AP384XC BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Low Start-up Current: 50µA
  • Robust VREF Line/Load Regulation Low Line Regulation : 4mV Low Load Regulation : 4mV
  • High Stability of Reference V oltage over a Full Temperature Range: 0.2mV/ oC
  • Operating Frequency up to 500KHz
  • High PWM Frequency Stability over a Full Tem- perature Range: 2.5%
  • High PWM Frequency Stability under a Full Sup- ply V oltage Range: 0.2%
  • Accurate Over-temperature Protection with Hys- teresis
  • UVLO with Hysteresis

Applications

  • Off-line Converter
  • DC-DC Converter
  • V oltage Adapter
  • CRT Monitor Power Supply
  • Desktop Power Supply
  • DVD/STB Power Supply SOIC-8 DIP-8

Figure 1. Package Types of AP3842C/3C/4C/5C

Figure 2. Pin Configuration of AP3842C/3C/4C/5C (Top View) 1 COMP This pin is the Error Amplifier output and is made available for loop compensation. power supply output through a resistor divider. this information to terminate the output switch conduction. 5 GND The combined control circuitry and power ground. sourced and sunk by this pin. CC The positive supply of the control IC.

8 VREF

7 VCC

6 OUTPUT

5 GND

Figure 3. Functional Block Diagram of AP3842C/3C/4C/5C

CURRENT MODE PWM CONTROLLER AP384XC Data Sheet Sep. 2006 Rev. 1. 1 BCD Semiconductor Manufacturing Limited Package Tempera- ture Range Part Number Marking ID Packing TypeTin Lead Lead Free Tin Lead Lead Free SOIC-8 -40 to 85oC AP3842/3/4/5CM AP3842/3/4/5CM-E1 3842/3/4/5CM 3842/3/4/5CM-E1 Tube AP3842/3/4/5CMTR AP3842/3/4/5CMTR-E1 384 2/3/4/5CM 3842/3/4/5CM-E1 Tape & Reel DIP-8 -40 to 85oC AP3842/3/4/5CP AP3842/3/4/5CP-E1 AP3842/3/4/5CP AP3842/3/4/5CP-E1 Tube BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Circuit Type Package P: DIP-8 M: SOIC-8 E1: Lead Free Blank: Tin Lead AP384XC - TR: Tape and Reel Blank: Tube

Ordering Information

CURRENT MODE PWM CONTROLLER AP384XC Data Sheet Sep. 2006 Rev. 1. 1 BCD Semiconductor Manufacturing Limited Parameter Symbol Value Unit Supply V oltage V CC 30 V Output Current I O ± 1 A Analog Inputs V(ANA) -0.3 to 6.3 V Error Amp Output Sink Current I SINK(E.A) 10 mA Power Dissipation at TA< 25 oC (DIP-8) PD (Note 3) 1000 mW Power Dissipation at TA<25 oC (SOIC-8) PD (Note 3) 460 mW Junction Operating Temperature T J -40 to 150 oC Thermal Resistance (Junction to Ambient) DIP-8 RθJA 140 oC/W SOIC-8 160 oC/W Storage Temperature Range T STG -65 to 150 oC Lead Temperature (Soldering, 10sec) T LEAD +300 oC ESD (Machine Mode) 250 V Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indi- cated under "Recommended Operat ing Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability. Note 2: All voltages are with respect to pin 5 and all currents are positive into specified terminal. Note 3: Board thickness 1.6mm, board dimension 90mm x 90mm. Parameter Symbol Min Max Unit Oscillation Frequency f 500 KHz Ambient Temperature TA -40 85 oC Recommended Operating Conditions Absolute Maximum Ratings (Note 1, 2)

