AP3410 BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • High Efficiency Buck Power Converter
  • Wide Input V oltage Range: 2.5V to 5.5V
  • Adjustable Output V oltage: 0.6V to 0.9×V IN
  • Low R DS(ON) Internal Switches:200mΩ (VIN=5V)
  • Built-in Power Switches for Synchronous Rectification with High Efficiency
  • Output Current: 1.2A
  • Feedback V oltage: 600mV
  • 1.5MHz Constant Frequency Operation
  • Thermal Shutdown Protection
  • Low Dropout Operation at 100% Duty Cycle
  • No Schottky Diode Required
  • Input Over V oltage Protection
  • Output Over V oltage Protection
  • Over Current Protection

Applications

  • Post DC-DC Voltage Regulation
  • PDA and Notebook Computer

Figure 1. Package Types of AP3410

Figure 2. Pin Configuration of AP3410 (Top View)

1 NC No internal connection

Figure 3. Functional Block Diagram of AP3410

P r e l i m i n a r y D a t a s h e e t 1.5MHz Synchronous Step-down DC-DC Converter AP3410 Mar. 2013 Rev. 1. 1 BCD Semiconductor Manufacturing Limited

Ordering Information

G1: Green C i r c u i t T y p e Package Temperature Range Part Number Marking ID Packing Type SOT-23-5 -40 to 85ºC AP3410KTR-G1 GHW Tape & Reel DFN-2×2-6 -40 to 85ºC AP3410DNTR-G1 CJ Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green. Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Input Voltage for the MOSFET Switch V IN 0 to 6.0 V Enable Input Voltage V EN -0.3 to V IN+0.3 V LX Pin Switch Current I LX 1.8 A Power Dissipation (on PCB, TA=25°C) P D SOT-23-5 0.4 W DFN-2×2-6 1.89 Thermal Resistance (Junction to Ambient, Simulation) θJA SOT-23-5 250 ºC/W DFN-2×2-6 53 Thermal Resistance (Junction to Case, Simulation) θJC SOT-23-5 130 ºC/W Operating Junction Temperature T J 155 ºC Storage Temperature T STG -55 to 150 ºC Operating Temperature T OP -40 to 85 ºC ESD (Machine Model) V MM 200 V ESD (Human Body Model) V HBM 2000 V Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional op eration of the device at these or any other conditions beyond those indicated under “Recommended Operating Co nditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. TR: Tape & Reel K: SOT-23-5 DN: DFN-2×2-6

P r e l i m i n a r y D a t a s h e e t 1.5MHz Synchronous Step-down DC-DC Converter AP3410 Mar. 2013 Rev. 1. 1 BCD Semiconductor Manufacturing Limited Recommended Operating Conditions Parameter Symbol Min Max Unit Supply Input V oltage V IN 2.5 5.5 V Operating Ambient Temperature T A -40 85 ºC Operating Junction Temperature T J -40 125 ºC

Electrical Characteristics

VIN=VEN=5V , VOUT=1.2V , VFB=0.6V , L=2.2µH, C IN=4.7µF, C OUT=10µF, T A=25°C, unless otherwise specified. Parameters Symbol Condi tions Min Typ Max Unit Input Voltage Range V IN 2.5 5.5 V Shutdown Current I OFF V EN=0 0.1 µA Active Current I ON V FB=0.55V 220 µA Regulated Feedback Voltage VFB 0.588 0.6 0.612 V Regulated Output Voltage Accuracy ∆VOUT/VOUT VIN=2.5V to 5.5V, IOUT=0 to 1.2A -3 3 % Peak Inductor Current IPK 1.5 1.9 A PMOSFET RDS(ON) R DS(ON)P V IN=5V 200 mΩ NMOSFET RDS(ON) R DS(ON)N V IN=5V 200 mΩ EN High Level Input Voltage VEN_H 1.5 V EN Low Level Input V oltage VEN_L 0.4 V EN Input Current I EN 0.1 µA Soft Start Time tSS 400 µs Maximum Duty Cycle D MAX 100 % Under Voltage Lock Out Threshold VUVLO Rising 2.3 V Falling 2.1 Hysteresis 0.2 Thermal Shutdown TSD Hysteresis=30°C 155 160 °C

Figure 12. Typical Applications of AP3410 Table 1. Component Guide

P r e l i m i n a r y D a t a s h e e t 1.5MHz Synchronous Step-down DC-DC Converter AP3410 Mar. 2013 Rev. 1. 1 BCD Semiconductor Manufacturing Limited Mechanical Dimensions SOT-23-5 U n i t : m m ( i n c h ) 2.820(0.111) 0.000(0.000) 0.300(0.012) 0.950(0.037) 0.900(0.035) 0.100(0.004) 0.200(0.008) 3.100(0.122) 0.500(0.020) 0.150(0.006) 1.300(0.051) 0.200(0.008) 1.800(0.071) 2.000(0.079) 0.700(0.028) REF TYP

P r e l i m i n a r y D a t a s h e e t 1.5MHz Synchronous Step-down DC-DC Converter AP3410 Mar. 2013 Rev. 1. 1 BCD Semiconductor Manufacturing Limited Mechanical Dimensions (Continued) DFN-2×2-6 Unit: mm(inch)

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277 IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yishan Road, Shanghai 200233, China

Tel: +021-6485-1491, Fax: +86-021-5450-0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203,Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District Shenzhen 518057, China Tel: +86-0755-8660-4900, Fax: +86-0755-8660-4958 Taiwan Office (Taipei) BCD Semiconductor (Taiwan) Company Limited Tel: +886-2-2656 2808 Fax: +886-2-2656-2806/26562950 Taiwan Office (Hsinchu) BCD Semiconductor (Taiwan) Company Limited 8F, No.176, Sec. 2, Gong-Dao 5th Road, East District HsinChu City 300, Taiwan, R.O.C Tel: +886-3-5160181, Fax: +886-3-5160181 - Headquarters BCD (Shanghai) Micro-electronics Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, P. R.C. Tel: +86-021-2416-2266, Fax: +86-021-2416-2277 USA Office BCD Semiconductor Corp.

48460 Kato Road, Fremont, CA 94538, USA

Tel: +1-510-668-1950 Fax: +1-510-668-1990 Korea Office BCD Semiconductor Limited Korea office. Room 101-1112, Digital-Empire II, 486 Sin-dong, Yeongtong-Gu, Suwon-city, Gyeonggi-do, Korea Tel: +82-31-695-8430