AP3032 BCDSEMI | Alldatasheet
Document overview
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Technical content
Features
- Efficiency Up to 81%(VIN=5V, IOUT=80mA)
- Drives up to 4 Rows of WLEDs with 7 Series for Each in Parallel (VIN=5V)
- Fast 1 MHz Switching Frequency
- Wide Input V oltage Range: 2.7V to 9V
- Low Feedback V oltage: 200mV
- Output Over V oltage Protection
- Cycle-by-cycle Current Limit: 1.4A
- Built in Soft-start
- Built in Standby-mode to Achieve High
- Frequency PWM Dimming
- Built in Thermal Shutdown Function
- Under V oltage Lockout
Applications
- 7’ to 10’ LCD Panels
- Digital Photo Frame
- GPS Receiver
Figure 1. Package Type of AP3032
Figure 2. Pin Configuration of AP3032 (Top View)
2 GND Ground
4 CTRL
WHITE LED STEP-UP CONVERTER AP3032 Dec. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited Functional Block Diagram A2A1 CONTROL LOGIC 1.2MHz OSCILLATOR RAMP GENERATOR VREF DRIVER 1.25V COMPARATOR OVP 200mV SOFT START FB SW OV GND CTRL VIN STAND BY OVER TEMPERATURE DETECTOR Figure 3. Functional Block Diagram of AP3032
Ordering Information
T R : T a p e & R e e l P a c k a g e K : S O T - 2 3 - 6 Package Temperature Range Part Number Marking ID Packing Type SOT-23-6 -40 to 85°C AP3032KTR-G1 GJL Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green. G1: Green
WHITE LED STEP-UP CONVERTER AP3032 Dec. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Input Voltage V IN 20 V SW Pin Voltage V SW 38 V FB Pin Voltage V FB 20 V OV Voltage V OV 35 V CTRL Pin Voltage V CTRL 20 V Thermal Resistance (Junction to Ambient, No Heat Sink) θJA 265 °C/W Operating Junction Temperature T J 150 °C Storage Temperature Range T STG -65 to 150 °C Lead Temperature (Soldering, 10sec) T LEAD 260 °C ESD (Machine Model) 200 V ESD (Human Body Model) 2000 V Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional op eration of the device at these or any other conditions beyond those indicated under “Recommended Operating Co nditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Recommended Operating Conditions Parameter Symbol Min Max Unit Operating Temperature Range T OP -40 85 °C Input V oltage V IN 2.7 9 V CTRL Pin V oltage V CTRL 9 V
WHITE LED STEP-UP CONVERTER AP3032 Dec. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited
Electrical Characteristics
VIN=VCTRL=5.0V , unless otherwise specified. Specification with standard typeface are for TA= 25°C, and those in boldface type apply over the full operating temperature rang (TA=-40°C to 85°C). Parameters Symbol Conditions Min Typ Max Unit SUPPLY VOLTAGE (VIN PIN) Input Voltage V IN 2.7 9 V Quiescent Current I Q VFB=VIN, Not Switching 3.0 4.0 5.0 mA Shutdown Supply Current I SHDN V CTRL=0V 50 μA ENABLE (EN PIN) CTRL Pin Voltage V CTRL 1.2 V CTRL Pin Bias Current I CTRL 60 μA OUTPUT VOLTAGE OVP Voltage V OVP 27 V VOLTAGE REFERENCE (FB PIN) Feedback Voltage V FB 188 200 212 mV Feedback Bias Current I FB 35 100 μA SWITCHING REGULATOR Switching Frequency f 0.75 1 1.3 MHz Maximum Duty Cycle D MAX 90 93 % Switch Current Limit I LIMIT D=60% 1.2 1.4 A Switch VCE Saturation Voltage V CE_SAT I SW=1A 300 mV Switch Leakage Current V SW=9V 0.01 5 μA THERMAL SHUTDOWN Thermal Shutdown T OTSD 160 ºC Thermal Shutdown Hysteresis T HYS 20 ºC SOFT START Soft-start Time t SS 300 μs Standby Time t STANDBY 0.7 ms
and luminous intensity is also useful.
5.1 Adding a Control Signal to CTRL Pin
please refer to Figure 17 and Figure 18. Figure 17. Dimming Control Figure 18. High Frequency
5.2 Changing the Effective Feedback Voltage
DC voltage can get appropriate luminous intensity. current. Please refer to Figure 19. Figure 19. Dimming Control and adjustable DC voltage. Please refer to Figure 20. Figure 20. Dimming Control
Figure 21. Typical Application of AP3032 (7S4P)
WHITE LED STEP-UP CONVERTER AP3032 Dec. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited Mechanical Dimensions SOT-23-6 Unit: mm(inch) 2.820(0.111) 3.020(0.119) 2.650(0.104) 2.950(0.116) 1.500(0.059) 1.700(0.067) 0.950(0.037)TYP 1.800(0.071) 2.000(0.079) 0.300(0.012) 0.400(0.016) 0.700(0.028)REF 0.100(0.004) 0.200(0.008) 0.200(0.008) 0.300(0.012) 0.600(0.024) 0.000(0.000) 0.150(0.006) 0.900(0.035) 1.300(0.051) 1.450(0.057) MAX 123 456 Pin 1 Mark
BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.
800 Yi Shan Road, Shanghai 200233, China
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277