AP3766B BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Primary Side Control for Tight Constant Current and Constant V oltage
  • 30mW No-load Input Power
  • Bipolar Junction Transistor (BJT) Driving
  • Open Circuit Protection
  • Over V oltage Protection
  • Short Circuit Protection
  • SOT-23-6 Package

Applications

  • LED Driver

Figure 1. Package Type of AP3766B

Figure 2. Pin Configuration of AP3766B (Top View)

1 OUT

3 VCC

6 FB The CV and CC regulation are realized based on the voltage

Figure 3. Functional Block Diagram of AP3766B

P r e l i m i n a r y D a t a s h e e t L o w - P o w e r O f f - l i n e P S R L E D C o n t r o l l e r A P 3 7 6 6 B Nov. 2012 Rev. 1.0 BC D Semiconductor Manufacturing Limited

Ordering Information

Range Part Number Marking ID Packing Type SOT-23-6 -40 to 85°C AP3766BK6TR-G1 GGO Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green. Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Supply Voltage V CC -0.3 to 30 V CS to GND Voltage -0.3 to 7 V FB Input Voltage V FB -40 to 10 V Source Current at OUT Pin ISOURCE Internally Limited A Operating Junction Temperature T J 150 ºC Storage Temperature T STG -65 to 150 ºC Lead Temperature (Soldering, 10 sec) TLEAD 300 ºC Thermal Resistance (Junction to Ambient) θJA 200 ºC/W ESD (Human Body Model) 2000 V Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional op eration of the device at these or any other conditions beyond those indicated under “Recommended Operating Co nditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. G1: Green TR: Tape & Reel Package K6: SOT-23-6 Circuit Type

P r e l i m i n a r y D a t a s h e e t L o w - P o w e r O f f - l i n e P S R L E D C o n t r o l l e r A P 3 7 6 6 B Nov. 2012 Rev. 1.0 BC D Semiconductor Manufacturing Limited

Electrical Characteristics

VCC =15V , TA=25°C, unless otherwise specified. Parameter Symbol Conditions Min Typ Max Unit UVLO SECTION Startup Threshold V TH (ST) 13 15.5 18 V Minimal Operating V oltage V OPR(MIN) 3 3.5 4.5 V STANDBY CURRENT SECTION Startup Current I ST VCC=VTH (ST)-1V , Before startup 0 0.2 0.6 µA Operating Current I CC(OPR) Static current 250 500 600 DRIVE OUTPUT SECTION Output Current Sink I SINK Apply 1V @OUT pin 200 300 500 mA Source I SOURCE 24 30 45 mA CURRENT SENSE SECTION Current Sense Threshold V oltage VCS 440 500 550 mV Equivalent Current Sense V oltage Accuracy (Note 2) ∆VCS, eq VCS, eq -3 3 % Leading Edge Blanking t LEB The minimum power switch turn on time 300 475 720 ns FEEDBACK INPUT SECTION Input Resistance of FB Pin R FB V FB=4V 1 1.6 2 MΩ Feedback Threshold V FB 3.70 3.974 4.21 V LINE COMPENSATION SECTION Line Compensation Transconductance (Note 3) gm 1.14 1.43 1.72 µS PROTECTION SECTION Over V oltage Protection V FB(OVP) 6.5 7.5 8.5 V Maximum On Time of Primary Side tonp (MAX) 11 18 50 µs Note 2: The output current is given by: Note 3: Line compensation voltage on CS pin: LINEm PRI AUX DCINCS RgRR R N NVV ⋅⋅+⋅⋅= S P OUT N N RI ×= CS CS eq ,V

Figure 15. Typical LED Driver Application

P r e l i m i n a r y D a t a s h e e t L o w - P o w e r O f f - l i n e P S R L E D C o n t r o l l e r A P 3 7 6 6 B Nov. 2012 Rev. 1.0 BC D Semiconductor Manufacturing Limited Mechanical Dimensions SOT-23-6 Unit: mm(inch) 2.820(0.111) 3.020(0.119) 2.650(0.104) 2.950(0.116) 1.500(0.059) 1.700(0.067) 0.950(0.037)TYP 1.800(0.071) 2.000(0.079) 0.300(0.012) 0.400(0.016) 0.700(0.028)REF 0.100(0.004) 0.200(0.008) 0.200(0.008) 0.300(0.012) 0.600(0.024) 0.000(0.000) 0.150(0.006) 0.900(0.035) 1.300(0.051) 1.450(0.057) MAX 123 456 Pin 1 Mark

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277