CURRENT MODE PWM CONTROLLER AP384XC Data Sheet Sep. 2006 Rev. 1. 1 BCD Semiconductor Manufacturing Limited Parameter Symbol Conditions Min Typ Max Unit REFERENCE SECTION Reference Output V oltage V REF TJ=25oC, IREF=1mA 4.90 5.00 5.10 V Total Output Variation Line, Load, Temp. 4.82 5.18 V Line Regulation ∆VREF 12V ≤ VCC ≤25V 4 15 mV Load Regulation ∆VREF 1mA ≤ IREF ≤20mA 4 15 mV Short Circuit Output Current I SC TA=25oC -100 -180 mA Temperature Stability 0.2 0.4 mV/oC OSCILLATOR SECTION Oscillation Frequency f TJ=25oC 47 52 57 KHz Oscillator Amplitude V OSC Pin 4, peak to peak (Note 6) 1.7 V Temperature Stability (Note 6) 2.5 % V oltage Stability 12V ≤ V CC ≤ 25V 0.2 1 % Discharge Current Vpin 4 =2V(Note 7) 8.5 9.5 10.5 mA ERROR AMPLIFIER SECTION Input V oltage V I Vpin 1=2.5V 2.45 2.50 2.55 V Output Sink Current I SINK Vpin1=1.1V 5 8 mA Output Source Current I SOURCE Vpin1=5V -0.5 -0.8 mA High Output V oltage V OH RL=15kΩ to GND 5 7 V Low Output V oltage V OL RL=15kΩ to pin 8 0.7 1.1 V V oltage Gain 2V ≤ VO ≤ 4V 65 90 dB Power Supply Rejection Ratio PSRR 12V ≤ VCC ≤ 25V 60 70 dB CURRENT SENSE SECTION Maximum Input Signal V I(MAX) Vpin1=5V(Note 4) 0.9 1 1.1 V Gain GV (Note 4, 5) 2.85 3 3.15 V/V Power Supply Rejection Ratio PSRR 12V ≤ VCC ≤ 25V (Note 4, 6) 70 dB Delay to Output Vpin3 = 0 to 2V (Note 6) 150 300 ns Input Bias Current I BIAS -3 -10 µA OUTPUT SECTION Low Output V oltage VOL ISINK = 20mA 0.1 0.4 V ISINK = 200mA 1.4 2.2 V High Output V oltage VOH ISOURCE = 20mA 13 14 V ISOURCE = 200mA 12 13 V Rise Time t R TJ=25oC, CL=1nF (Note 6) 50 150 ns Fall Time t F TJ=25oC, CL=1nF (Note 6) 50 150 ns (VCC=15V , RT=10kΩ CT=3.3nF, TA= -40 to 85oC, unless otherwise specified.)

Electrical Characteristics

Figure 4. Basic Test Circuit Note 6: These parameters, although guaranteed, are not 100% tested in production. Note 7: This parameter is measured with RT=10kΩ to VREF, it contributes 0.3mA of current to the measured value. So the total current flowing into the CT pin will be 0.3mA higher than the measured value approximately. Note 4: Parameters are tested at trip point of latch with Vpin2 = 0.

Figure 9. Error Amplifier Open-Loop Frequency Response Figure 10. Start-up Current vs. Ambient Temperature

Figure 11. Typical Application of AP3842C/3C/4C/5C

CURRENT MODE PWM CONTROLLER AP384XC Data Sheet Sep. 2006 Rev. 1. 1 BCD Semiconductor Manufacturing Limited Mechanical Dimensions Unit: mm(inch) R0.150(0.006) R0.150(0.006) 1.000(0.039) 0.330(0.013) 0.510(0.020) 4.800(0.189) 1.750(0.069) 0.100(0.004) 0.300(0.012) 0.900(0.035) 0.800(0.031) 0.200(0.008) 3.800(0.150) 4.000(0.157) 20:1 D 1.270(0.050) TYP 0.190(0.007) 0.250(0.010) D 5.800(0.228) 6.200(0.244) 0.675(0.027) 0.725(0.029) 0.320(0.013) φ SOIC-8

CURRENT MODE PWM CONTROLLER AP384XC Data Sheet Sep. 2006 Rev. 1. 1 BCD Semiconductor Manufacturing Limited Mechanical Dimensions (Continued) DIP-8 Unit: mm(inch) R0.750(0.030) 0.254(0.010)TYP 0.130(0.005)MIN 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014) 7.620(0.300)TYP 0.700(0.028) 9.000(0.354) 9.400(0.370) 3.710(0.146) 4.310(0.170) 3.000(0.118) 3.600(0.142) 0.360(0.014) 0.560(0.022) 6.600(0.260) 3.200(0.126) 3.600(0.142) 0.510(0.020)MIN Φ3.000(0.118) Depth 0.100(0.004) 0.200(0.008) 1.524(0.060) TYP

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951, Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808, Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 3170 De La Cruz Blvd., Suite 105, Santa Clara, CA 95054-2411, U.S.A - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com