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Technical content

Features

  • Low Start-up Current: 50μA
  • Robust VREF Line/Load Regulation Low Line Regulation : 4mV Low Load Regulation : 4mV
  • High Stability of Reference V oltage over a Full Temperature Range: 0.2mV/ oC
  • Operating Frequency up to 500kHz
  • High PWM Frequency Stability over a Full Tem- perature Range: 2.5%
  • High PWM Frequency Stability under a Full Sup- ply V oltage Range: 0.2%
  • Accurate Over-temperature Protection with Hys- teresis
  • UVLO with Hysteresis

Applications

  • Off-line Converter
  • DC-DC Converter
  • V oltage Adapter
  • CRT Monitor Power Supply
  • Desktop Power Supply
  • DVD/STB Power Supply SOIC-8 DIP-8

Figure 1. Package Types of AP3842C/3C/4C/5C

Figure 2. Pin Configuration of AP3842C/3C/4C/5C (Top View) 1 COMP This pin is the Error Amplifier output and is made available for loop compensation. power supply output through a resistor divider. this information to terminate the output switch conduction. 5 GND The combined control circuitry and power ground. sourced and sunk by this pin. 7V CC The positive supply of the control IC.

Figure 3. Functional Block Diagram of AP3842C/3C/4C/5C

CURRENT MODE PWM CONTROLLER AP384XC Data Sheet Jul. 2013 Rev. 2. 0 BCD Semiconductor Manufacturing Limited Package Tempera- ture Range Part Number Marking ID Packing TypeLead Free Green Lead Free Green SOIC-8 -40 to 85oC AP3842/3/4/5CM-E1 AP3842/3/4/5CM-G1 3842/3/4/5CM-E1 3842/3/4/5CM-G1 Tube AP3842/3/4/5CMTR-E1 AP3842/3/4/5CMTR-G1 3842/3/4/5CM-E1 3842/3/4/5CM-G1 Tape & Reel DIP-8 AP3842/3/4/5CP-E1 AP3842/3/4/5CP-G1 AP3842/3/4/5CP-E1 AP3842/3/4/5CP-G1 Tube Circuit Type Package P: DIP-8 M: SOIC-8 E1: Lead Free AP384XC - TR: Tape and Reel Blank: Tube

Ordering Information

G1: Green BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with "G1" suffix are available in green packages. 2: AP3842C 3: AP3843C 4: AP3844C 5: AP3845C

CURRENT MODE PWM CONTROLLER AP384XC Data Sheet Jul. 2013 Rev. 2. 0 BCD Semiconductor Manufacturing Limited Parameter Symbol Value Unit Supply V oltage VCC 30 V Output Current IO ± 1 A Analog Inputs V(ANA) -0.3 to 6.3 V Error Amp Output Sink Current I SINK(E.A) 10 mA Power Dissipation at TA< 25 oC (DIP-8) PD (Note 3) 1000 mW Power Dissipation at TA<25 oC (SOIC-8) PD (Note 3) 460 mW Junction Operating Temperature TJ -40 to 150 oC Thermal Resistance (Junction to Ambient) θJA DIP-8 140 oC/W SOIC-8 160 oC/W Storage Temperature Range TSTG -65 to 150 oC Lead Temperature (Soldering, 10sec) T LEAD +300 oC ESD (Machine Model) 250 V Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indi- cated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability. Note 2: All voltages are with respect to pin 5 and all currents are positive into specified terminal. Note 3: Board thickness 1.6mm, board dimension 90mm x 90mm. Parameter Symbol Min Max Unit Oscillation Frequency f 500 KHz Ambient Temperature TA -40 85 oC Recommended Operating Conditions Absolute Maximum Ratings (Note 1, 2)

CURRENT MODE PWM CONTROLLER AP384XC Data Sheet Jul. 2013 Rev. 2. 0 BCD Semiconductor Manufacturing Limited Parameter Symbol Conditions Min Typ Max Unit REFERENCE SECTION Reference Output V oltage V REF TA=25oC, IREF=1mA 4.90 5.00 5.10 V Total Output V ariation Line, Load, Temp. 4.82 5.18 V Line Regulation ΔVREF 12V ≤ VCC ≤25V 4 15 mV Load Regulation ΔVREF 1mA ≤ IREF ≤20mA 4 15 mV Short Circuit Output Current I SC TA=25oC -100 -180 mA Temperature Stability (Note 6) 0.3 mV/oC OSCILLATOR SECTION Oscillation Frequency f T A=25oC 47 52 57 KHz Oscillator Amplitude V OSC Pin 4, peak to peak (Note 6) 1.7 V Temperature Stability (Note 6) 2.5 % V oltage Stability 12V ≤ VCC ≤ 25V 0.2 1 % Discharge Current Vpin 4 =2V(Note 7) 8.5 9.5 10.5 mA ERROR AMPLIFIER SECTION Input Voltage V I Vpin 1=2.5V 2.45 2.50 2.55 V Output Sink Current ISINK Vpin1=1.1V 5 8 mA Output Source Current ISOURCE Vpin1=5V -0.5 -0.8 mA High Output V oltage VOH RL=15kΩ to GND 5 7 V Low Output V oltage V OL RL=15kΩ to pin 8 0.7 1.1 V V oltage Gain 2V ≤ VO ≤ 4V 65 90 dB Power Supply Rejection Ratio PSRR 12V ≤ VCC ≤ 25V 60 70 dB CURRENT SENSE SECTION Maximum Input Signal V I(MAX) Vpin1=5V(Note 4) 0.9 1 1.1 V Gain GV (Note 4, 5) 2.85 3 3.15 V/V Power Supply Rejection Ratio PSRR 12V ≤ VCC≤ 25V (Note 4, 6) 70 dB Delay to Output Vpin3 = 0 to 2V (Note 6) 150 300 ns Input Bias Current I BIAS -3 -10 μA OUTPUT SECTION Low Output V oltage VOL ISINK = 20mA 0.1 0.4 V ISINK = 200mA 1.4 2.2 V High Output V oltage VOH ISOURCE = 20mA 13 14 V ISOURCE = 200mA 12 13 V Rise Time tR TA=25oC, CL=1nF (Note 6) 50 150 ns Fall Time t F TA=25oC, CL=1nF (Note 6) 50 150 ns (VCC=15V , RT=10kΩ CT=3.3nF, TA=25oC, unless otherwise specified.)

