AS393,393A BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Wide Supply V oltage Range - Single Supply: 2.0V to 36V - Dual Supplies: ±1.0V to ±18V
  • Low Supply Current Drain: 0.6mA
  • Low Input Bias Current: 25nA (Typical)
  • Low Input Offset Current: ±5.0nA (Typical)
  • Low Input Offset V oltage: 1.0mV (Typical)
  • Input Common Mode V oltage Range Includes Ground
  • Differential Input V oltage Range Equals to the Power Supply V oltage
  • Low Output Saturation V oltage: 200mV at 4mA
  • Open Collector Output

Applications

  • Battery Charger
  • Cordless Telephone
  • Switching Power Supply
  • DC-DC Module
  • PC Motherboard
  • Communication Equipment

Figure 1. Package Types of AS393/393A

LOW POWER LOW OFFSET VOLTAGE DUAL COMPARATORS AS393/393A BCD Semiconductor Manufacturing Limited Data Sheet Jan. 2013 Rev. 2. 3

Ordering Information

Lead Free Green Lead Free Green SOIC-8 -40 to 85oC AS393M-E1 AS393M-G1 AS393M-E1 AS393M-G1 Tube AS393MTR-E1 AS393MTR-G1 AS393M-E1 AS393M-G1 Tape & Reel AS393AM-E1 AS393AM-G1 AS393AM-E1 AS393AM-G1 Tube AS393AMTR-E1 AS393AMTR-G1 AS393AM-E1 AS393AM-G1 Tape & Reel DIP-8 -40 to 85 oC AS393P-E1 AS393P-G1 AS393P-E1 AS393P-G1 Tube AS393AP-E1 AS393AP-G1 AS393AP-E1 AS393AP-G1 Tube TDIP-8 -40 to 85 oC AS393PT-G1 AS393PT-G1 Tube TSSOP-8 -40 to 85oC AS393GTR-E1 AS393GTR-G1 EG3C GG3C Tape & Reel MSOP-8 -40 to 85oC AS393MMTR-G1 AS393MM-G1 Tape & Reel BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with "G1" suffix are available in green packages. Circuit Type Package E1: Lead Free G1: Green AS393 TR: Tape and Reel Blank: Tube M: SOIC-8 P: DIP-8 Blank: AS393 A: AS393A G: TSSOP-8 MM: MSOP-8 PT: TDIP-8

LOW POWER LOW OFFSET VOLTAGE DUAL COMPARATORS AS393/393A BCD Semiconductor Manufacturing Limited Data Sheet Jan. 2013 Rev. 2. 3 Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Supply V oltage VCC 40 V Differential Input V oltage VID 40 V Input V oltage VIN -0.3 to 40 V Input Current (VIN < -0.3V) (Note 2) I IN 50 mA Output Short-Circuit Current to Ground Continuous Power Dissipation (TA=25oC) PD DIP-8 780 mW SOIC-8 660 TSSOP-8 570 MSOP-8 450 Operating Junction Temperature T J 150 oC Storage Temperature TSTG -65 to 150 oC Lead Temperature (Soldering, 10 sec) TLEAD 260 oC Parameter Symbol Min Max Unit Supply V oltage V CC 23 6 V Operating Temperature Range T A -40 85 oC Recommended Operating Conditions Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional op eration of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Max- imum Ratings" for extended periods may affect device reliability. Note 2: This input current will only exist when the voltage at any of the input leads is driven negative. It is due to the collector-base junction of the input PNP transistors becoming forward biased and thereby acting as input diode clamps. In addition to this diode action, there is also lateral NPN parasitic transistor action on the IC chip. This transistor action can cause the output voltages of the comparators to go to the V+ voltage level (or to ground for a large overdrive) for the time duration that an input is dr iven negative. This is not destructive and normal output states will re-establish when the input voltage, which was negative, again returns to a value greater than -0.3 V DC (at 25oC).

LOW POWER LOW OFFSET VOLTAGE DUAL COMPARATORS AS393/393A BCD Semiconductor Manufacturing Limited Data Sheet Jan. 2013 Rev. 2. 3

Electrical Characteristics

Parameter Conditions Min Typ Max Unit Input Offset V oltage VO=1.4V , RS=0Ω, VCC=5V to 30V AS393 1.0 5.0 mV AS393A 1.0 3.0 Input Bias Current IIN+ or IIN- with output in Linear Range, VCM=0V 25 250 nA 400 Input Offset Current IIN+-IIN -, VCM=0V 5.0 50 nA 200 Input Common Mode V oltage Range (Note 4) VCC=30V 0 VCC -1.5 V Supply Current RL=∞ VCC=5V 0.6 1.0 mA VCC=30V 0.7 1.7 V oltage Gain VCC=15V , RL≥15kΩ, VO=1V to 11V 50 200 V/mV Large Signal Response Time V IN =TTL Logic Swing, VREF=1.4V , VRL=5V , RL=5.1k 200 ns Response Time VRL=5V , RL=5.1K 1.3 μs Output Sink Current VIN-=1V , VIN+=0, VO=1.5V 6.0 16 mA Output LeackageCurrent VIN-=0V , VIN+=1V , VO=5V 0.1 nA VIN-=0V , VIN+=1V , VO=30V 1 μA Saturation V oltage VIN-=1V , VIN+=0, ISINK≤4mA 200 400 mV 500 Thermal Resistance (Junction to Case) DIP-8 93 oC/WSOIC-8 138 Limits in standard typeface are for T A=25oC, bold typeface applies over T A=-40oC to 85 oC (Note 3), V CC=5V , GND=0V , unless otherwise specified. Note 3: These specifica tions are limited to -40 oC≤ TA ≤85oC. Limits over temperatur e are guaranteed by design, but not tested in production. Note 4: The input common-mode voltage of either input signal voltage should not be allowed to go negatively by more than 0.3V (at 25oC). The upper end of the common-mode voltage range is VCC-1.5V (at 25oC), but either or both inputs can go to +36V without damages, independent of the magnitude of the VCC.

