AP3968 BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Primary Side Control for Eliminating Opto-coupler and Secondary CV/CC Control Circuitry
  • Built-in NPN Transistor with 700V CBO
  • Low Start-up Current: 0.2 µA (Typ.)
  • Internal Output Cable V oltage Drop Compensation
  • Random Frequency Modulation for Low EMI
  • Short Circuit Protection
  • Low Total Cost Solution
  • Output Power Range (Note 1): AP3968 for 5W Adapter AP3969 for 7.5W Adapter AP3970 for 12W Adapter AP3970S for 10W Adapter Note 1: Typical continuous power in a non-ventilated enclosed adapter measured at 50ºC ambient.

Applications

  • Chargers
  • Adapters
  • Set Top Boxes
  • Auxiliary Supplies
  • DVD
  • LED Driver

Figure 1. Package Types of AP3968/69/70/70S

Figure 2. Pin Configuration of AP3968/69/70/70S (Top View)

P r e l i m i n a r y D a t a s h e e t Primary Side Power Switcher for Off-line SMPS AP3968/69/70/70S Dec. 2011 Rev. 1. 4 BCD Semiconductor Manufacturing Limited Pin Description Pin Number SOIC-7/DIP-7 DIP-8 Pin Name Function 1 1 CPC This pin connects a capacitor to GND for output cable compensation 2 2 FB The voltage feedback from auxiliary winding 3 3 VCC This pin receives rectified voltage from the auxiliary winding of the transformer 4 4 CS Current sense for primary side of transformer 5,6 5,6 C This pin is connected with an internal power BJT’s collector

7 NC Not connected

7 8 GND This pin is the signal reference ground

Figure 3. Functional Block Diagram of AP3968/69/70/70S

P r e l i m i n a r y D a t a s h e e t Primary Side Power Switcher for Off-line SMPS AP3968/69/70/70S Dec. 2011 Rev. 1. 4 BCD Semiconductor Manufacturing Limited

Ordering Information

Range Part Number Marking ID Packing Type AP3968M-G1 AP3968M-G1 Tube SOIC-7 AP3968MTR-G1 AP3968M-G1 Tape & Reel AP3969P7-G1 AP3969P7-G1 Tube AP3970P7-G1 AP3970P7-G1 Tube DIP-7 AP3970SP7-G1 AP3970SP7-G1 Tube AP3969P-G1 AP3969P-G1 Tube AP3970P-G1 AP3970P-G1 Tube DIP-8 -40 to 85°C AP3970SP-G1 AP3970SP-G1 Tube BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green. G1: Green TR: Tape & Reel Blank: Tube Package M: SOIC-7 P7: DIP-7 P: DIP-8 68: AP3968 69: AP3969 70: AP3970 70S: AP3970S Circuit Type

P r e l i m i n a r y D a t a s h e e t Primary Side Power Switcher for Off-line SMPS AP3968/69/70/70S Dec. 2011 Rev. 1. 4 BCD Semiconductor Manufacturing Limited Absolute Maximum Ratings (Note 2) Parameter Symbol Value Unit Supply Voltage V CC -0.3 to 22 V FB Input Voltage V FB -1 to 10 V Collector-emitter Voltage V CBO 700 V AP3968/69 1.5 AP3970 4 Collector DC Current AP3970S 3.2 A Operating Junction Temperature T J 150 ºC Storage Temperature T STG -65 to 150 ºC Lead Temperature (Soldering, 10 sec) T LEAD 300 ºC ESD (Machine Model) 200 V ESD (Human Body Model) 2000 V Note 2: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Co nditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Recommended Operating Conditions Parameter Symbol Min Max Unit Supply V oltage V CC 22 V Operating Temperature Range T OP -40 85 °C Maximum Operating Frequency f MAX 60 kHz

P r e l i m i n a r y D a t a s h e e t Primary Side Power Switcher for Off-line SMPS AP3968/69/70/70S Dec. 2011 Rev. 1. 4 BCD Semiconductor Manufacturing Limited

