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Technical content

Features

  • Mutual Capacitive Touch Sensing
  • Dual Power Supply: 2.8V to 3.6V Operation V oltage; 1.6V to 2.0V Operation V oltage
  • Up to 38/30 Drive Lines and 22/17 Sense Lines
  • Dedicated Internal Two-wire Serial Control Bus I2C and UART between CS5519 and Host
  • Single-end Integrator with Programmable Gain Control and Offset Control
  • Multiplexed Analog Digitization with Two 8-bit Resolution Odd/Even Scan SAR ADCs and Its Dedicated 2X to 8X Accumulator XSRAM Buffers Features (Continued)
  • Single Cycle 8051 CPU Core, Maximum Opera- ting Clock up to 24MHz from IOSC (Zero Wait State); 48MHz from IOSC(With Wait State) 4MHz to 48MHz Internal Oscillator (IOSC) 64K-byte Flash ROM 256-byte Internal SRAM and 12032-byte XSRAM Extra XSRAMs for AFE:  896×12-bit×2 XSRAM for 8-bit SAR ADC  896×8-bit XSRAM for 8-bit Parasitical Capacitor Compensator Two 16-bit Timers T0/T1 and One 16-bit ECT Timer T2 One I 2C Slave Controller and One I 2C Master Controller Shared with the Same Port  With Asynchronous I 2C Slave Address Detection Logic Design

4 General Purpose GPIO Pins

One External Interrupt Pin One UART Data Transfer Output Pin

  • ISP/IAP via I²C Port
  • Operation Temperature Range: -40°C to 95°C
  • Package Types: QFN-7×7-56 and QFN-8×8-68
  • RoHS Compliance Operating Mode: Mode Description Power-down No scan with power-down mode Standard Higher scan rate when fingers are on panel, IOSC can up to 4MHz to 48MHz

Applications

  • Mobile Phones
  • Personal Digital Assistants
  • Smart Hand-held or Gaming Devices

Figure 1. Package Types of CS5519

Figure 2. Pin Configuration of CS5519 (56-pin) (Top View)

69 VSS

Figure 3. Pin Configuration of CS5519 (68-pin) (Top View)

Enhanced Multi-touch Capacitive Touch Screen Controller CS5519 Apr. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited Pin Description Pin Number Pin Name Pin Type Pin Function QFN-7×7 -56 QFN-8×8 -68 1 1 P1.7/ TXD1/ PINT0.1/ EXTCLKIN/ I/O Port 1.7 GPIO 8051 P1.7 GPIO TXD1 This pin also can be configured as TXD of UART 1 PINT0.1 This pin also can be configured as the expanded INT0 interrupt External Clock Input External clock input source. T0 Timer 0 Input This pin also can be configured as Timer 0 input 2 2 TESTEN I Test Mode Enable High Active This pin has an internal weakly pull low resistor connected. If it is connected high, the chip enters into Test Mode condition 3 3 P1.2/SDA (open- drain) I/O Port 1.2 GPIO 8051 P1.2 GPIO SDA This pin also can be confi gured as the SDA signal of the I2C master or I2C slave controller. In this operation mode, this pin should also be configured as bi-directional I/O with open-drain output 4 4 P1.3/SCL (open- drain) I/O Port 1.3 GPIO 8051 P1.3 GPIO SCL This pin also can be config ured as the SCL signal of the I 2C master or I 2C slave controller. In I 2C master mode, this pin should be configured as open-drain output. In I 2C slave, this pin should be configured as input only 5 5 RSTN I Reset Low Active Typically connect a resistor to VDD18 and a capacitor to VSS Low asserted and threshold at 0.5×V DD18. When forced low, the chip enters into reset condition This pin should not be connected to any level above VDD18

