AP3211 BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Input V oltage Range: 4.5V to 18V
  • Output V oltage Adjustable from 0.81V to 15V
  • Fixed 1.4MHz Frequency
  • High Efficiency: up to 92%
  • Output Current: 1.5A
  • Current Mode Control
  • Built-in Over Current Protection
  • Built-in Thermal Shutdown Function
  • Built-in UVLO Function
  • Built-in Over V oltage Protection
  • Built-in Soft-start

Applications

  • LCD TV
  • DPF
  • Portable DVD

Figure 1. Package Type of AP3211

Figure 2. Pin Configuration of AP3211 (Top View)

2 GND Ground pin

Control input pin. Forcing this pin above 1.5V enables the IC.

1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER AP3211 Jul. 2011 Rev. 1.3 BCD Semiconductor Manufacturing Limited Functional Block Diagram Figure 3. Functional Block Diagram of AP3211

Ordering Information

C i r c u i t T y p e G 1 : G r e e n P a c k a g e T R : T a p e & R e e l K : S O T - 2 3 - 6 Package Temperature Range Part Number Marking ID Packing Type SOT-23-6 -40 to 85°C AP3211KTR-G1 GCI Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green.

1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER AP3211 Jul. 2011 Rev. 1.3 BCD Semiconductor Manufacturing Limited Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Input Pin Voltage V IN -0.3 to 20 V EN Pin Voltage V EN -0.3 to V IN+0.3 V SW Pin Voltage V SW 21 V Bootstrap Pin Voltage V BS -0.3 to V SW+6 V Feedback Pin Voltage V FB -0.3 to 6V V Thermal Resistance θJA 220 ºC/W Operating Junction Temperature T J 150 ºC Storage Temperature T STG -65 to 150 ºC Lead Temperature (Soldering, 10sec) TLEAD 260 ºC Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Co nditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Recommended Operating Conditions Parameter Symbol Min Max Unit Input V oltage V IN 4.5 18 V Maximum Output Current I OUT (MAX) 1.5 A Operating Ambient Temperature T A -40 85 ºC

1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER AP3211 Jul. 2011 Rev. 1.3 BCD Semiconductor Manufacturing Limited

Electrical Characteristics

VIN=VEN=12V, VOUT=3.3V, TA=25ºC, unless otherwise specified. Parameter Symbol Conditions Min Typ Max Unit Input V oltage V IN 4.5 18 V Quiescent Current I Q V FB=0.9V 0.8 1.1 mA Shutdown Supply Current I SHDN V EN=0V 0.1 1.0 μA Feedback V oltage VFB 0.785 0.810 0.835 V Feedback Over V oltage Threshold V FBOV 0.972 V Feedback Bias Current I FB V FB=0.85V -0.1 0.1 μA Switch On-resistance R DSON I SW=1A 0.35 Ω Switch Leakage Current I LEAK VIN=18V , VEN=0V 0.1 10 μA Switch Current Limit I LIM 1.8 2.4 A VENH 1.5 EN Pin Threshold VENL 0.4 V Input UVLO Threshold V UVLO VIN Rising 3.3 3.8 4.3 V Input UVLO Hysteresis V HYS 0.2 V fOSC1 1.1 1.4 1.7 MHz Oscillator Frequency fOSC2 Short Circuit 460 kHz Max. Duty Cycle D MAX V FB=0.6V 90 % Min. Duty Cycle D MIN V FB=0.9V 0 % Minimum On Time t ON 100 ns Thermal Shutdown T OTSD 160 ºC Thermal Shutdown Hysteresis T HYS 20 ºC Soft-start Time t SS 200 μs Note 2: RDSON , tON, TOTSD, THYS and tSS are guaranteed by design.

TA=25ºC, VIN=12V, VEN=5V，VOUT=3.3V, unless otherwise noted. Figure 16. Over Voltage Protection (IOUT= 1 . 5 A ) Figure 17. Over Voltage Recovery (IOUT=1.5A)

Figure 18. Typical Application Circuit of AP3211

1.4MHz, 1.5A ASYNCHRONOUS DC-DC BUCK CONVERTER AP3211 Jul. 2011 Rev. 1.3 BCD Semiconductor Manufacturing Limited Mechanical Dimensions SOT-23-6 Unit: mm(inch) 2.820(0.111) 3.020(0.119) 0.950(0.037)TYP 1.800(0.071) 2.000(0.079) 0.300(0.012) 0.400(0.016) 0.700(0.028)REF 0.100(0.004) 0.200(0.008) 0.200(0.008) 0.300(0.012) 0.600(0.024) 0.000(0.000) 0.150(0.006) 0.900(0.035) 1.300(0.051) 1.450(0.057) MAX 123 456 Pin 1 Dot by Marking

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277