AP3039 BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Input V oltage Range 6V to 27V
  • 0.6A Peak MOSFET Gate Driver
  • 20ns Quick MOSFET Gate Driver
  • Duty Cycle Limit of 90%
  • Programmable UVLO
  • Programmable Over V oltage Protection
  • Cycle by Cycle Current Limit
  • Adjustable Soft-Start
  • Adjustable Operation Frequency from 400 kHz to

1 MHz

Applications

  • Notebook
  • LCD Display Modules

Figure 1. Package Type of AP3039

1 EN Enable pin

2 VIN Input supply pin, mu st be locally bypassed

6V linear regulator output pin. VCC is used to bias the gate driver for the external MOSFET.

6 PGND Power ground

7 RT An external resistor connected from this pin to GND to set the operating frequency

8 CS Sense switch current pin, which is used for current mode control and for current limit

9 AGND Reference ground

10 SHDN This pin can be connected to current matched chip and receives error signal used to shut down

Figure 2. Pin Configuration of AP3039 (Top View)

14 SS An external soft start time ca pacitor is connected from this pin to ground and is charged by

15 UVLO Two resistors connected from this pin to ground and the VIN pin respectively to set start up

16 OV Over output voltage protection pin

Figure 3. Functional Block Diagram of AP3039

BCD Semiconductor Manufacturing LimitedMay 2008 Rev. 1. 0 Package Temperature Range Part Number Marking ID Packing Type QFN-3x3-16 -40 to 85oC AP3039FNTR-G1 B2A Tape & Reel BCD Semiconductor's products, as designated with "G1" suffix in the part number, are RoHS compliant and Green. Circuit Type Package FN: QFN-3x3-16 G1: Green AP3039 -

Ordering Information

TR: Tape and Reel

BCD Semiconductor Manufacturing LimitedMay 2008 Rev. 1. 0 Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Max- imum Ratings" for extended periods may affect device reliability. Parameter Symbol Min Max Unit Input V oltage VIN 62 7V Operating Frequency f 400 1000 kHz Operating Temperature T A -40 85 oC Recommended Operating Conditions Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Input V oltage V IN 30 V VCC Pin V oltage V CC 10 V OUT Pin V oltage V OUT 10 V Feedback Pin V oltage V FB 7V UVLO Pin V oltage V UVLO 7V CS Pin V oltage V CS 7V SHDN Pin V oltage V SHDN 7V Enable Pin V oltage V EN VIN V OV Pin V oltage V OV 7V Thermal Resistance (Junction to Ambient, no Heat sink) R θJA 60 oC/W Operating Junction Temperature T J 150 oC Storage Temperature Range T STG -65 to 150 oC Lead Temperature (Soldering, 10sec) T LEAD 260 oC ESD (Machine Model) 200 V ESD (Human Body Model) 2000 V

BCD Semiconductor Manufacturing LimitedMay 2008 Rev. 1. 0 Parameter Symbol Conditions Min Typ Max Unit Input V oltage V IN 62 7 V Feedback V oltage VFB 470 500 530 mV FB Pin Bias Current I FB 35 100 nA Supply Current I CC Not Switching 3 5 mA Shutdown Supply Current I Q VEN=0V 1 2 μA VCC V oltage VCC 9V≤VIN≤27V 5.5 6 6.5 V 6V≤VIN<9V 5 VCC Current Limit I CC-LIM 50 mA Drop V oltage Across Bypass Switch VIN-VCC ICC=0mA, fOSC≤400kHz, 6V≤VIN <8.5V 300 mV Bypass Switch Turn-off Threshold VBYP-HI VIN increasing 8.7 V Bypass Switch Threshold Hysteresis VBYP-HYS VIN decreasing 260 mV VCC Pin UVLO Rising Threshold VCC-HI 4.7 V VCC Pin UVLO Falling Hysteresis VCC-HYS 300 mV Oscillator Frequency fOSC Adjustable, RT=51kΩ to 150kΩ 400 1000 kHz UVLO Threshold V UVLO 1.22 1.25 1.28 V UVLO Hysteresis Current Source I HYS 22 μA Current Limit Threshold V oltage V CS 90 110 130 mV RT V oltage V RT 1.20 1.25 1.30 V Error Amplifier Transconductance G S 470 μA/V EN Pin Threshold V oltage VEH 2.0 V VEL 0.5 SHDN Pin Threshold V oltage VIH 2.0 V VIL 0.5

Electrical Characteristics

(VIN=12V , VEN =VIN, TA=25oC, unless otherwise specified.)

