AP9930GM-HF

AP9930GM-HF_14 A-POWER | Alldatasheet

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Advanced Power 2N AND 2P-CHANNEL ENHANCEMENT Electronics Corp. MODE POWER MOSFET ▼ Simple Drive Requirement ▼ Low On-resistance N-CH BV DSS 30V ▼ Full Bridge Application on RDS(ON) 33mΩ LCD Monitor Inverter ID 5.5A ▼ RoHS Compliant P-CH BVDSS -30V RDS(ON) 55mΩ Description ID -4.1A Absolute Maximum Ratings Symbol Parameter Rating Units N-channel P-channel VDS Drain-Source Voltage -30 V VGS Gate-Source Voltage ±20 V ID@TA=25℃ Continuous Drain Current3 -4.1 A ID@TA=70℃ Continuous Drain Current3 -3.3 A IDM Pulsed Drain Current1 -20 A PD@TA=25℃ Total Power Dissipation 1.38 W Linear Derating Factor 0.01 W/ ℃ TSTG Storage Temperature Range -55 to 150 ℃ TJ Operating Junction Temperature Range -55 to 150 ℃ Symbol Value Unit Rthj-a Maximum Thermal Resistance, Junction-ambient 3 90 ℃/W Data and specifications subject to change without notice Parameter 200805154 AP9930GM-HF Thermal Data Halogen-Free Product ±20 5.5 4.4 Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost- effectiveness. The SO-8 package is widely preferred for commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. N1G N1D/P1D N1S/N2S N2G P1G P1S/P2S N2D/P2D P2G SO-8 N1G N1S P1G P1S P1N1D N2G N2S P2G P2S P2N2D

Symbol Parameter Test Conditions Min. Typ. Max. Units BVDSS Drain-Source Breakdown Voltage V GS=0V, ID=250uA 30 - - V RDS(ON) Static Drain-Source On-Resistance2 VGS=10V, ID=5A - - 33 mΩ VGS=4.5V, ID=3A - - 60 mΩ VGS(th) Gate Threshold Voltage V DS=VGS, ID=250uA 1 - 3 V gfs Forward Transconductance V DS=10V, ID=5A - 5.2 - S IDSS Drain-Source Leakage Current VDS=30V, VGS=0V - - 1 uA Drain-Source Leakage Current (Tj=70oC) VDS=24V, VGS=0V - - 25 uA IGSS Gate-Source Leakage V GS=±20V - - ±100 nA Qg Total Gate Charge2 ID=5A - 7 10 nC Qgs Gate-Source Charge V DS=15V - 2 - nC Qgd Gate-Drain ("Miller") Charge V GS=4.5V - 4 - nC td(on) Turn-on Delay Time2 VDS=15V - 7 - ns tr Rise Time I D=1A - 10 - ns td(off) Turn-off Delay Time R G=6Ω,VGS=10V - 18 - ns tf Fall Time R D=15Ω -8- ns Ciss Input Capacitance V GS=0V - 600 960 pF Coss Output Capacitance V DS=25V - 229.8 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 94 - pF Source-Drain Diode Symbol Parameter Test Conditions Min. Typ. Max. Units VSD Forward On Voltage2 IS=1.2A, VGS=0V - - 1.2 V trr Reverse Recovery Time2 IS=1.7A, VGS=0V - 21 - ns Qrr Reverse Recovery Charge dI/dt=100A/µs - 16 - nC AP9930GM-HF

Symbol Parameter Test Conditions Min. Typ. Max. Units BVDSS Drain-Source Breakdown Voltage V GS=0V, ID=-250uA -30 - - V RDS(ON) Static Drain-Source On-Resistance2 VGS=-10V, ID=-4A - - 55 mΩ VGS=-4.5V, ID=-2A - - 100 mΩ VGS(th) Gate Threshold Voltage V DS=VGS, ID=-250uA -1 - -3 V gfs Forward Transconductance V DS=-10V, ID=-4A - 4 - S IDSS Drain-Source Leakage Current VDS=-30V, VGS=0V - - -1 uA Drain-Source Leakage Current (Tj=70oC) VDS=-24V, VGS=0V - - -25 uA IGSS Gate-Source Leakage V GS=±20V - - ±100 nA Qg Total Gate Charge2 ID=-4A - 8 11 nC Qgs Gate-Source Charge V DS=-24V - 1.5 - nC Qgd Gate-Drain ("Miller") Charge V GS=-4.5V - 4 - nC td(on) Turn-on Delay Time2 VDS=-15V - 6.6 - ns tr Rise Time I D=-1A - 7.7 - ns td(off) Turn-off Delay Time R G=3.3Ω,VGS=-10V - 22 - ns tf Fall Time R D=15Ω - 9.3 - ns Ciss Input Capacitance V GS=0V - 570 790 pF Coss Output Capacitance V DS=-25V - 80 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 75 - pF Source-Drain Diode Symbol Parameter Test Conditions Min. Typ. Max. Units VSD Forward On Voltage2 IS=-1.2A, VGS=0V - - -1.2 V trr Reverse Recovery Time2 IS=-4A, VGS=0V, - 18 - ns Qrr Reverse Recovery Charge dI/dt=100A/µs - 10 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test 3.Surface mounted on 1 in 2 copper pad of FR4 board , t <10sec ; 186 ℃/W when mounted on Min. copper pad. THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN.

Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature Fig 5. Forward Characteristic of Fig 6. Gate Threshold Voltage v.s. Reverse Diode Junction Temperature 0123456 V DS , Drain-to-Source Voltage (V) ID , Drain Current (A) T A =25 o C 10V 8.0V 6.0V 4.0V V G =3.0V 0123456 V DS , Drain-to-Source Voltage (V) ID , Drain Current (A) T A =150 o C V G =3.0V 10V 8.0V 6.0V 4.0V 2468 1 0 V GS , Gate-to-Source Voltage (V) RDS(ON) (m I D =3A T A =25 ℃ 0.6 0.8 1.0 1.2 1.4 1.6 -50 0 50 100 150 T j , Junction Temperature ( o C) Normalized RDS(ON) I D =5A V G =10V 1.2 1.4 1.6 1.8 -50 0 50 100 150 T j ,Junction Temperature ( o C) VGS(th) (V) 0.01 0.10 1.00 10.00 V SD , Source-to-Drain Voltage (V) IS(A) T j =25 o CT j =150 o C

Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance Fig 11. Switching Time Waveform Fig 12. Gate Charge Waveform 0 4 8 12 16 Q G , Total Gate Charge (nC) VGS , Gate to Source Voltage (V) I D =5A V DS =15V 100 1000 1 5 9 13 17 21 25 29 V DS , Drain-to-Source Voltage (V) C (pF) f=1.0MHz C iss C oss C rss td(on) tr td(off) tf VDS VGS 10% 90% Q VG 4.5V QGS QGD QG Charge 0.001 0.01 0.1 0.0001 0.001 0.01 0.1 1 10 100 1000 t , Pulse Width (s) Normalized Thermal Response (Rthja) 0.01 0.05 0.1 0.2 Duty factor=0.5 Single Pulse PDM Duty factor = t/T Peak Tj = PDM x Rthja + Ta Rthja = 186℃/W t T 0.02 0.01 0.1 100 0.1 1 10 100 V DS , Drain-to-Source Voltage (V) ID (A) T A =25 o C Single Pulse 100us 1ms 10ms 100ms DC

Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature Fig 5. Forward Characteristic of Fig 6. Gate Threshold Voltage v.s. Reverse Diode Junction Temperature 0.6 0.8 1.2 1.4 1.6 1.8 -50 0 50 100 150 T j , Junction Temperature ( o C) Normalized RDS(ON) I D =- 4A V G = -10 V 0123456 -V DS , Drain-to-Source Voltage (V) -ID , Drain Current (A) T A =25 o C -10V -8.0V -6.0V -4.0V V G =-3.0V 0123456 -V DS , Drain-to-Source Voltage (V) -ID , Drain Current (A) T A =150 o C -10V -4.0V -6.0V -8.0V V G =-3.0V 2468 1 0 -V GS , Gate-to-Source Voltage (V) RDS(ON) (m I D =-2A T A =25 ℃ 0.01 0.10 1.00 10.00 -V SD ,Source-to-Drain Voltage (V) -IS(A) T j =25 o CT j =150 o C 1.2 1.4 1.6 1.8 -50 0 50 100 150 T j , Junction Temperature ( o C) -VGS(th) (V)

Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance Fig 11. Switching Time Waveform Fig 12. Gate Charge Waveform 100 1000 1 5 9 1 31 72 12 52 9 -V DS , Drain-to-Source Voltage (V) C (pF) f=1.0MHz C iss C oss C rss 048 1 2 1 6 2 0 Q G , Total Gate Charge (nC) -VGS , Gate to Source Voltage (V) I D =-4A V DS =-24V td(on) tr td(off) tf VDS VGS 10% 90% Q VG -4.5V QGS QGD QG Charge 0.001 0.01 0.1 0.0001 0.001 0.01 0.1 1 10 100 1000 t , Pulse Width (s) Normalized Thermal Response (Rthja) 0.01 0.05 0.1 0.2 Duty factor=0.5 Single Pulse PDM Duty factor = t/T Peak Tj = PDM x Rthja + Ta Rthja = 186℃/W t T 0.02 0.01 0.1 100 0.1 1 10 100 -V DS , Drain-to-Source Voltage (V) ID (A) 100us 1ms 10ms 100ms DC T A =25 o C Single Pulse