Enhanced Multi-touch Capacitive Touch Screen Controller CS5519 Apr. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited Pin Description (Continued) Pin Number Pin Name Pin Type Pin Function QFN-7×7 -56 QFN-8×8 -68 - 6 to 13 D38 to D31 O, A D38, D37, D36, D35, D34, D33, D32, D31 Driving line 38 to line 31 6 to 35 14 to 43 D30 to D1 O, A D30, D29, D28, D27, D26, D25, D24, D23, D22, D21, D20, D19, D18, D17, D16, D15, D14, D13, D12, D11, D10, D9, D8, D7, D6, D5, D4, D3, D2, D1 Driving line 30 to line 1 36 44 P3.6/ RXD1 (open- drain) I/O Port 3.6 GPIO 8051 P3.6 GPIO This pin should be configured as open-drain output and the input range can be 1.8V to 3.3V RXD1 This pin also can be configured as RXD of UART 1 37 69 VSS Power Ground Voltage. 0V 38 45 VDD18 Power Internal Regulator Output. 1.6V to 2.0V Typical decoupling capacitors of 0.1 F and 10 F should be connected between VDD18 and VSS 39 46 VDD33 Power Supply Voltage. 2.8V to 3.6V A good decoupling capacitor between VDD33 and VSS is critical for good performance 40 to 56 47 to 63 S1 to S17 I, A S1, S2, S3, S4, S5, S6, S7, S8, S9, S10, S11, S12, S13, S14, S15, S16, S17 Sensing line 1to line 17 - 64 to 68 S18 to S22 I, A S18, S19, S20, S21, S22 Sensing line 18 to line 22

Figure 4. Main AFE I/O Pin Assignment and Whole Chip’s Functional Block Diagram

Enhanced Multi-touch Capacitive Touch Screen Controller CS5519 Apr. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited G1: Green Blank: Tray TR: Tape & Reel

Ordering Information

Range Part Number Marking ID Packing Type QFN-7x7-56 -40 to 95°C CS5519CJI1FN-G1 CS5519CJ-I1 Tray CS5519CJI1FNTR-G1 CS5519CJ-I1 Tape & Reel -40 to 85°C CS5519CJI2FN-G1 CS5519CJ-I2 Tray CS5519CJI2FNTR-G1 CS5519CJ-I2 Tape & Reel -40 to 80°C CS5519CJI3FN-G1 CS5519CJ-I3 Tray CS5519CJI3FNTR-G1 CS5519CJ-I3 Tape & Reel QFN-8x8-68 -40 to 95°C CS5519AJI1FN-G1 CS5519AJ-I1 Tray CS5519AJI1FNTR-G1 CS5519AJ-I1 Tape & Reel -40 to 85°C CS5519AJI2FN-G1 CS5519AJ-I2 Tray CS5519AJI2FNTR-G1 CS5519AJ-I2 Tape & Reel -40 to 80°C CS5519AJI3FN-G1 CS5519AJ-I3 Tray CS5519AJI3FNTR-G1 CS5519AJ-I3 Tape & Reel BCD Semiconductor's Pb-free products, as designated wi th "G1" in the part number, are RoHS compliant and green. Package FN: QFN-7x7-56 /QFN-8x8-68 CJ: 56-pin AJ: 68-pin I1: -40 to 95°C I2: -40 to 85°C I3: -40 to 80°C

Enhanced Multi-touch Capacitive Touch Screen Controller CS5519 Apr. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited CS5519 Support 7” to 13” Touch Panel, Listed Below: PN TX/ RX Multi - Touch Package Panel size CS5519 30/17 10 point 100HZ QFN-7x7-56 7” to 10” 38/22 10 point 100HZ QFN-8x8-68 8” to 13” Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Supply V oltage 1 V DD 2.8 to 3.6 V Supply V oltage 2 V DD18 1.6 to 2.0 V Analog Input V oltage (Other pins) V DDA -0.3 to V DD+0.3 V Logic Input V oltage V DDD -0.3 to V DD+0.3 V Power Dissipation P D 250 mW Maximum Junction Temperature T J 100 °C Operating Temperature T OP -40 to 95 °C Storage Temperature T STG -65 to 150 °C Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional op eration of the device at these or any other conditions beyond those indicated under “Recommended Operating Co nditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability.

