AP3407,A BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Input V oltage Range: 2.5V to 5.5V
  • Output V oltage: 0.6V to VIN
  • ADJ Output
  • Fixed 1.4MHz Frequency
  • High Efficiency up to 95%
  • Output Current: 1.2A
  • Current Mode Control
  • 100% Duty Cycle in Dropout
  • Built-in Over Current Protection
  • Built-in Short Circuit Protection
  • Built-in Thermal Shutdown Protection
  • Built-in UVLO Function
  • Built-in Soft-start

Applications

  • Datacom
  • Portable Device
  • Smart Phone

Figure 1. Package Type of AP3407/A

Figure 2. Pin Configuration of AP3407/A (Top View) the IC. Forcing this pin below 0.4V shuts down the IC. divider is connected to this pin.

Figure 3. Functional Block Diagram of AP3407/A

1.2A, 1.4MHz High Efficiency Synchronous DC-DC Buck Converter AP3407/A Dec. 2011 Rev. 1. 3 BCD Semiconductor Manufacturing Limited

Ordering Information

G1: Green C i r c u i t T y p e B l a n k : A P 3 4 0 7 A: AP3407A Part Number Marking ID Package Temperature Range Green Green Packing Type AP3407KTR-G1 GJA Tape & Reel SOT-23-5 -40 to 85 ºC AP3407AKTR-G1 GJB Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green. Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Input Voltage V IN -0.3 to 6.0 V Feedback Voltage V FB -0.3 to V IN +0.3 V EN Pin Voltage V EN -0.3 to V IN+0.3 V SW Pin Voltage V SW -0.3 to V IN+0.3 V Thermal Resistance θJA 265 ºC/W Thermal Resistance θJC 60 ºC/W Power Dissipation P D 0.377 W Operating Junction Temperature T J 150 ºC Storage Temperature T STG -65 to 150 ºC Lead Temperature (Soldering, 10sec) T LEAD 260 ºC Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Co nditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Note 2: The junction temperature rise is given by T RISING=PD*θJA, where PD is the power dissipated by regulator, θJA is the thermal resistance from junction of the die to the ambient temperature; The junction temperature, TJ is given by TJ=TA+TR, where TA is the ambient temperature. TR: Tape & Reel K: SOT-23-5

1.2A, 1.4MHz High Efficiency Synchronous DC-DC Buck Converter AP3407/A Dec. 2011 Rev. 1. 3 BCD Semiconductor Manufacturing Limited Recommended Operating Conditions Parameter Symbol Min Max Unit Input V oltage V IN 2.5 5.5 V Maximum Output Current I OUT (MAX) 1.2 A Operating Ambient Temperature T A -40 85 ºC

Electrical Characteristics

VIN=VDD =VPVDD=3.3V, TA=25℃, unless otherwise specified. Parameters Symbol Conditions Min Typ Max Unit Input V oltage V IN 2.5 5.5 V Quiescent Current I Q V FB=0.65V 62 100 µA Shutdown Supply Current I STBY V EN=GND 0.1 1 µA Reference V oltage V REF For Adjustable Output V oltage 0.588 0.6 0.612 V Feedback Bias Current I FB V FB=VIN -0.1 0.1 µA Output V oltage Accuracy ∆VOUT -2 2 % PMOSFET RON R DS(ON)_ P I SW = 200mA 0.28 Ω NMOSFET RON R DS(ON) _N I SW = -200mA 0.25 Ω Switch Current Limit I LIM VFB=0.55V 1.5 2.0 A VH 1.5 EN Pin Threshold VL 0.4 V UVLO Threshold V UVLO V DD Rising 2.3 UVLO Hysteresis V HYS 0.2 V Oscillator Frequency f OSC 1.12 1.40 1.68 MHz Max. Duty Cycle D MAX V FB=0V 100 Min. Duty Cycle D MIN V FB=6.5V 0 N-MOS SW Leakage Current V IN=3.3V , VSW=3.3V 0.1 µA Soft-start Time t 1 ms Thermal Shutdown T OTSD 160 ºC Thermal Shutdown Hysteresis THYS 20 ºC

Figure 12. RDS (ON)_LOW vs. Temperature

Figure 13. Typical Application of AP3407/A

1.2A, 1.4MHz High Efficiency Synchronous DC-DC Buck Converter AP3407/A Dec. 2011 Rev. 1. 3 BCD Semiconductor Manufacturing Limited Mechanical Dimensions SOT-23-5 Unit: mm(inch) 2.820(0.111) 0.000(0.000) 0.300(0.012) 0.950(0.037) 0.900(0.035) 0.100(0.004) 0.200(0.008) 3.020(0.119) 0.400(0.016) 0.150(0.006) 1.300(0.051) 0.200(0.008) 1.800(0.071) 2.000(0.079) 0.700(0.028) REF TYP

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277