AP3406A BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • High Efficiency: up to 95%
  • Output Current: 800mA
  • Input Voltage Range: 2.5V to 5.5V
  • Fixed 1.1MHz Frequency
  • Current Mode Control
  • 100% Duty Cycle in Dropout
  • Built-in Short Circuit Protection
  • Built-in Thermal Shutdown Function
  • Built-in Current Limit Function
  • Shutdown Current: <1 µA

Applications

  • GPS
  • WiFi Card
  • Portable Media Player
  • Digital Still and Video Cameras

Figure 1. Package Types of AP3406A

Figure 2. Pin Configuration of AP3406A (Top View) Control input pin. Forcing this pin above 1.5V enables the IC.

10 PGND Power ground pin

1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER AP3406A May 2009 Rev. 1. 2 BCD Semiconductor Manufacturing Limited Functional Block Diagram Figure 3. Functional Block Diagram of AP3406A

Ordering Information

G1: Green C i r c u i t T y p e P a c k a g e K T : T S O T - 2 3 - 5 M M : M S O P - 1 0 Package Temperature Range Part Number Marking ID Packing Type TSOT-23-5 AP3406AKT-ADJTR G1 L2A Tape & Reel MSOP-10 -40 to 85°C AP3406AMM-ADJTRG1 3406AMM-G1 Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green. TR: Tape & Reel ADJ: Adjustable V oltage

1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER AP3406A May 2009 Rev. 1. 2 BCD Semiconductor Manufacturing Limited Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Input Voltage V IN -0.3 to 6 V Feedback Voltage V FB -0.3 to V IN +0.3 V EN Pin Voltage V EN -0.3 to V IN+0.3 V SW Pin Voltage V SW -0.3 to V IN+0.3 V TSOT-23-5 250 Thermal Resistance θJA MSOP-10 135 ºC/W Operating Junction Temperature T J 125 ºC Storage Temperature T STG -65 to 150 ºC Lead Temperature (Soldering, 10sec) T LEAD 260 ºC Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Co nditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Recommended Operating Conditions Parameter Symbol Min Max Unit Input V oltage V IN 2.5 5.5 V Maximum Output Current I OUT (MAX) 800 mA Operating Ambient Temperature T A -40 85 ºC

1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER AP3406A May 2009 Rev. 1. 2 BCD Semiconductor Manufacturing Limited

Electrical Characteristics

VIN =VEN=3.6V, TA=25℃, unless otherwise specified. Specifications with boldface type apply over full operating temperature range from -40 to 85ºC. Parameters Symbol Conditions Min Typ Max Unit Supply Current I CC V FB=0.55V 400 600 µA Shutdown Supply Current I SHDN V EN=0V , VIN=5.5V 0.01 1 µA Under V oltage Lockout Threshold VUVLO Rising edge 2.27 V Under V oltage Lockout Hysteresis VHUVLO 200 mV Feedback Bias Current I FB V FB=0.65V -50 0.5 50 nA Feedback V oltage V FB I OUT=100mA 0.588/ 0.582 0.600 0.612/ 0.618 V VIN=2.5V , VOUT=0.9V 800 VIN=3.6V , VOUT=1.2V 800 Maximum Output Current IOUT (MAX) VIN=4.6V , VOUT=3.3V 800 mA Switch Current Limit I LIM V FB=0.55V 0.95 1.25 A Oscillator Frequency f OSC 0.8 1.1 1.4 MHz VENL 0.6 EN Pin Threshold VENH 1.5 V IH V EN=3.6V -0.1 0.1 µA EN Pin Input Leakage Current IL V EN=0V -0.1 0.1 µA Internal PFET On Resistance RDSONP I SW=100mA 0.44 Ω Internal NFET On Resistance RDSONN I SW=-100mA 0.29 Ω Maximum Duty Cycle D MAX V FB=0.55V 100 % Soft-start Time T SS VEN=0V to VIN IOUT＝50mA 220 µs Thermal Shutdown Threshold TOTSD 160 ºC Thermal Shutdown Hysteresis THYS 30 ºC

1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER AP3406A May 2009 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 0.1 1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 VIN=3.6V VOUT =1.8V L=10 µH Efficiency (%) Output Current (A) TSOT-23-5 MSOP-10 0.1 1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 VIN=4.2V VOUT =3.3V L=10 µH TSOT-23-5 MSOP-10 Efficiency (%) Output Current (A) Typical Performance Characteristics (Continued) 10µs/div 4 0 µs/div F i g u r e 1 2 . S h o r t C i r c u i t P r o t e c t i o n F i g u r e 1 3 . S h o r t C i r c u i t R e c o v e r y IN=3.6V, VOUT=1.8V, no load) (V IN=3.6V, VOUT=1.8V, no load) F i gure 14. Efficiency vs. Output Current Figure 15. Efficiency vs. Output Current VOUT 1V/div VSW 2V/div IL 1A/div VOUT 1V/div VSW 2V/div IL 1A/div

1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER AP3406A May 2009 Rev. 1. 2 BCD Semiconductor Manufacturing Limited Mechanical Dimensions TSOT-23-5 Unit: mm(inch)

1.1MHz, 800mA SYNCHRONOUS DC-DC BUCK CONVERTER AP3406A May 2009 Rev. 1. 2 BCD Semiconductor Manufacturing Limited Mechanical Dimensions (Continued) MSOP-10 Unit: mm(inch)

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen, 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277