Electrical Characteristics

VCC =15V , TJ=25°C, unless otherwise specified. Parameter Symbol Conditions Min Typ Max Unit UVLO Section Turn-on V oltage VON 13 15 17 V Turn-off V oltage VOFF No drive Current 4.5 5.3 6.3 V Standby Current Section Start-up Current I ST V CC=VON-0.5V 0.2 0.6 Operating Current I CC 320 435 550 µA Feedback Input Section FB Input Current I FB V FB=4V 1.5 3.5 5.5 µA FB Threshold V oltage V FB 4.23 4.3 4.37 V Power Transistor Section Collector-emitter Saturation V oltage VCE(SAT) AP3968/9: IC=0.5A AP3970/70S: IC=1A 0.3 V AP3968/69 14 17 DC Current Gain h FE AP3970/70S 17 26 Leakage Current I CEO 60 nA Over Temperature Protection Shutdown Temperature T SHDN Surface temperature 125 160 ºC Temperature Hysteresis 40 ºC Thermal Impedance Parameter Symbol Value Unit AP3968 80 AP3969 60 AP3970 45 Junction to Ambient θJA AP3970S 50 AP3968 40 AP3969 30 AP3970 22 Junction to Case θJC AP3970S 26 ºC/W

Figure 11. Typical Application of AP3969 (9V/800mA)

P r e l i m i n a r y D a t a s h e e t Primary Side Power Switcher for Off-line SMPS AP3968/69/70/70S Dec. 2011 Rev. 1. 4 BCD Semiconductor Manufacturing Limited Mechanical Dimensions S O I C - 7 U n i t : m m ( i n c h ) 3.800(0.150) 4.000(0.157) 1.270(0.050) TYP 4.700(0.185) 5.100(0.201) 0.330(0.013) 0.510(0.020) 0.190(0.007) 0.250(0.010) 0.100(0.004) 0.250(0.010) 1.350(0.053) 1.750(0.069) 0.450(0.017) 0.800(0.031)8° 5.800(0.228) 6.200(0.244) 2.54(0.100) TYP 1.250(0.049) 1.500(0.059) Note: Eject hole, oriented hole and mold mark is optional.

P r e l i m i n a r y D a t a s h e e t Primary Side Power Switcher for Off-line SMPS AP3968/69/70/70S Dec. 2011 Rev. 1. 4 BCD Semiconductor Manufacturing Limited Mechanical Dimensions (Continued) DIP-7 Unit: mm(inch) 8.400(0.331) 9.000(0.354) 0.204(0.008) 0.360(0.014) 7.320(0.288) 9.000(0.354) 9.400(0. 370) 3.710(0.146) 4.310(0.170) 3.000(0.118) 3.600(0.142) 2.540(0.100)BSC 6.200(0.244) 6.600(0.260) 3.200(0.126) 3.600(0.142) 0.510(0.020)MIN 1.524(0.060) BSC Note: Eject hole, oriented hole and mold mark is optional. 0.380(0.015) 0.570(0.022) 7.920(0. 312)

P r e l i m i n a r y D a t a s h e e t Primary Side Power Switcher for Off-line SMPS AP3968/69/70/70S Dec. 2011 Rev. 1. 4 BCD Semiconductor Manufacturing Limited Mechanical Dimensions (Continued) D I P - 8 U n i t : m m ( i n c h ) R0.750(0.030) 0.254(0.010)TYP 0.130(0.005)MIN 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014) 7.620(0.300)TYP 0.700(0.028) 9.000(0.354) 9.400(0.370) 3.710(0.146) 4.310(0.170) 3.000(0.118) 3.600(0.142) 0.360(0.014) 0.560(0.022) 2.540(0.100) TYP 6.200(0.244) 6.600(0.260) 3.200(0.126) 3.600(0.142) 0.510(0.020)MIN Φ3.000(0.118) Depth 0.100(0.004) 0.200(0.008) 1.524(0.060) TYP Note: Eject hole, oriented hole and mold mark is optional.

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277