D2PAK AMKOR | Alldatasheet
Document overview
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Technical content
Applications
D2PAK is suitable for high-power applications (over 100A available), designed for low on-resistance and high-speed switching MOSFETs. f Motor drivers f Power supply circuits f DC-DC converters f Key applications for automotive in body, safety and lighting Reliability Qualification Amkor packages are assembled with proven reliable semiconductor materials. All reliability testing includes: f JEDEC standard pre-conditioning except for high temperature storage f 85°C/85% RH, 168 hours, IR reflow 260°C 3X f H3TRB: 85°C/85% RH, 1000 hours f uHAST: 130°C/85% RH, 96 hours f Temp cycle: -55°C to 150°C, 1000 cycles f High temp storage: 150°C, 1000 hours Test Services Amkor offers full turnkey business for all power discrete products with the capability to test various types of power devices including MOSFETs, intelligent power devices, etc. f Power discrete test capability ▷ DC ▷ Capacitance *1 ▷ Rg *1 ▷ Avalanche test ▷ Thermal resistance f Program conversion f Electrical failure analysis f Integrated test, marking, vision inspection and tape & reel services *1 Sampling test only D2PAK follows the JEDEC standard (TO-263) for high-power discrete products. D2PAK (TO-263) DATA SHEET | POWER PRODUCTS
FEATURES
f Low on-resistance and high-current density due to thick Al wirebonding f Full turnkey available from wafer saw through test and packing f Green materials: Pb-free plating and halogen-free mold compound UNDER DEVELOPMENT f Environmentally friendly die attach Pb-free solder PROCESS HIGHLIGHTS f Interconnect: Thick Al wirebonding technology f Plating: 100% Matte Sn f Marking: Laser mark f 100% Auto appearance check for automotive grade
Visit amkor.com or email sales@amkor.com for more information. With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2020 Amkor Technology, Incorporated. All Rights Reserved. DS417A-EN Rev Date: 05/20 D2PAK (TO-263) Shipping f Tape and reel packing ▷ 800 pcs per reel ▷ Tape width: 24 mm ▷ Reel Φ = 330 mm f Barcode packing label Package Outline Drawing Standard Materials f Leadframe: Bare copper f Die attach: Pb solder f Interconnect: Al wire f Mold compound: Halogen-free Cross Section D2PAK 7L D2PAK Die Die attach material Mold compound A B Leadframe Al wire C D E C D A B E