AP3768 BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Primary Side Control for Eliminating Opto-cou- pler and Secondary CV/CC Control Circuitry
  • 30mW No-load Input Power
  • Programmable Output Cable V oltage Drop Com- pensation
  • Proprietary CC Tightening Technique to Achieve Vertical CC Profile
  • Compensation for External Component Tempera- ture Variations
  • Flyback Topology in DCM Operation
  • Random Frequency Adjustment to Reduce Sys- tem EMI
  • Built-in Soft Start
  • Over V oltage Protection
  • Short Circuit Protection
  • SOIC-8 Package

Applications

  • Adapter/Chargers for Cell/Cordless Phones, PDAs, MP3 and Other Portable Apparatus
  • LED Driver
  • Standby and Auxiliary Power Supplies

Figure 1. Package Type of AP3768

1 CS The primary current sense

2 VCC Supply voltage

3 OUT This pin drives the base of external power NPN switch

4 GND Ground

5 CPC This pin connects a capac itor for output cable compensation

6 FB The voltage feedback from the auxiliary winding

7 CPR Connects a resistor to FB pin fo r adjustable output cable compensation

8 BIAS This pin sets the bias current inside AP3768 with an external resistor to GND

Figure 2. Pin Configuration of AP3768 (Top View)

Figure 3. Functional Block Diagram of AP3768

LOW-POWER OFF-LINE PRIMARY SIDE REGULATION CONTROLLER AP3768 Preliminary Datasheet BCD Semiconductor Manufacturing LimitedAug. 2010 Rev. 1. 0 Parameter Value Unit V oltage at VCC Pin to GND -0.3 to 36 V V oltage at CS, OUT to GND -0.3 to 7 V FB input -40 to 10 V Output Current at OUT Internally limited A Operating Junction Temperature 150 oC Storage Temperature -65 to 150 oC Lead Temperature (Soldering, 10s) 300 oC Thermal Resistance Junction-to-Ambient 190 oC/W ESD (Machine Model) 200 V ESD (Human Body Model) 2000 V Note 1: Stresses greater than those li sted under "Absolute Maximum Ratings" may cause permanen t damage to the device. These are stress ratings only, and functiona l operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absol ute Maximum Ratings" for extended periods may affect device reliability. Absolute Maximum Ratings (Note 1) BCD Semiconductor's products, as designated with "G1" suffix in the part number, are RoHS compliant and Green.

Ordering Information

TR: Tape and ReelPackage M: SOIC-8 G1: Green Package Temperature Range Part Number Marking ID Packing Type SOIC-8 -40 to 85oC AP3768M-G1 3768M-G1 Tube AP3768MTR-G1 3768M-G1 Tape & Reel Blank: Tube

LOW-POWER OFF-LINE PRIMARY SIDE REGULATION CONTROLLER AP3768 BCD Semiconductor Manufacturing LimitedAug. 2010 Rev. 1. 0 Preliminary Datasheet Parameter Symbol Conditions Min Typ Max Unit UVLO SECTION Start-up Threshold VTH (ST) 17 18.5 21 V Minimal Operating V oltage V OPR(min) 8.2 9.2 10.2 V Reference Voltage BIAS Pin V oltage VBIAS RBIAS=200kΩ, After Turn On 1.0 1.1 1.2 V STANDBY CURRENT SECTION Start-up Current IST VCC=VTH (ST)-0.5V , RBIAS=200kΩ, Before start-up 0.6 µA Operating Current I CC(OPR) RBIAS=200kΩ 390 480 µA DRIVE OUTPUT SECTION OUT Maximum Current Source I OUT RBIAS=200kΩ 28 36 44 mA CURRENT SENSE SECTION Current Sense Threshold VCS 490 513 535 mV Pre-Current Sense VCS(PRE) 390 413 435 mV Leading Edge Blanking 500 ns FEEDBACK INPUT SECTION Feedback Pin Input Leakage Current IFB VFB=4V 1.8 2.4 3.0 µA Feedback Threshold VFB 3.97 4.03 4.09 V Enable Turn-on V oltage VFB(EN) -2.0 -1.7 -1.4 V OUTPUT VOLTAGE COMPENSATION SECTION CPR V oltage VCPR Dons (Tons/T): from 55% to 0.02% 1.5 3.5 V CPR Sink Current I CPR 200 µA PROTECTION SECTION Over V oltage Protection VFB(OVP) 789 V (VCC=15V , TA=25oC, unless otherwise specified.)

Electrical Characteristics

Figure 11. 5V/0.7A Output for Battery Charger of Mobile Phone

LOW-POWER OFF-LINE PRIMARY SIDE REGULATION CONTROLLER AP3768 BCD Semiconductor Manufacturing LimitedAug. 2010 Rev. 1. 0 Preliminary Datasheet Mechanical DimensionsMechanical Dimensions Unit: mm(inch)SOIC-8 φ R0.150(0.006) R0.150(0.006) 1.000(0.039) 0.330(0.013) 0.510(0.020) 1.350(0.053) 1.750(0.069) 0.100(0.004) 0.300(0.012) 0.900(0.035) 0.800(0.031) 0.200(0.008) 3.800(0.150) 4.000(0.157) 20:1 D 1.270(0.050) TYP 0.190(0.007) 0.250(0.010) D 5.800(0.228) 6.200(0.244) 0.675(0.027) 0.725(0.029) 0.320(0.013) 0.450(0.017) 0.800(0.031) 4.700(0.185) 5.100(0.201) Note: Eject hole, oriented hole and mold mark is optional.

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277