APD360 BCDSEMI | Alldatasheet

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P r e l i m i n a r y D a t a s h e e t SCHOTTKY BARRIER RECTIFIER APD360 Jun. 2009 Rev. 1. 1 BCD Semiconductor Manufacturing Limited

Ordering Information

E1: Lead Free C i r c u i t T y p e G 1 : G r e e n P a c k a g e B l a n k : B u l k V P : D O - 2 7 T R : A m m o Part Number Marking ID Package Temperature Range Lead Free Green Lead Free Green Packing Type APD360VP-E1 APD360VP-G1 D360VP 360VPG Bulk DO-27 -40 to 85°C APD360VPTR-E1 APD360VPTR- G1 D360VP 360VPG Ammo BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with “G1” suffix are available in green packages.

P r e l i m i n a r y D a t a s h e e t SCHOTTKY BARRIER RECTIFIER APD360 Jun. 2009 Rev. 1. 1 BCD Semiconductor Manufacturing Limited Absolute Maximum Ratings (TA=25°C unless otherwise noted) (Note 1) Parameter Symbol Value Unit Maximum repetitive peak reverse voltage VRRM 60 V Maximum DC blocking voltage V DC 60 V Maximum RMS voltage V RMS 42 V Average rectified forward current 0.375” (9.5mm)lead length IF(A V) 3.0 A Non-repetitive peak forward surge current 8.3ms single half sine-wave on rated load I FSM 80 A Operating junction temperature range T J -65 to 125 °C Storage temperature range T STG -65 to 150 °C Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Co nditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Thermal Characteristics (TA=25°C unless otherwise noted) Parameter Symbol Value Unit Typical Thermal Resistance θJA 40 °C/W Electrical Characteristics (TA=25°C unless otherwise noted) Parameter Symbol Min Typ Max Units Forward voltage @ IF=3.0A V F 0.68 V TA=25°C 0.5 Reverse Current @ rated VR (Note 2) TA=100°C IR 10 mA Note 2: Pulse Test: 300µS pulse width, 1.0% duty cycle.

Figure 7. Typical Junction Capacitance

P r e l i m i n a r y D a t a s h e e t SCHOTTKY BARRIER RECTIFIER APD360 Jun. 2009 Rev. 1. 1 BCD Semiconductor Manufacturing Limited Mechanical Dimensions DO-27 Unit: mm(inch) 25.400(1.000) MIN 25.400(1.000) MIN 1.060(0.042) 0.960(0.038) 8.500(0.375) 9.500(0.335) 5.000(0.197) 5.600(0.220) DIA. DIA.

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen, 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277