LOW POWER LOW OFFSET VOLTAGE DUAL COMPARATORS AS393/393A BCD Semiconductor Manufacturing Limited Data Sheet Jan. 2013 Rev. 2. 3 Mechanical Dimensions DIP-8 Unit: mm(inch) R0.750(0.030) 0.254(0.010)TYP 0.130(0.005)MIN 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014) 7.620(0.300)TYP 0.700(0.028) 9.000(0.354) 9.600(0.378) 3.710(0.146) 4.310(0.170) 3.000(0.118) 3.600(0.142) 0.360(0.014) 0.560(0.022) 2.540(0.100) TYP 6.200(0.244) 6.600(0.260) 3.200(0.126) 3.600(0.142) 0.510(0.020)MIN Φ3.000(0.118) Depth 0.100(0.004) 0.200(0.008) 1.524(0.060) TYP Note: Eject hole, oriented hole and mold mark is optional.

LOW POWER LOW OFFSET VOLTAGE DUAL COMPARATORS AS393/393A BCD Semiconductor Manufacturing Limited Data Sheet Jan. 2013 Rev. 2. 3 Mechanical Dimensions (Continued) TDIP-8 Unit: mm(inch) 1.500(0.059) 1.700(0.067) 3.300(0.130)MAX 0.600(0.024) 0.800(0.031) 0.940(0.037) 1.040(0.041) 1.470(0.058) 1.670(0.066) 2.540(0.100) BCS 3.100(0.122) 3.500(0.138) 7.570(0.298) 8.200(0.323) 8.200(0.323) 9.400(0.370) 9.150(0.360) 6.450(0.254) 0.500(0.020)MIN 0.390(0.015) 0.550(0.022) Note: Eject hole, oriented hole and mold mark is optional.

LOW POWER LOW OFFSET VOLTAGE DUAL COMPARATORS AS393/393A BCD Semiconductor Manufacturing Limited Data Sheet Jan. 2013 Rev. 2. 3 Mechanical Dimensions (Continued) SOIC-8 Unit: mm(inch) R0.150(0.006) R0.150(0.006) 1.000(0.039) 0.330(0.013) 0.510(0.020) 1.350(0.053) 1.750(0.069) 0.100(0.004) 0.300(0.012) 0.900(0.035) 0.800(0.031) 0.200(0.008) 3.800(0.150) 4.000(0.157) 20:1 D 1.270(0.050) TYP 0.190(0.007) 0.250(0.010) D 5.800(0.228) 6.200(0.244) 0.675(0.027) 0.725(0.029) 0.320(0.013) 0.450(0.017) 0.800(0.031) 4.700(0.185) 5.100(0.201) Note: Eject hole, oriented hole and mold mark is optional.

LOW POWER LOW OFFSET VOLTAGE DUAL COMPARATORS AS393/393A BCD Semiconductor Manufacturing Limited Data Sheet Jan. 2013 Rev. 2. 3 Mechanical Dimensions (Continued) TSSOP-8 Unit: mm(inch) 4.300(0.169) 0.400(0.016) 0.190(0.007) 0.300(0.012) SEE DETAIL A DETAIL A 2.900(0.114) 0.050(0.002) MAX 1.950(0.077) 12 ° TOP & BOTTOM R0.090(0.004) 0.450(0.018) 0.750(0.030) 1.000(0.039) 6.400(0.252) 0.800(0.031) 1.050(0.041) 0.090(0.004) 0.200(0.008) GAGE PLANE SEATING PLANE 0.250(0.010) 3.100(0.122) 4.500(0.177) TYP 0.650(0.026) TYP TYP TYP R0.090(0.004) REF Note: Eject hole, oriented hole and mold mark is optional.

LOW POWER LOW OFFSET VOLTAGE DUAL COMPARATORS AS393/393A BCD Semiconductor Manufacturing Limited Data Sheet Jan. 2013 Rev. 2. 3 Mechanical Dimensions (Continued) MSOP-8 Unit: mm(inch) 4.700(0.185) 0.650(0.026)TYP 5.100(0.201) 0.410(0.016) 0.650(0.026) 0.000(0.000) 0.200(0.008) 0.300(0.012)TYP 3.100(0.122) 2.900(0.114) 0.800(0.031) 1.200(0.047) 3.100(0.122) 2.900(0.114) 0.150(0.006)TYP 0.760(0.030) 0.970(0.038) Note: Eject hole, oriented hole and mold mark is optional.

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277