Place a connector on the push-pull machine, then apply a force on a contact head and push the contact to the opposite direction of the contact insertion at the speed of 25 ± 3mm/min. (EIA364-29) Durability Contact Resistance: 100mΩ(Max) No Damage Solder connectors on PCB, then place them on the pull-push machine, and repeat mating and un-mating 10,000cycles repeatedly at a rate of 400~600 cycles/hour. (EIA364-09) Vibration Finish 1. No electrical discontinuity more than 0.1μs. 2 .No Damage 3.Contact Resistance 100mΩ(Max) Mate dummy card and subject to the following vibration conditions, for a period of 30 minutes in each of 3 mutually perpendicular axis, passing DC 1 mA during the test. Amplitude: 1.52 mm P-P or 19.6 m/s2 Frequency: 10-55-10Hz Shall be traversed in 1minute. (MIL-STD-202 METHOD 201) Shock Finish 1. No electrical discontinuity more than 0.1μs. 2 .No Damage 3.Contact Resistance 100mΩ(Max) Solder connectors on PCB and mate them together, subject to the following shock conditions, 3 shocks shall be period along 3 mutually perpendicular axis, passing DC 1mA current during the test. 1 axis, plus-minus direction, core 3 times. (total:18times) 490m/s2 (MIL-STD-202 METHOD 213) Card Insertion / Eject Force 9.8N(Max) Push the card at the speed rate 25 ± 3mm/minute. Card Release Force 4N+/-1N From the state of the card lock, Pull the card at the speed rate 25 ± 3 mm/minute. Push in strength No Damage The card inserted in positive and the opposite direction and the load of 30N is added

The information contained herein is exclusive property of Attend. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -3 - ENVIRONMENTAL Item Requirement Test Condition Temperature Cycle Finish 1.Contact Resistance 100mΩ(Max) 2.Insulation Resistance 100MΩ(Min) Stage Temp Time t1 -55°C 30 min t2 -55~+90°C 3 min t3 +90°C 30 min t4 +90~-55°C 3 min Test time: 6 cycles (JIS C0025) Heat Resistance Finish 1. Contact Resistance: 100mΩ(Max) 2.Insulation Resistance 100MΩ(Min) Solder connectors on PCB and mate them together, expose to 90 ± 2°C for 96hrs. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 of 2hrs, after which the specified measurements shall be performed. (MIL-STD-202 METHOD 108) Cold Resistance Finish 1. Contact Resistance: 100mΩ(Max) 2. Insulation Resistance 100MΩ(Min) Solder connectors on PCB and mate them together, expose to -55 ± 3°C for 96hrs. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 of 2hrs, after which the specified measurements shall be performed. (EIA364-59) Humidity Finish 1. Contact Resistance: 100mΩ(Max) 2. Insulation Resistance 100MΩ(Min) Humidity storage at +40°C with 90~95% RH for 96 hours. Upon completion of the exposure period, the test specimens shall be conditions for 1 of 2 hrs, then 10 mating cycles while. (EIA364-31) Salt Spray Finish 1. Contact Resistance: 100mΩ(Max) 5 ± 1% salt solutions, at 35 ± 2°C duration 48 hours. Connectors detached (MIL-STD-1344) SOLDER ABILITY Item Requirement Test Condition Solder ability 95% of immersed area must show no voids, pin holes. DIP solder tails into the molten solder (held at 230±5°C) up to 0.5mm from the tip of tails for 3±0.5 seconds. (MIL-STD-202 METHOD 208) Resistance to soldering heat No melting, cracks or functional damage allowed All connectors designed for PCB soldering within this specification must be able to withstand the heat from solder oven according to the graph below. The cycle should be repeated twice. (MIL-STD-202 METHOD 210)

The information contained herein is exclusive property of Attend. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -4 - Reflow Profile Preheating temperature: 150 ~ 200°C, 60~120 seconds Liquidus temperature (TL): 217°C, 60~150 seconds Peak temperature: 260°C Time within 5 °C of peak temperature (Tc): 255°C, 30seconds