APEXX16 APLUS | Alldatasheet
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Technical content
APLUS MAKE YOUR PRODUCTION A-PLUS APExx16 Series DATA SHEET APLUS INTEGRATED CIRCUITS INC. Address: 3 F-10, No. 32, Sec. 1, Chenggung Rd., Taipei, Taiwan 115, R.O.C. (115)台北市南港區成功路㆒段32 號 3 樓之 10. TEL: 886-2-2782-9266 FAX: 886-2-2782-9255 WEBSITE : http: //www.aplusinc.com.tw Sales E-mail: sales@aplusinc.com.tw Technology E-mail: service@aplusinc.com.tw
Rev 1.1 2003/9/2 1
1.0 General Description
The APExx16 series are very low cost voice and melody synthesizer with 4-bits CPU. They have various features including 4-bits ALU, ROM, RAM, I/O ports, timers, clock generator, voice and melody synthesizer, and PWM (Direct drive) or D/A current outputs, etc. The audio synthesizer contains one voice-channel and two melody-channels. Furthermore, they consist of 27 instructions in these devices. With CMOS technology and halt function can minimize power dissipation. Their architectures are similar to RISC, with two stages of instruction pipeline. They allow all instructions to be executed in a single cycle, except for program branches and data table read instructions (which need two instruction cycles).
2.0 Features
(1) Single power supply can operate from 2.4V to 5.5V at 4MHz or 8MHz. (2) Program ROM: 16k x 10 bits ( APE8416 /APE10616 /APE12716 are 64k x 10 bits ) (3) 1 set of 16-bits DPR can access up to 64k x 10 bits melody data memory space, and 1 set of 19-bits VPR can access up to 512k x 10 bits voice data memory space. Product Voice Duration (sec) Voice Pointer (VPR) ROM Size (10-bits) APE1016 10 15-bits 32k APE1516 15 16-bits 48k APE2016 20 16-bits 64k APE3116 31 17-bits 96k APE4116 41 17-bits 128k APE6316 63 18-bits 192k APE8416 84 18-bits 256k APE10616 106 19-bits 320k APE12716 127 19-bits 384k (4) Data Registers: a). 128 x 4-bits data RAM (00-7Fh) b). Unbanked special function registers (SFR) range: 00h-2Fh (5) I/O Ports: a). PRA: 4-bits I/O Port A (10h) can be programmed to input/output individually. (Register control) b). PRB: 4-bits I/O Port B (13h) can be configured to input/output individually. (Mask option) c). PRC: 4-bits I/O Port C (14h) can be programmed to input/output individually. (Register control) d). PRD: 4-bits I/O Port D (15h) can be programmed to input/output individually. (Register control) (6) On-chip clock generator: Resistive Clock Drive (RM) or Crystal oscillator (HM) (7) Timer: 1-set Voice Interrupt (Timer0: a 9-bits auto-reload timer/counter). (8) Stack: 2-level subroutine nesting. (9) Built-in 4 Level Volume Control can be programmed.
Rev 1.1 2003/9/2 2 (10) Built-in 8 Level DAC current output can be configured. (Mask option) (11) Built-in IR Carry Output: Port B[1] can be configured as IR pin by 38k / 56kHz. (Mask option) (12) External Reset: Port B[3] can be configured as reset pin. (Mask opton) (13) HALT and Release from HALT function to reduce power consumption (14) Watch Dog Timer ( WDT) (15) Instruction: 1-cycle instruction except for table read and program branches which are 2-cycles (16) Number of instruction: 27 (17) DAC: 1 channel voice and dual tone melody synthesizer (One 9-bits Cout or 8-bits PWM output). FIGURE 1 : ROM Map of APExx16 Series * APE8416 /APE10616 /APE12716 are 64k x 10 bits 14-bit x 2 STACK Reset Vector 00000h-03FFFh 16-bit Data Pointer PC[13:0] Reserved for Testing 000FFh-00400h 00401h 00000h 000FEh Program ROM 00000h-0FFFFh Data ROM for Melody 19-bit Voice Pointer 00000h-7FFFFh Voice ROM for Voice
Rev 1.1 2003/9/2 3
3.0 Pin Description