Enhanced Multi-touch Capacitive Touch Screen Controller CS5519 Apr. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

Electrical Characteristics

DA/AC Characteristics for AFE TA=–40°C to 95°C, VDD=3.3V, I2C bus frequency=400kHz, unless otherwise noted. Parameter Symbol Test Condition Min Typ Max Unit ADC DC Accuracy Resolution 8 Bits No Missing Codes Standard/Fast 6 8 Bits Integral Linearity Error INL Standard/Fast ±2 LSB Differential Linearity Error Offset Error Gain Error DNL External V REF LSB LSB LSB Analog Input Full-scale Input Span Absolute Input Range 0 -0.2 VDD VDD+0.2 V V ADC Sampling Dynamics Throughput Rate 500 ksps Reference Input Input V oltage Range 1.8 V DD V Switched-capacitor Integrator Output V oltage Range 0.3 V DD-0.3 V Integrator Capacitor C INT 12 pF Digital Input/Output Logic Family CMOS Input High V oltage V IH 0.7×V DD V DD+0.3 V Input Low V oltage V IL -0.3 0.3×V DD V Output High V oltage V OH 0.8×V DD V Output Low V oltage V OL 0.4 V Input High V oltage for P3.6 (GPIO18) VIH18 0.7×V DD18 V DD18+0.3 V Input Low V oltage for P3.6 (GPIO18) VIL18 -0.3 0.3×V DD18 V Output High V oltage for P3.6 (GPIO18) VOH18 0.8×V DD18 V Output Low V oltage for P3.6 (GPIO18) VOL18 0.2×V DD18 V Power Supply Supply V oltage V DD Operating voltage 2.8 3.6 V Quiescent Current Standard mode: IOSC=4MHz to 48MHz TBD mA Power-down mode 10 A Temperature Range Specified Performance -40 95 °C

Enhanced Multi-touch Capacitive Touch Screen Controller CS5519 Apr. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited Electrical Characteristics (Continued) DA/AC Characteristics for AFE TA=–40°C to 95°C, VDD=3.3V, I2C bus frequency=400kHz, unless otherwise noted. Parameter Symbol Test Condition Min Typ Max Unit 3.3V-to-1.8V LDO Internal 1.8V Regulator Output VDD18, 15mA 1.6 1.8 2.0 V Output V oltage Trimming Internal OSC Frequency 4 48 MHz Operating Current Operating frequency=12MHz 50 A Frequency Trimming Level -10/20/30 0 10/20/30 %

Enhanced Multi-touch Capacitive Touch Screen Controller CS5519 Apr. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited Electrical Characteristics (Continued) DA/AC Characteristics for 8051 CPU Core, Digital GPIO pins, Digital Peripherals, and IOSC TA=–40°C to 95°C, VDD=2.8V to 3.6V, unless otherwise noted. Parameter Symbol Mi n Typ Max Unit Note Power Supply Current Normal Mode Supply Current Using IOSC up to 48MHz IDD, normal IOSC1 25 mA 2 Normal Mode Supply Current Using IOSC=4MHz IDD, normal IOSC2 2.9 mA 2 PMM Mode Supply Current Using IOSC up to 48MHz IDD, PMM IOSC1 6 mA 2 PMM Mode Supply Current Using IOSC=4MHz IDD, PMM IOSC2 1.5 mA 2 Idle Mode Supply Current Using IOSC up to 48MHz IDD, idle IOSC1 3 mA 2 Stop Mode Supply Current Using IOSC Keeps Low IDD, stop 3 A 2 Digital GPIO Characteristics Input High V oltage V IH 2 3.6 V 3 Input Low V oltage V IL -0.3 0.8 V 3 Output High V oltage V OH 2.4 V 3 Output Low V oltage V OL 0.4 V 3 High Level Output Current @VOH(min) IOH(2mA) 3.0 7.87 12.9 mA IOH(4mA) 7.7 15.6 25.8 mA Low Level Output Current @VOL(max) IOL(2mA) 3.4 5.4 7.4 mA IOL(4mA) 6.7 10.7 14.7 mA Input Pull Up Resistance R PU 34 74 k 3 Input Pull Down Resistance R PD 29 86 k 3 Input Low to High Level, RSTN V IH, RSTN 0.85 0.93 V 4 Input High to Low Level, RSTN V IL, RSTN 0.63 0.71 V 4 Output Rise Time t RISE 5 ns 7 Output Fall Time t FALL 5 ns 7 Internal 3.3V-to-1.8V LDO from AFE Internal 1.8V Regulator Output V DD18, 15mA 1.6 1.8 2.0 V 5 Power On/Off Reset Level V DD18, Reset 80 85 90 % 6 Note 2: Does not include load current and tested under NOP loop and all peripheral disabled. Note 3: For Digital I/O only. Note 4: For RSTN pin only. Note 5: Supply to internal digital and analog circuit only. Note 6: This is measured as the percentage of steady state value of V DD18. Note 7: This is measured with 20pF load and 20% to 80% output level.

