AS324_13 BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Internally Frequency Compensated for Unity Gain
  • Large V oltage Gain: 100dB (Typical)
  • Low Input Bias Current: 20nA (Typical)
  • Low Input Offset V oltage: 2mV (Typical)
  • Low Supply Current: 0.5mA (Typical)
  • Wide Power Supply V oltage Range: Single Supply: 3V to 36V Dual Supplies: ± 1.5V to ± 18V
  • Input Common Mode V oltage Range Includes Ground
  • Large Output V oltage Swing: 0V to VCC -1.5V
  • Power Drain Suitable for Battery Operation Application
  • Battery Charger
  • Cordless Telephone
  • Switching Power Supply DIP-14 SOIC-14 TSSOP-14

Jan. 2013 Rev. 2. 0 BCD Semiconductor Manufacturing Limited Data Sheet LOW POWER QUAD OPERATIONAL AMPLIFIERS AS324/324A Absolute Maximum Ratings (Note 1) Recommended Operating Conditions Parameter Symbol Value Unit Supply V oltage VCC 40 V Differential Input V oltage VID 40 V Input V oltage VIN -0.3 to 40 V Total Power Dissipation (TA=25oC) PD DIP-14 1130 mW SOIC-14 800 TSSOP-14 710 Operating Junction Temperature TJ 150 oC Storage Temperature Range TSTG -65 to 150 oC Lead Temperature (Soldering, 10 Seconds) TLEAD 260 oC Parameter Symbol Min Max Unit Supply V oltage V CC 33 6 V Ambient Operating Temperature Range T A -40 85 oC Note 1: Stresses greater than those listed under "A bsolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Max- imum Ratings" for extended periods may affect device reliability. Ordering Information (Continued) BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with "G1" suffix are available in green packages. Package Temperature Range Part Number Marking ID Packing Type Lead Free Green Lead Free Green SOIC-14 -40 to 85oC AS324M-E1 AS324M-G1 AS324M-E1 AS324M-G1 Tube AS324MTR-E1 AS324MTR-G1 AS324M-E1 AS324M-G1 Tape & Reel AS324AM-E1 AS324AM-G1 AS324AM-E1 AS324AM-G1 Tube AS324AMTR-E1 AS324AMTR-G1 AS324AM-E1 AS324AM-G1 Tape & Reel DIP-14 AS324P-E1 AS324P-G1 AS324P-E1 AS324P-G1 Tube TSSOP-14 AS324GTR-E1 AS324GTR-G1 EGS324 GGS324 Tape & Reel

Jan. 2013 Rev. 2. 0 BCD Semiconductor Manufacturing Limited Data Sheet LOW POWER QUAD OPERATIONAL AMPLIFIERS AS324/324A Parameter Symbol Test Conditions Min Typ Max Unit Input Offset V oltage VIO VO=1.4V , RS=0 Ω, VCC=5V to 30V AS324 25 mV AS324A 23 mV Average Temperature Coeffi- cient of Input Offset V oltage ΔVIO/ΔT TA=-40 to 85oC 7 μV/oC Input Offset Current IIO IIN+ - IIN-, VCM=0V 53 0 nA 100 Input Bias Current IBIAS IIN+ or IIN-, VCM=0V 20 100 nA 200 Input Common Mode V oltage Range (Note 3) VIR VCC=30V 0 VCC -1.5 V Supply Current ICC TA=-40 to 85 oC, RL=∞ VCC=30V 1.0 3 mA VCC=5V 0.7 1.2 Large Signal V oltage Gain GV VCC=15V , RL ≥ 2kΩ, VO=1V to 11V 85 100 dB Common Mode Rejection Ratio CMRR DC, V CM=0 to (VCC-1.5)V 60 70 dB Power Supply Rejection Ratio PSRR V CC=5 to 30V 70 100 dB Channel Separation CS f=1kHz to 20kHz -120 dB Output Current Source ISOURCE VIN+=1V , VIN-=0V , VCC=15V , VO=2V 20 40 mA Sink ISINK VIN+=0V , VIN-=1V , VCC=15V , VO=2V 10 15 mA VIN+=0V , VIN-=1V , VCC=15V , VO=0.2V 12 50 μA Output Short Circuit Current to Ground ISC VCC=15V 40 60 mA Output V oltage Swing VOH VCC=30V , RL=2kΩ 26 V26 VCC=30V , RL=10kΩ 27 28 VOL VCC=5V , RL= 10kΩ 52 0 mV Thermal Resistance (Junction to Case) θJC DIP-14 24.78 oC/WSOIC-14 36.78

