AP4604I A-POWER | Alldatasheet

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Advanced Power N-CHANNEL ENHANCEMENT MODE Electronics Corp. POWER MOSFET ▼ Simple Drive Requirement BVDSS 40V ▼ Ultra-low On-resistance RDS(ON) 2.5mΩ ▼ Fast Switching Characteristic ID 100A ▼ RoHS Compliant & Halogen-Free

Description

Absolute Maximum Ratings@Tj=25oC(unless otherwise specified) Symbol Units VDS V VGS V ID@TC=25℃ A ID@TC=100℃ A IDM A PD@TC=25℃ W PD@TA=25℃ W EAS Single Pulse Avalanche Energy3 mJ TSTG ℃ TJ ℃ Symbol Value Units Rthj-c Maximum Thermal Resistance, Junction-case 3 ℃/W Rthj-a Maximum Thermal Resistance, Junction-ambient 65 ℃/W Data and specifications subject to change without notice Parameter Total Power Dissipation 2.3 Storage Temperature Range Operating Junction Temperature Range -55 to 175 Thermal Data Total Power Dissipation 50 -55 to 175 Gate-Source Voltage + 20 Pulsed Drain Current1 Drain Current, VGS @ 10V Drain Current, VGS @ 10V 100 Parameter Rating Drain-Source Voltage 40 AP4604I Halogen-Free Product 201512031 320 73.4 G D S AP4604 series are from Advanced Power innovated design and silicon process technology to achieve the lowest possible on-resistance and fast switching performance. It provides the designer with an extreme efficient device for use in a wide range of power applications. The TO-220 package is widely preferred for all commercial- industrial through hole applications. The low thermal resistance and low package cost contribute to the worldwide popular package. G D S AP4604 series are from Advanced Power innovated design and silicon process technology to achieve the lowest possible on-resistance and fast switching performance. It provides the designer with an extreme efficient device for use in a wide range of power applications. The TO-220CFM package is widely preferred for all commercial-industrial through hole applications. The mold compound provides a high isolation voltage capability and lo w thermal resistance between the tab and the external heat-sink. G D S TO-220CFM(I)

Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Units BVDSS Drain-Source Breakdown Voltage V GS=0V, ID=250uA 40 - - V RDS(ON) Static Drain-Source On-Resistance2 VGS=10V, ID=30A - - 2.5 m Ω VGS(th) Gate Threshold Voltage V DS=VGS, ID=250uA 2 - 4 V gfs Forward Transconductance V DS=10V, ID=40A - 120 - S IDSS Drain-Source Leakage Current VDS=32V, VGS=0V - - 10 uA IGSS Gate-Source Leakage V GS= +20V, VDS=0V - - + 100 nA Qg Total Gate Charge I D=40A - 105 168 nC Qgs Gate-Source Charge V DS=32V - 20 - nC Qgd Gate-Drain ("Miller") Charge V GS=10V - 44 - nC td(on) Turn-on Delay Time V DS=20V - 22 - ns tr Rise Time I D=40A - 84 - ns td(off) Turn-off Delay Time R G=3.3Ω -5 0- ns tf Fall Time V GS=10V - 30 - ns Ciss Input Capacitance V GS=0V - 5330 8528 pF Coss Output Capacitance V DS=25V - 1100 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 340 - pF Rg Gate Resistance f=1.0MHz - 1.2 2.4 Ω Source-Drain Diode Symbol Parameter Test Conditions Min. Typ. Max. Units VSD Forward On Voltage2 IS=40A, VGS=0V - - 1.2 V trr Reverse Recovery Time I S=40A, VGS=0V - 40 - ns Qrr Reverse Recovery Charge dI/dt=100A/µs - 38 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test 3.Starting Tj=25oC , VDD=25V , L=0.1mH , RG=25Ω THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. AP4604I

Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature Fig 5. Forward Characteristic of Fig 6. Gate Threshold Voltage v.s. Reverse Diode Junction Temperature AP4604I 160 240 320 02468 1 0 V DS , Drain-to-Source Voltage (V) ID , Drain Current (A) T C =2 5o C 10V 9.0V 8.0V 7.0V V G =6.0V 120 160 200 02468 1 0 1 2 V DS , Drain-to-Source Voltage (V) ID , Drain Current (A) 10V 8.0V 7.0V 6.0V V G =5.0V T C = 175o C 456789 1 0 V GS Gate-to-Source Voltage (V) RDS(ON) (m I D =30A T C =25 o C 0.4 0.8 1.2 1.6 2.0 2.4 -100 -50 0 50 100 150 200 T j , Junction Temperature ( o C) Normalized RDS(ON) I D =30A V G =10V 100 V SD , Source-to-Drain Voltage (V) IS(A) T j =25 o CT j =175 o C 0.4 0.8 1.2 1.6 -100 -50 0 50 100 150 200 T j ,Junction Temperature ( o C) Normalized VGS(th) I D =1mA

Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance Fig 11. Drain Current v.s. Case Fig 12. Transfer Characteristics Temperature 0.001 0.01 0.1 t , Pulse Width (s) Normalized Thermal Response (Rthjc) PDM Duty factor = t/T Peak Tj = PDM x Rthjc + TC t T 0.02 0.01 0.05 0.1 0.2 Duty factor=0.5 Single Pulse 1000 2000 3000 4000 5000 6000 7000 1 1 12 13 14 15 1 V DS ,Drain-to-Source Voltage (V) C (pF) f=1.0MHz C iss C oss C rss 0 40 80 120 160 Q G , Total Gate Charge (nC) VGS , Gate to Source Voltage (V) I D =4 0A V DS =32V 0.1 100 1000 0.1 1 10 100 V DS , Drain-to-Source Voltage (V) ID (A) T C =25 o C Single Pulse 100us 1ms 10ms 100ms DC Operation in this area limited by RDS(ON) 120 160 25 75 125 175 T C , Case Temperature ( o C ) ID , Drain Current (A) 100 150 200 250 300 02468 1 0 V GS , Gate-to-Source Voltage (V) ID , Drain Current (A) T j =175 o C T j =25 o C V DS =5V T j = -55 o C

Fig 13. Normalized BVDSS v.s. Junction Fig 14. Total Power Dissipation Fig 15. Typ. Drain-Source on State Resistance 0 20 40 60 80 100 120 140 I D , Drain Current (A) RDS(ON) (m T j =25 o C V GS =10V 0 50 100 150 200 T C , Case Temperature( o C) PD, Power Dissipation(W) 0.4 0.8 1.2 1.6 -100 -50 0 50 100 150 200 T j , Junction Temperature ( o C) Normalized BVDSS I D =1mA

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