Enhanced Multi-touch Capacitive Touch Screen Controller CS5519 Apr. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited Mechanical Dimensions QFN-7×7-56 U n i t : m m ( i n c h )

Enhanced Multi-touch Capacitive Touch Screen Controller CS5519 Apr. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited Mechanical Dimensions (Continued) QFN-8×8-68 Unit: mm(inch) 7.900(0.311) 8.100(0.319) 7.900(0.311) 8.100(0.319) Pin 1 Mark Pin 1 Options DETAIL A # 1 IDENTIFICATION See DETAIL A PIN Symbol D E min(mm) max(mm) max(mm) min(mm)min(inch) min(inch)max(inch) max(inch) Option1 Option2 4.300 5.400 4.500 5.600 0.169 0.177 0.213 0.220 4.500 5.600 4.300 5.400 0.169 0.213 0.177 0.220 0.400(0.016) BSC 0.150(0.006) 0.250(0.010) N18 D N680.300(0.012) 0.500(0.020) E N52 N35 0.700(0.028) 0.800(0.031) 0.000(0.000) 0.050(0.002) 0.203(0.008) REF

Enhanced Multi-touch Capacitive Touch Screen Controller CS5519 Apr. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited Mounting Pad Layout QFN-7×7-56 X Y E E X2 Y3 X3 Dimensions X=Y (mm)/(inch) X1=Y1 (mm)/(inch) X2=Y2 (mm)/(inch) X3=Y3 (mm)/(inch) E (mm)/(inch)

Enhanced Multi-touch Capacitive Touch Screen Controller CS5519 Apr. 2013 Rev. 1. 0 BCD Semiconductor Manufacturing Limited Mounting Pad Layout (Continued) QFN-8×8-68 Dimensions X=Y (mm)/(inch) X1=Y1 (mm)/(inch) X2=Y2 (mm)/(inch) E (mm)/(inch) X3=Y3 (mm)/(inch)

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Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277 IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

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Tel: +021-6485-1491, Fax: +86-021-5450-0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203,Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District Shenzhen 518057, China Tel: +86-0755-8660-4900, Fax: +86-0755-8660-4958 Taiwan Office (Taipei) BCD Semiconductor (Taiwan) Company Limited Tel: +886-2-2656 2808 Fax: +886-2-2656-2806/26562950 Taiwan Office (Hsinchu) BCD Semiconductor (Taiwan) Company Limited 8F, No.176, Sec. 2, Gong-Dao 5th Road, East District HsinChu City 300, Taiwan, R.O.C Tel: +886-3-5160181, Fax: +886-3-5160181 - Headquarters BCD (Shanghai) Micro-electronics Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, P. R.C. Tel: +86-021-2416-2266, Fax: +86-021-2416-2277 USA Office BCD Semiconductor Corp.

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