Electrical Characteristics

Limits in standard typeface are for T A=25oC, bold typeface applies over T A=-40oC to 85 oC (Note 2), V CC=5V , GND=0V , unless otherwise specified. Note 2: Limits over the full temperature are guaranteed by design, but not tested in production.

Jan. 2013 Rev. 2. 0 BCD Semiconductor Manufacturing Limited Data Sheet LOW POWER QUAD OPERATIONAL AMPLIFIERS AS324/324A Mechanical Dimension DIP-14 Unit: mm(inch) 0.254(0.010) 10° 10° 18.800(0.740) 19.200(0.756) 0.360(0.014) 0.560(0.022) 2.540(0.100)TYP R1.000(0.039) 0.130(0.005)MIN 7.620(0.300)TYP 0.700(0.028) Φ3.000(0.118) Depth 0.100(0.004) 0.200(0.008) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014) 1.600(0.063) 1.800(0.071) 1.600(0.063) 1.800(0.071) 1.524(0.060) TYP 3.000(0.118) 6.200(0.244) 6.600(0.260) Note: Eject hole, oriented hole and mold mark is optional.

Jan. 2013 Rev. 2. 0 BCD Semiconductor Manufacturing Limited Data Sheet LOW POWER QUAD OPERATIONAL AMPLIFIERS AS324/324A Mechanical Dimension (Continued) SOIC-14 Unit: mm(inch) φ φ Note: Eject hole, oriented hole and mold mark is optional. 8.550(0.337) 1.350(0.053) 0.700(0.028) 0.100(0.004) 0.250(0.010) 0.500(0.020) R0.200(0.008) 20:1 A 0.280(0.011) ×45° A 0.190(0.007) 9.5° Depth 0.060(0.002) 0.100(0.004) 2.000(0.079) 1.270(0.050) 1.000(0.039) 1.300(0.051) 5.800(0.228) 8.750(0.344) 0.250(0.010) 1.750(0.069) 0.250(0.010) 3.800(0.150) 4.000(0.157) 0.330(0.013) 0.510(0.020) 6.200(0.244) 0.600(0.024) R0.200(0.008) 0.250(0.010) 0.200(0.008)MIN 0.480(0.019)×45° φ

Jan. 2013 Rev. 2. 0 BCD Semiconductor Manufacturing Limited Data Sheet LOW POWER QUAD OPERATIONAL AMPLIFIERS AS324/324A Mechanical Dimension (Continued) TSSOP-14 Unit: mm(inch) Note: Eject hole, oriented hole and mold mark is optional. SEE DETAIL A DETAIL A TOP&BOTTOM 1.000(0.039) REF 4.300(0.169) 4.500(0.177) 6.200(0.244) 6.600(0.260) 4.860(0.191) 5.060(0.199) 0.340(0.013) 0.540(0.021) INDEX 0.050(0.002) 0.150(0.006) 0.900(0.035) 1.050(0.041) 0.650(0.026) 0.200(0.008) 0.280(0.011) 0.250(0.010) 0.450(0.018) 0.750(0.030) # 1 PIN 0.950(0.037) 1.050(0.041) DEP 0 0.100(0.004) 0.100(0.004) 0.190(0.007) R0.090(0.004) R0.090(0.004) 10° 14° 0.200(0.008) 1.200(0.047) MAX φ

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277