Electrical Characteristics

Note 6: These parameters, although guaranteed, are not 100% tested in production. Note 7: This parameter is measured with RT=10kΩ to VREF, it contributes 0.3mA of current to the measured value. So the total current flowing into the CT pin will be 0.3mA higher than the measured value approximately. Note 4: Parameters are tested at trip point of latch with Vpin2 = 0. Figure 4. Basic Test Circuit

Figure 12. Typical Application of AP3842C/3C/4C/5C

CURRENT MODE PWM CONTROLLER AP384XC Data Sheet Jul. 2013 Rev. 2. 0 BCD Semiconductor Manufacturing Limited Mechanical Dimensions SOIC-8 Unit: mm(inch) 0 ° 8 ° 1 ° 7 ° R0.150(0.006) R0.150(0.006) 1.000(0. 039) 0.300(0.012) 0.510(0.020) 1.350(0.053) 1.750(0.069) 0.100(0.004) 0.300(0.012) 0.900(0.035) 3.800(0.150) 4.000(0.157) 7 ° 7 ° 20:1 D 1.270(0.050) TYP 0.150(0. 006) 0.250(0. 010) 8 ° D 5.800(0.228) 6.200(0.244) 0.675(0.027) 0.725(0.029) 0.320(0.013) 8 ° 0.450(0.017) 0.800(0.031) 4.700(0.185) 5.100(0.201) Note: Eject hole, oriented hole and mold mark is optional . Option 1 Option 1 Option 2 0.350(0.014) TYP TYP TYP TYP

CURRENT MODE PWM CONTROLLER AP384XC Data Sheet Jul. 2013 Rev. 2. 0 BCD Semiconductor Manufacturing Limited Mechanical Dimensions (Continued) Unit: mm(inch)DIP-8 R0.750(0.030) 0.254(0.010)TYP 0.130(0.005)MIN 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014) 7.620(0.300)TYP 0.700(0.028) 9.000(0.354) 9.600(0.378) 3.710(0.146) 4.310(0.170) 3.000(0.118) 3.600(0.142) 0.360(0.014) 0.560(0.022) 2.540(0.100) TYP 6.200(0.244) 6.600(0.260) 3.200(0.126) 3.600(0.142) 0.510(0.020)MIN Φ3.000(0.118) Depth 0.100(0.004) 0.200(0.008) 1.524(0.060) TYP Note: Eject hole, oriented hole and mold mark is optional.

CURRENT MODE PWM CONTROLLER AP384XC Data Sheet Jul. 2013 Rev. 2. 0 BCD Semiconductor Manufacturing Limited Mounting Pad Layout Unit: mm(inch)SOIC-8 Dimensions Z (mm)/(inch) G (mm)/(inch) X (mm)/(inch) Y (mm)/(inch) E (mm)/(inch) Grid placement courtyard Z G Y EX

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277 IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yishan Road, Shanghai 200233, China

Tel: +021-6485-1491, Fax: +86-021-5450-0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203,Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District Shenzhen 518057, China Tel: +86-0755-8660-4900, Fax: +86-0755-8660-4958 Taiwan Office (Taipei) BCD Semiconductor (Taiwan) Company Limited Tel: +886-2-2656 2808 Fax: +886-2-2656-2806/26562950 Taiwan Office (Hsinchu) BCD Semiconductor (Taiwan) Company Limited 8F, No.176, Sec. 2, Gong-Dao 5th Road, East District HsinChu City 300, Taiwan, R.O.C Tel: +886-3-5160181, Fax: +886-3-5160181 - Headquarters BCD (Shanghai) Micro-electronics Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, P. R.C. Tel: +86-021-2416-2266, Fax: +86-021-2416-2277 USA Office BCD Semiconductor Corp.

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