AP4405GM A-POWER | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 5

Technical content

Advanced Power P-CHANNEL ENHANCEMENT MODE Electronics Corp. POWER MOSFET ▼ Simple Drive Requirement BVDSS -30V ▼ Lower On-resistance RDS(ON) 8.2mΩ ▼ Fast Switching Characteristic ID -14A

Description

ID@TA=25℃ A ID@TA=70℃ A IDM A PD@TA=25℃ W TSTG ℃ TJ ℃ Symbol Value Unit Rthj-a Maximum Thermal Resistance, Junction-ambient 3 50 ℃/W Data and specifications subject to change without notice 200806201 AP4405GM Rating -30 +20 -14 Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Drain Current3 -11.3 Pulsed Drain Current1 -50 RoHS-compliat Product Thermal Data Parameter Total Power Dissipation 2.5 -55 to 150 Operating Junction Temperature Range -55 to 150 Storage Temperature Range Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The SO-8 package is widely preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. S S S G D D D D SO-8 G D S

Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Units BVDSS Drain-Source Breakdown Voltage V GS=0V, ID=-250uA -30 - - V RDS(ON) Static Drain-Source On-Resistance2 VGS=-10V, ID=-13A - - 8.2 m Ω VGS=-4.5V, ID=-10A - - 15 m Ω VGS(th) Gate Threshold Voltage V DS=VGS, ID=-250uA -1 - -3 V gfs Forward Transconductance V DS=-10V, ID=-10A - 10 - S IDSS Drain-Source Leakage Current VDS=-24V, VGS=0V - - -1 uA Drain-Source Leakage Current (Tj=70oC) VDS=-24V, VGS=0V - - -25 uA IGSS Gate-Source Leakage V GS=+20V - - + 100 nA Qg Total Gate Charge2 ID=-13A - 44 70 nC Qgs Gate-Source Charge V DS=-24V - 7 - nC Qgd Gate-Drain ("Miller") Charge V GS=-4.5V - 28 - nC td(on) Turn-on Delay Time2 VDS=-15V - 13 - ns tr Rise Time I D=-1A - 11 - ns td(off) Turn-off Delay Time R G=3.3Ω,VGS=-10V - 64 - ns tf Fall Time R D=15Ω -4 2- ns Ciss Input Capacitance V GS=0V - 3400 5440 pF Coss Output Capacitance V DS=-25V - 520 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 455 - pF Source-Drain Diode Symbol Parameter Test Conditions Min. Typ. Max. Units VSD Forward On Voltage2 IS=-2A, VGS=0V - - -1.2 V trr Reverse Recovery Time2 IS=-13A, VGS=0V, - 37 - ns Qrr Reverse Recovery Charge dI/dt=100A/µs - 35 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test 3.Surface mounted on 1 in 2 copper pad of FR4 board ; 125 ℃/W when mounted on Min. copper pad. THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. AP4405GM

Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature Fig 5. Forward Characteristic of Fig 6. Gate Threshold Voltage v.s. Reverse Diode Junction Temperature 001122 -V DS , Drain-to-Source Voltage (V) -ID , Drain Current (A) T A =2 5o C - 10 V - 7.0 V - 6.0 V - 5.0 V V G = - 4.0 V 001122 -V DS , Drain-to-Source Voltage (V) -ID , Drain Current (A) T A = 150o C - 10 V - 7.0 V - 6.0 V - 5.0 V V G = - 4.0 V 2468 1 0 -V GS , Gate-to-Source Voltage (V) RDS(ON) (m I D = - 10 A T A =25 ℃ 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -50 0 50 100 150 T j , Junction Temperature ( o C) Normalized RDS(ON) I D = - 13 A V G =-10V 1.4 1.8 2.2 2.6 -50 0 50 100 150 T j , Junction Temperature ( o C) -VGS(th) (V) -V SD , Source-to-Drain Voltage (V) -IS(A) T j =25 o CT j =150 o C

Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance Fig 11. Switching Time Waveform Fig 12. Gate Charge Waveform AP4405GM td(on) tr td(off)tf VDS VGS 10% 90% Q VG -4.5V QGS QGD QG Charge 1000 2000 3000 4000 1 5 9 13 17 21 25 29 -V DS , Drain-to-Source Voltage (V) C (pF) f=1.0MHz C iss C oss C rss 0 2 04 06 08 0 1 0 0 Q G , Total Gate Charge (nC) -VGS , Gate to Source Voltage (V) I D = -13A V DS = -24V 0.01 0.1 100 0.01 0.1 1 10 100 -V DS , Drain-to-Source Voltage (V) -ID (A) T A =25 o C Single Pulse 100us 1ms 10ms 100ms DC 0.001 0.01 0.1 0.0001 0.001 0.01 0.1 1 10 100 1000 t , Pulse Width (s) Normalized Thermal Response (Rthja) PDM Duty factor = t/T Peak Tj = PDM x Rthja + Ta Rthja=125oC/W t T 0.02 0.01 0.05 0.1 0.2 Duty factor=0.5 Single Pulse

Package Outline : SO-8 Millimeters SYMBOLS MIN NOM MAX A 1.35 1.55 1.75 A1 0.10 0.18 0.25 B 0.33 0.41 0.51 C 0.19 0.22 0.25 D 4.80 4.90 5.00 E1 3.80 3.90 4.00 E 5.80 6.15 6.50 L 0.38 0.71 1.27 θ 0 4.00 8.00 e 1.All Dimension Are In Millimeters. 2.Dimension Does Not Include Mold Protrusions. Part Marking Information & Packing : SO-8

1.27 TYP

ADVANCED POWER ELECTRONICS CORP. c DETAIL A A 4405GM YWWSSS Package CodePart Number DETAIL A L θ Date Code (YWWSSS) Y：Last Digit Of The Year WW：Week SSS：Sequence e B 5678 D E1 E meet Rohs requirement