AP3606 BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Regulated Output Current with ±3% Matching
  • Drives up to 4 WLEDs at 20mA Each (AP3606) Drives up to 6 WLEDs at 20mA Each (AP3607)
  • 16 Steps Brightness Control Using Pulse Signal Dimming
  • Wide Operating V oltage Range: 2.7V to 5.5V
  • High Operating Frequency: 1MHz
  • Auto 1x/1.5x Charge Pump Mode Selection
  • Built-in Soft-start
  • Output Over V oltage Protection
  • Built-in UVLO
  • Built-in OTSD
  • Operating Temperature Range: -40°C to 85°C

Applications

  • Mobile Phone
  • PDA
  • MP3/4

Figure 1. Package Type of AP3606/AP3607

Note: Pin 15 should be connected with Pin 16 on PCB Board. Note: Pin 14 should be connected with Pin 16 on PCB Board. Figure 2. Pin Configuratio n of AP3606/AP3607 (Top View) shutdown mode. It is used for digital dimming by applying a pulse signal on it.

4 Channels Current Sink16 Steps Pulse

16 Steps Pulse

6 Channels Current Sink

Figure 3. Functional Block Diagram of AP3606/AP3607

P r e l i m i n a r y D a t a s h e e t 4/6 CHANNEL CHARGE PUMP CURRENT SINK FOR LED DRIVER AP3606/AP3607 Dec. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

Ordering Information

C i r c u i t T y p e G 1 : G r e e n Package Temperature Range Part Number Marking ID Packing Type AP3606FNTR-G1 B1B QFN-3×3-16 -40 to 85°C AP3607FNTR-G1 B1C Tape & Reel BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with "G1" suffix are available in green package. Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Input V oltage V IN -0.3 to 6 V VOUT Pin V oltage (VOUT1 & VOUT2) V OUT -6 to 0.3 V EN Pin V oltage V EN -0.3 to 6 V C1+, C2+ Pin V oltage V C+ -0.3 to 6 V C1-, C2- Pin V oltage V C- -6 to 0.3 V D1, D2, D3, D4 Pin V oltage AP3606 D1, D2, D3, D4, D5, D6 Pin V oltage AP3607 VD V OUT to VIN V Thermal Resistance (Junction to Ambient, No Heat Sink, Free Air) θJA 60 ºC/W Operating Junction Temperature TJ 150 ºC Storage Temperature TSTG -65 to 150 ºC Lead Temperature (Soldering, 10sec) TLEAD 260 ºC Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. TR: Tape and Reel 06: AP3606 07: AP3607 Package FN: QFN-3×3-16

P r e l i m i n a r y D a t a s h e e t 4/6 CHANNEL CHARGE PUMP CURRENT SINK FOR LED DRIVER AP3606/AP3607 Dec. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited Recommended Operating Conditions Parameter Symbol Min Max Unit Input V oltage V IN 2.7 5.5 V Operating Ambient Temperature T A -40 85 ºC

Electrical Characteristics

VIN=3.6V , VEN=VIN, TA=25ºC, CIN=C1=C2=COUT=1µF, VF(forward voltage)=3.2V , unless otherwise noted. Parameter Symbol Conditions Min Typ Max Unit Input Section Input V oltage V IN I D=0mA to 80mA 2.7 5.5 V Under V oltage Lockout Threshold V IN Falling 2.2 V Under V oltage Lockout Hysteresis 250 mV Supply Current I CC No Load 1.7 3 mA Shutdown Supply Current I SHDN V EN=GND 3 10 µA Charge Pump Section Switch Frequency f OSC V IN=3.0V , 1.5x Mode 0.7 1 1.3 MHz AP3606 VD=3.2V , ID1=ID2=ID3=ID4=20mA 1x Mode to 1.5x Mode Transition V oltage (V IN Falling) V1.5X AP3607 VD=3.2V , ID1=ID2=ID3=ID4= ID5=ID6=20mA 3.5 3.6 V AP3606 VD=3.2V , ID1=ID2=ID3=ID4=20mA 1.5x Mode to 1x Mode Transition V oltage (V IN Rising) V1X AP3607 VD=3.2V , ID1=ID2=ID3=ID4= ID5=ID6=20mA 3.7 3.8 V Current Source Section WLED Current I D 100% Setting, 3.0V≤VIN≤5.0V TA=-40ºC to 85ºC 18.5 20 21.5 mA

P r e l i m i n a r y D a t a s h e e t 4/6 CHANNEL CHARGE PUMP CURRENT SINK FOR LED DRIVER AP3606/AP3607 Dec. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited Electrical Characteristics (Continued) VIN=3.6V , VEN=VIN, TA=25ºC, CIN=C1=C2=COUT=1µF, VF(forward voltage)=3.2V , unless otherwise noted. Parameter Symbol Conditions Min Typ Max Unit AP3606 VD1=VD2=VD3=VD4= 3.2V Current Matching Between any Two Outputs ID-Match1 AP3607 VD1=VD2=VD3=VD4= VD5=VD6=3.2V -3 3 % AP3606 VD1=VD2=VD3=VD4=3.0 V to 4.0V V IN=3.2V to 5.0V Current Matching Between any Two Outputs ID-Match2 AP3607 VD1=VD2=VD3=VD4= VD5=VD6=3.0V to 4.0V VIN=3.2V to 5.0V -3.5 3.5 % Enable Section EN High Level Threshold V oltage V IH 1.5 V EN Low Level Threshold V oltage V IL 0.5 V EN Input Current I EN V EN= 0V to 5V 1 10 µA EN Low to Shutdown Delay t SHDN 1 ms EN Low Time for Dimming t LO 0.45 500 µs EN High Time for Dimming t HI 0.45 µs Total Device AP3606 I D=80mA Total Soft-start Time t SS AP3607 I D=120mA Total 200 µs AP3606 VIN=3.2V , ID=80mA Total 200 Inrush Current I INRUSH AP3607 VIN=3.2V , ID=120mA Total 320 mA Over V oltage Protection V OVP Note 2 5.5 V Thermal Shutdown T OTSD 160 ºC Thermal Shutdown Hysteresis T HYS 20 ºC Thermal Resistance (Junction to Case) θJC QFN-3×3-16 15 ºC/W Note 2: Open circuit at any WLED that is programmed to be in the on state.

TA=25ºC, CIN=C1=C2=COUT=1µF, VF=3.2V , unless otherwise noted. Figure 28. 1x Mode Dimming Operation Figure 29. 1x Mode Dimming Operation

Figure 32. Digital Dimming Operating Diagram of AP3606/AP3607 brightness if a pulse is added to EN pin then.

P r e l i m i n a r y D a t a s h e e t 4/6 CHANNEL CHARGE PUMP CURRENT SINK FOR LED DRIVER AP3606/AP3607 Dec. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited Typical Application

3 WLEDs

4 WLEDs

5 WLEDs

6 WLEDs

Figure 33. Typical Applications of AP3606/AP3607 Detailed application information, please refer to AP3606/AP3607 application note.

P r e l i m i n a r y D a t a s h e e t 4/6 CHANNEL CHARGE PUMP CURRENT SINK FOR LED DRIVER AP3606/AP3607 Dec. 2008 Rev. 1. 2 BCD Semiconductor Manufacturing Limited Mechanical Dimensions QFN-3×3-16 Unit: mm(inch)

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen, 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277