AP9408AGP A-POWER | Alldatasheet

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Advanced Power N-CHANNEL ENHANCEMENT MODE Electronics Corp. POWER MOSFET ▼ Lower Gate Charge BVDSS 30V ▼ Simple Drive Requirement RDS(ON) 10mΩ ▼ Fast Switching Characteristic ID 53A

Description

ID@TC=25℃ A ID@TC=100℃ A IDM A PD@TC=25℃ W TSTG ℃ TJ ℃ Symbol Value Units Rthj-c Maximum Thermal Resistance, Junction-case 2.8 ℃/W Rthj-a Maximum Thermal Resistance, Junction-ambient 62 ℃/W Data and specifications subject to change without notice AP9408AGP RoHS-compliant Product 200810282 Parameter Rating Drain-Source Voltage 30 Gate-Source Voltage ±20 Continuous Drain Current, VGS @ 10V 53 Operating Junction Temperature Range -55 to 150 Continuous Drain Current, VGS @ 10V 33 Pulsed Drain Current1 160 Storage Temperature Range Total Power Dissipation 44.6 -55 to 150 Thermal Data Parameter G D S Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The TO-220 package is widely preferred for commercial-industrial power applications and suited for low voltage applications such as DC/DC converters. GD S TO-220(P)

Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Units BVDSS Drain-Source Breakdown Voltage V GS=0V, ID=250uA 30 - - V RDS(ON) Static Drain-Source On-Resistance2 VGS=10V, ID=30A - - 10 m Ω VGS=4.5V, ID=20A - - 15 m Ω VGS(th) Gate Threshold Voltage V DS=VGS, ID=250uA 1 - 3 V gfs Forward Transconductance V DS=10V, ID=30A - 30 - S IDSS Drain-Source Leakage Current VDS=30V, VGS=0V - - 10 uA IGSS Gate-Source Leakage V GS=±20V - - ±100 nA Qg Total Gate Charge2 ID=20A - 6.5 10.5 nC Qgs Gate-Source Charge V DS=24V - 1.8 - nC Qgd Gate-Drain ("Miller") Charge V GS=4.5V - 3.7 - nC td(on) Turn-on Delay Time2 VDS=15V - 6 - ns tr Rise Time I D=20A - 56 - ns td(off) Turn-off Delay Time R G=3.3Ω,VGS=10V - 15 - ns tf Fall Time R D=0.75Ω - 3.7 - ns Ciss Input Capacitance V GS=0V - 600 960 pF Coss Output Capacitance V DS=25V - 185 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 80 - pF Rg Gate Resistance f=1.0MHz - 2.5 3.8 Ω Source-Drain Diode Symbol Parameter Test Conditions Min. Typ. Max. Units VSD Forward On Voltage2 IS=30A, VGS=0V - - 1.2 V trr Reverse Recovery Time2 IS=10A, VGS=0V, - 23 - ns Qrr Reverse Recovery Charge dI/dt=100A/µs - 16 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. AP9408AGP

Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature Fig 5. Forward Characteristic of Fig 6. Gate Threshold Voltage v.s. Reverse Diode Junction Temperature 120 160 012345 V DS , Drain-to-Source Voltage (V) ID , Drain Current (A) T C =2 5o C 10 V 7.0 V 6.0 V 5.0 V V G = 4.0 V 100 0123456 V DS , Drain-to-Source Voltage (V) ID , Drain Current (A) 10V 7.0V 6.0V 5.0V V G = 4.0 V T C =15 0 o C 2468 1 0 V GS Gate-to-Source Voltage (V) RDS(ON) (m I D =20A T C =25 o C 0.4 0.8 1.2 1.6 2.0 -50 0 50 100 150 T j , Junction Temperature ( o C) Normalized RDS(ON) I D =30A V G =10V V SD , Source-to-Drain Voltage (V) IS(A) T j =25 o CT j =150 o C 0.4 0.8 1.2 1.6 -50 0 50 100 150 T j ,Junction Temperature ( o C) Normalized VGS(th) (V)

Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance Fig 11. Switching Time Waveform Fig 12. Gate Charge Waveform AP9408AGP 02468 1 0 1 2 Q G , Total Gate Charge (nC) VGS , Gate to Source Voltage (V) V DS =1 5V V DS =1 8V V DS =2 4V I D =2 0A td(on) tr td(off) tf VDS VGS 10% 90% Q VG 4.5V QGS QGD QG Charge 200 400 600 800 1000 1 5 9 1 31 72 12 52 9 V DS ,Drain-to-Source Voltage (V) C (pF) f=1.0MHz C iss C oss C rss 0.01 0.1 t , Pulse Width (s) Normalized Thermal Response (Rthjc) PDM Duty factor = t/T Peak Tj = PDM x Rthjc + TC t T 0.02 0.01 0.05 0.1 0.2 Duty factor=0.5 Single Pulse 100 1000 0.1 1 10 100 V DS , Drain-to-Source Voltage (V) ID (A) T C =25 o C Single Pulse 100us 1ms 10ms 100ms DC

Package Outline : TO-220 Millimeters MIN NOM MAX A 4.40 4.60 4.80 b 0.76 0.88 1.00 D 8.60 8.80 9.00 c 0.36 0.43 0.50 E 9.80 10.10 10.40 L4 14.70 15.00 15.30 L5 6.20 6.40 6.60 c1 1.25 1.35 1.45 b1 1.17 1.32 1.47 L 13.25 13.75 14.25 e L1 2.60 2.75 2.89 φ 3.71 3.84 3.96 1.All Dimensions Are in Millimeters. 2.Dimension Does Not Include Mold Protrusions. Part Marking Information & Packing : TO-220 2.54 REF.

7.4 REF,

ADVANCED POWER ELECTRONICS CORP. 5.10 REF. b e D A c L Package Code Part Number Date Code (YWWSSS) Y：Last Digit Of The Year WW：Week SSS：Sequence 9408AGP YWWSSS LOGO φ meet Rohs requirement E