Pad Name Pin Attr. Description PWM2/Cout O PWM2 output, or Current Output of Audio. PWM1 O PWM1 output. Vdd1~3 Power Power supply during operation. PRA0~3 PRC0~3 PRD0~3 I/O I/O port can be programmed to input/output individually. Input type with weak pull-low or fix-input-floating capability. Buffer Output type. PRB0 / OSC2 I/O I/O port can be configured to input/output individually or HM OSC pad. Input type with weak pull-low or fix-input-floating capability. Buffer Output type. PRB1 / IR I/O I/O port can be configured to input/output individually. Input type with weak pull-low or fix-input-floating capability. Buffer Output type. Mask option selected as an IR Carrier Output with 38k / 56kHz PRB2 I/O I/O port can be configured to input/output individually. Input type with weak pull-low or fix-input-floating capability. Buffer Output type. PRB3 / Reset I/O I/O port can be configured to input/output individually. Input type with weak pull-low or fix-input-floating capability. Buffer Output type. Mask option selected as an external RESET pin with weak pull-low capability. OSC1 I RM/HM mode Oscillator input GND1~4 Power Ground Potential
4.0 DC Characteristics
Symbol Parameter Vdd Min. Typ. Max. Unit Condition Vdd Operating voltage 2.4 3 5.5 V depending on Freq. 3 1 Isb Standby 4.5 1 uA 4MHz, RM, in HALT Mode 3 2 Iop Supply current Operating 4.5 7 mA 4MHz, RM, IO Floating 3 3 Iih Input current (Internal pull low) 4.5 10 uA Input ports with weak pull-low 3 -3 Ioh Output-high current 4.5 -10 3 7 Iol Output-low current 4.5 19 mA 4MHz, RM (IO ports) 3 0.8 ~ 4.8 Cout DAC output current (8-level option) 4.5 0.9 ~ 6.5 mA 4MHz, RM (Full scale) dF/F Frequency stability -5 5 % Fosc(3v- 2.4v) Fosc (3v) dF/F Fosc lot variation -10 10 % Vdd=3V, Rosc=180k, 4MHz
Rev 1.1 2003/9/2 4 FIGURE 2 : Frequency vs. Rosc (at 3V) Resistor (Rosc ohms) 110k 200k 300k 430k Frequency (MHz) 14.84 8.25 5.54 3.92
5.0 Application Circuit
Rosc vs Freq. 5.54 3.92 8.25 14.84 0 100 200 300 400 500 Rosc (k ohm) Freq. (MHz)
Rev 1.1 2003/9/2 5
6.0 Bonding Diagram of APE1016 /APE1516 /APE2016
Pad # Pad Name X Y Pad # Pad Name X Y
1 Vdd3 56 647 14 GND2 1261 235
2 PWM2/Cout 58 466 15 OSC1 1261 350
3 Vdd2 58 182 16 PRB0/OSC2 1261 465
4 PWM1 145 58 17 PRC3 1261 580
5 GND3 293 58 18 PRC2 1261 695
6 PRA3 413 87 19 PRC1 1261 810
7 PRA2 533 87 20 PRC0 1261 925
8 PRA1 653 87 21 PRD3 1261 1040
9 PRA0 773 87 22 PRD2 1261 1155
10 PRB3/Reset 893 87 23 PRD1 1261 1270
11 PRB2 1013 87 24 PRD0 1261 1385
12 PRB1/IR 1133 87 25 GND1 1261 1500
13 Vdd1 1253 87
PRA2 PRA3 PRA1 PRB1 PRB2 PRB3 PRA0 GND3 PWM2/Cout Vdd3 1 PWM1 Vdd1 PRC0 (0,0)
16 PRB0
Chip Size : 1432 um x 1650 um Pad Size : 80 um x 80 um * The IC substrate must be connected to GND.
Rev 1.1 2003/9/2 6
6.1 Bonding Diagram of APE3116 /APE4116 /APE6316
Pad # Pad Name X Y Pad # Pad Name X Y
1 Vdd3 56 647 14 PRB1/IR 1248 405
2 PWM2/Cout 58 466 15 OSC1 1248 570
3 Vdd2 58 182 16 PRB0/OSC2 1248 733
4 PWM1 145 58 17 PRC3 1248 896
5 GND3 293 58 18 PRC2 1248 1056
6 PRA3 430 87 19 PRC1 1248 1218
7 PRA2 563 87 20 PRC0 1248 1379
8 PRA1 696 87 21 PRD3 1248 1540
9 PRA0 829 87 22 PRD2 1248 1700
10 PRB3/Reset 962 87 23 PRD1 1248 1861
11 PRB2 1095 87 24 PRD0 1248 2022
12 Vdd1 1228 87 25 GND1 1248 2310
13 GND2 1248 272
PRA2 PRA3 PRA1 Vdd1 PRB2 PRB3 PRA0 GND3 PWM2/Cout Vdd3 1 PWM1 GND2 PRC0 (0,0) Chip Size : 1408 um x 2556 um Pad Size : 80 um x 80 um * The IC substrate must be connected to GND.
Rev 1.1 2003/9/2 7
6.2 Bonding Diagram of APE8416 /APE10616 /APE12716
Pad # Pad Name X Y Pad # Pad Name X Y
1 GND4 76 404 14 PRA3 2109 76
2 GND3 59 294 15 GND2 2128 212
3 PWM1 59 146 16 GND1 1927 2204
4 Vdd3 183 59 17 PRD0 1765 2204
5 PWM2/Cout 467 59 18 PRD1 1603 2204
6 Vdd2 815 76 19 PRD2 1441 2204
7 OSC1 976 76 20 PRD3 1279 2204
8 PRB0/OSC2 1140 76 21 PRC0 1117 2204
9 PRB1/IR 1304 76 22 PRC1 955 2204
10 PRB2 1465 76 23 PRC2 739 2204
11 PRA0 1626 76 24 PRC3 631 2204
12 PRA1 1787 76 25 PRB3/Reset 469 2204
13 PRA2 1948 76 26 Vdd1 307 2204
PRB1 PRB0 PRB2 PRA3 PRA2 PRA1 PRA0 GND3 PWM2/Cout GND4 1 Chip Size : 2288 um x 2364 um Pad Size : 80 um x 80 um * The IC substrate must be connected to GND. PWM1 Vdd3 PRD3 (0,0) 22 21 20 19 16 25 24 23 26 GND1 PRD2 PRC1 PRD1 PRD0 Vdd1 PRB3 PRC3 PRC2