BCD Semiconductor Manufacturing LimitedMay 2008 Rev. 1. 0 Parameter Symbol Conditions Min Typ Max Unit OV Threshold V OV 1.25 V OV Hysteresis Current Source I OV-HYS 22 μA Maximum Duty Cycle D MAX 90 93 % Soft Start Current Source I SS 12 μA Out Pin Rise Time t RISE Out Pin Load =1nF 20 ns Out Pin Fall Time t FALL Out Pin Load =1nF 20 ns OUT Dropout V oltage (VCC-VOUT)V OUT-H IOUT=50mA 0.25 0.75 V OUT Low V oltage Level (VOUT)V OUT-L IOUT=100mA 0.25 0.75 V Thermal Shutdown Temperature TOTSD 160 oC Thermal Shutdown Hysteresis THYS 20 oC Electrical Characteristics (Continued) (VIN=12V , VEN =VIN, TA=25oC, unless otherwise specified.)

BCD Semiconductor Manufacturing LimitedMay 2008 Rev. 1. 0

Application Information

AP3039 is a boost DC-DC co ntroller with adjustable operation frequency. Current mode control scheme provides excellent line and lo ad regulation. Operation can be best understood by referring to Figure 3. At the start of each oscillator cycle, the SR latch is set and external power switch Q1 (see Figure 4) turns on and the switch current will increase linearly. The voltage on external sense resistor R CS (see Figure4), connected from CS pin to GND, is proportional to the switch current. This voltage is added to a stabilizing ramp and the result is fed into the non-inversion input of the PWM comparator. When this non-inversion input voltage exceeds inversion input voltage of PWM comparator which is the ou tput voltage of the error amplifier EA, the SR latch is reset and the external power switch turns off. The voltage level at inversion input of PWM comparator sets the peak current level to keep the output voltage in regulation. This voltage level is the amplified signal of the voltage difference between feedback voltage and reference voltage of 0.5V . So, a constant output current can be provided by this operation mode. Input Under-Voltage Detector AP3039 contains an Under V oltage Lock Out (UVLO) circuit. Two resistors R1 and R2 are connected from UVLO pin to ground and VIN pin respectively (see Figure 4). The resistor divider must be designed such that the voltage on the UVLO pin is higher than 1.25V when VIN is in the desired operating range. If the voltage on the pin is below under voltage threshold, all functions of AP3039 are disabled, but the system will remain in a low power stan dby state. UVLO hysteresis is accomplished thr ough an internal 22 μA current source which switched on or off 22 μA current into the impedance of the set-point divider. When the UVLO threshold is exceeded, the current source is activated to instantly raise the voltage on the UVLO pin. When the UVLO pin voltage falls below the threshold the current source is turned off, causing the voltage on the UVLO pin to fall. The formula for UVLO can be expresses as blow: For Input Threshold V oltage V IN_THRESHOLD=1.25V*(R1+R2)/R2 For Input Hysteresis V oltage V IN-HYSTERESIS=22μA*R1 Over Voltage Protection AP3039 has an over voltage protection (OVP) circuit. The OV Pin is connected to the center tap of R3 and R4 resistor voltage-divider from the high voltage output to GND. (see Figure 21). When th e loop is open or the output voltage becomes excessive in any case, result the voltage on OV pin exceed s 1.25V , all functions of AP3039 will be disabled, and the output voltage will fall. OVP hysteresis is acco mplished with an internal 22μA current source and the operation mode is the same as UVLO. The formula for OVP can be expresses as blow: For OVP V oltage V OVP=1.25V*(R3+R4)/R4 For OVP Hysteresis V oltage V OVP-HYSTERESIS=22μA*R3 Frequency Selection An external resistor R T, connected from RT pin to GND, is used to set the operating frequency (see Figure 4). Operation frequency range is from 400kHz to 1MHz (see Table 1). High frequency operation optimizes the regulator for the smallest component size, while low frequency operation can reduce the switch losses. Table 1. Frequency Selection

Figure 21. AP3039 Application Circuit

BCD Semiconductor Manufacturing LimitedMay 2008 Rev. 1. 0 QFN-3x3-16 0.700(0.028) 0.900(0.035) 0.000(0.000) 0.050(0.002) 0.178(0.007) 0.228(0.009) 0.180(0.007) 0.280(0.011) 0.550(0.022) 0.450(0.018) 1.500(0.059) Ref 1.500(0.059) Ref 0.450(0.018) 0.350(0.014) Bottom View Exposed Pad Pin 1 Identification Pin 1 Identification3.100(0.122) 2.900(0.114) 3.100(0.122) 2.900(0.114) Pin1 Mechanical Dimensions Unit: mm(inch)

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen, 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277